End user's guide to innovative flexible circuit packaging:
Gespeichert in:
1. Verfasser: | |
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Format: | Buch |
Sprache: | English |
Veröffentlicht: |
New York u.a.
Dekker
1986
|
Schriftenreihe: | Electrical engineering and electronics.
33. |
Schlagworte: | |
Beschreibung: | IX, 153 S. graph. Darst. |
ISBN: | 0824775848 |
Internformat
MARC
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035 | |a (DE-599)BVBBV002055502 | ||
040 | |a DE-604 |b ger |e rakddb | ||
041 | 0 | |a eng | |
049 | |a DE-91 |a DE-83 | ||
050 | 0 | |a TK7868.P7 | |
082 | 0 | |a 621.381/74 |2 19 | |
084 | |a ELT 296f |2 stub | ||
100 | 1 | |a Miniet, Jay J. |e Verfasser |4 aut | |
245 | 1 | 0 | |a End user's guide to innovative flexible circuit packaging |
264 | 1 | |a New York u.a. |b Dekker |c 1986 | |
300 | |a IX, 153 S. |b graph. Darst. | ||
336 | |b txt |2 rdacontent | ||
337 | |b n |2 rdamedia | ||
338 | |b nc |2 rdacarrier | ||
490 | 1 | |a Electrical engineering and electronics. |v 33. | |
650 | 4 | |a Flexible printed circuits | |
650 | 0 | 7 | |a Verkapseln |0 (DE-588)4139497-5 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Halbleiterbauelement |0 (DE-588)4113826-0 |2 gnd |9 rswk-swf |
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689 | 0 | 1 | |a Verkapseln |0 (DE-588)4139497-5 |D s |
689 | 0 | |5 DE-604 | |
830 | 0 | |a Electrical engineering and electronics. |v 33. |w (DE-604)BV001899533 |9 33. | |
999 | |a oai:aleph.bib-bvb.de:BVB01-001344213 |
Datensatz im Suchindex
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any_adam_object | |
author | Miniet, Jay J. |
author_facet | Miniet, Jay J. |
author_role | aut |
author_sort | Miniet, Jay J. |
author_variant | j j m jj jjm |
building | Verbundindex |
bvnumber | BV002055502 |
callnumber-first | T - Technology |
callnumber-label | TK7868 |
callnumber-raw | TK7868.P7 |
callnumber-search | TK7868.P7 |
callnumber-sort | TK 47868 P7 |
callnumber-subject | TK - Electrical and Nuclear Engineering |
classification_tum | ELT 296f |
ctrlnum | (OCoLC)13666202 (DE-599)BVBBV002055502 |
dewey-full | 621.381/74 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 621 - Applied physics |
dewey-raw | 621.381/74 |
dewey-search | 621.381/74 |
dewey-sort | 3621.381 274 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik |
format | Book |
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id | DE-604.BV002055502 |
illustrated | Illustrated |
indexdate | 2024-07-09T15:39:35Z |
institution | BVB |
isbn | 0824775848 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-001344213 |
oclc_num | 13666202 |
open_access_boolean | |
owner | DE-91 DE-BY-TUM DE-83 |
owner_facet | DE-91 DE-BY-TUM DE-83 |
physical | IX, 153 S. graph. Darst. |
publishDate | 1986 |
publishDateSearch | 1986 |
publishDateSort | 1986 |
publisher | Dekker |
record_format | marc |
series | Electrical engineering and electronics. |
series2 | Electrical engineering and electronics. |
spelling | Miniet, Jay J. Verfasser aut End user's guide to innovative flexible circuit packaging New York u.a. Dekker 1986 IX, 153 S. graph. Darst. txt rdacontent n rdamedia nc rdacarrier Electrical engineering and electronics. 33. Flexible printed circuits Verkapseln (DE-588)4139497-5 gnd rswk-swf Halbleiterbauelement (DE-588)4113826-0 gnd rswk-swf Halbleiterbauelement (DE-588)4113826-0 s Verkapseln (DE-588)4139497-5 s DE-604 Electrical engineering and electronics. 33. (DE-604)BV001899533 33. |
spellingShingle | Miniet, Jay J. End user's guide to innovative flexible circuit packaging Electrical engineering and electronics. Flexible printed circuits Verkapseln (DE-588)4139497-5 gnd Halbleiterbauelement (DE-588)4113826-0 gnd |
subject_GND | (DE-588)4139497-5 (DE-588)4113826-0 |
title | End user's guide to innovative flexible circuit packaging |
title_auth | End user's guide to innovative flexible circuit packaging |
title_exact_search | End user's guide to innovative flexible circuit packaging |
title_full | End user's guide to innovative flexible circuit packaging |
title_fullStr | End user's guide to innovative flexible circuit packaging |
title_full_unstemmed | End user's guide to innovative flexible circuit packaging |
title_short | End user's guide to innovative flexible circuit packaging |
title_sort | end user s guide to innovative flexible circuit packaging |
topic | Flexible printed circuits Verkapseln (DE-588)4139497-5 gnd Halbleiterbauelement (DE-588)4113826-0 gnd |
topic_facet | Flexible printed circuits Verkapseln Halbleiterbauelement |
volume_link | (DE-604)BV001899533 |
work_keys_str_mv | AT minietjayj endusersguidetoinnovativeflexiblecircuitpackaging |