Thick film technology and chip joining:
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
New York
Gordon and Breach
1972
|
| Schriftenreihe: | Processes and materials in electronics.
1. |
| Schlagworte: | |
| Beschreibung: | 221 S. |
Internformat
MARC
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Datensatz im Suchindex
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|---|---|
| any_adam_object | |
| author | Miller, Lewis F. |
| author_facet | Miller, Lewis F. |
| author_role | aut |
| author_sort | Miller, Lewis F. |
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| building | Verbundindex |
| bvnumber | BV001970174 |
| callnumber-first | T - Technology |
| callnumber-label | TK7874 |
| callnumber-raw | TK7874 |
| callnumber-search | TK7874 |
| callnumber-sort | TK 47874 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_rvk | UP 7500 |
| ctrlnum | (OCoLC)447124 (DE-599)BVBBV001970174 |
| dewey-full | 621.381/73 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/73 |
| dewey-search | 621.381/73 |
| dewey-sort | 3621.381 273 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Physik Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV001970174 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-09T15:38:07Z |
| institution | BVB |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-001284894 |
| oclc_num | 447124 |
| open_access_boolean | |
| owner | DE-91 DE-BY-TUM DE-355 DE-BY-UBR DE-634 DE-83 |
| owner_facet | DE-91 DE-BY-TUM DE-355 DE-BY-UBR DE-634 DE-83 |
| physical | 221 S. |
| psigel | TUB-nveb |
| publishDate | 1972 |
| publishDateSearch | 1972 |
| publishDateSort | 1972 |
| publisher | Gordon and Breach |
| record_format | marc |
| series | Processes and materials in electronics. |
| series2 | Processes and materials in electronics. |
| spelling | Miller, Lewis F. Verfasser aut Thick film technology and chip joining New York Gordon and Breach 1972 221 S. txt rdacontent n rdamedia nc rdacarrier Processes and materials in electronics. 1. Microelectronics Thick films Dickschichttechnik (DE-588)4012133-1 gnd rswk-swf Dickschichttechnik (DE-588)4012133-1 s DE-604 Processes and materials in electronics. 1. (DE-604)BV001891655 1. |
| spellingShingle | Miller, Lewis F. Thick film technology and chip joining Processes and materials in electronics. Microelectronics Thick films Dickschichttechnik (DE-588)4012133-1 gnd |
| subject_GND | (DE-588)4012133-1 |
| title | Thick film technology and chip joining |
| title_auth | Thick film technology and chip joining |
| title_exact_search | Thick film technology and chip joining |
| title_full | Thick film technology and chip joining |
| title_fullStr | Thick film technology and chip joining |
| title_full_unstemmed | Thick film technology and chip joining |
| title_short | Thick film technology and chip joining |
| title_sort | thick film technology and chip joining |
| topic | Microelectronics Thick films Dickschichttechnik (DE-588)4012133-1 gnd |
| topic_facet | Microelectronics Thick films Dickschichttechnik |
| volume_link | (DE-604)BV001891655 |
| work_keys_str_mv | AT millerlewisf thickfilmtechnologyandchipjoining |