11th international congress molded interconnect devices :: scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany /
Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping, Chapter 2: Printing Technologies, Chapter 3: Mat...
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|---|---|
| Other Authors: | |
| Format: | Electronic Conference Proceeding eBook |
| Language: | English |
| Published: |
Pfaffikon, Switzerland :
TTP,
2014.
|
| Series: | Advanced materials research ;
v. 1038. |
| Subjects: | |
| Online Access: | DE-862 DE-863 |
| Summary: | Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping, Chapter 2: Printing Technologies, Chapter 3: Materials and Manufacturing, Chapter 4: Manufacturing Processes, Chapter 5: Assembly Technologies and Inspection, Chapter 6: Quality and Reliability. Keyword: Printing Technologies, Materiala Manufacturing, Manufatruting processes, Inspection, assemply technologies, quality testing The 16 papers collected here are from the 11th International Congress Molded Interconnect Devices (MID 2014), held in September 2014 in Nuremberg/Fuerth, Germany. Technology specialists from Europe, the US, and Taiwan address development and prototyping, printing technologies, materials and manufacturing, manufacturing processes, assembly technologies and inspection, and quality and reliability. -- Electronic components and devices-- Electronic engineering-- Materials science. |
| Physical Description: | 1 online resource (119 pages) : illustrations |
| Bibliography: | Includes bibliographical references at the end of each chapters and index. |
| ISBN: | 9783038266365 3038266361 |
| ISSN: | 1662-8985 ; 1662-8985 |
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| 504 | |a Includes bibliographical references at the end of each chapters and index. | ||
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| 520 | |a Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping, Chapter 2: Printing Technologies, Chapter 3: Materials and Manufacturing, Chapter 4: Manufacturing Processes, Chapter 5: Assembly Technologies and Inspection, Chapter 6: Quality and Reliability. Keyword: Printing Technologies, Materiala Manufacturing, Manufatruting processes, Inspection, assemply technologies, quality testing The 16 papers collected here are from the 11th International Congress Molded Interconnect Devices (MID 2014), held in September 2014 in Nuremberg/Fuerth, Germany. Technology specialists from Europe, the US, and Taiwan address development and prototyping, printing technologies, materials and manufacturing, manufacturing processes, assembly technologies and inspection, and quality and reliability. -- Electronic components and devices-- Electronic engineering-- Materials science. | ||
| 505 | 0 | |a 11th International Congress Molded Interconnect Devices -- Scientific Proceedings; Preface and Committees; Table of Contents; Chapter 1: Development and Prototyping; Method for the Identification and Comparison of Alternative Process Chains Focusing on Economics Efficiency Analysis during the Conceptual Design of Mechatronic Integrated Devices; Novel Approach for the Implementation of 3D-MID Compatible Routing Functionalities into Computer-Aided Design Tools; Optimized Process Sequences for Prototyping of Molded Interconnect Devices; Integration of Functional Circuits into FDM Parts | |
| 505 | 8 | |a Chapter 2: Printing TechnologiesPrinting of Functional Structures on Molded 3D Devices; Electrical Functionalization of Thermoplastics by Combining Plasmadust Coating and Aerosol Jet Printing; Production of Miniaturized Sensor Structures on Polymer Substrates Using Inkjet Printing; Progress in the Manufacturing of Molded Interconnected Devices by 3D Microcontact Printing; Chapter 3: Materials and Manufacturing; Characterization of Electromagnetic Properties of MID Materials for High Frequency Applications up to 67 GHz | |
| 505 | 8 | |a Novel Laser Induced Metallization for Three Dimensional Molded Interconnect Device Applications by Spray MethodExperimental Investigation of Laser Sintering of Conductive Adhesive for Functional Prototypes Produced by Embedding Stereolithography; MID Fabricated by Ultrasonic Processing; Usage of Industrial Robots as Flexible Handling Devices Supporting the Process of Three Dimensional Conductive Pattern Generation; Chapter 4: Manufacturing Processes; Study of MID Technologies for Automotive Lighting and Light Signaling Devices; Chapter 5: Assembly Technologies and Inspection | |
| 505 | 8 | |a Design and Solder Process Optimization in MID Technology for High Power ApplicationsChapter 6: Quality and Reliability; Hot Pin Pull Method -- New Test Procedure for the Adhesion Measurement for 3D-MID; Keywords Index; Authors Index | |
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| 776 | 0 | 8 | |i Print version: |a International Congress Molded Interconnect Devices (11th : 2014 : Nuremberg / Fuerth, Germany). |t 11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. |d Pfaffikon, Switzerland : TTP, ©2014 |h 124 pages |k Advanced materials research ; Volume 1038 |x 1662-8985 |z 9783038352525 |
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| author_corporate | International Congress Molded Interconnect Devices Nuremberg, Germany, and Fuerth, Germany |
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| contents | 11th International Congress Molded Interconnect Devices -- Scientific Proceedings; Preface and Committees; Table of Contents; Chapter 1: Development and Prototyping; Method for the Identification and Comparison of Alternative Process Chains Focusing on Economics Efficiency Analysis during the Conceptual Design of Mechatronic Integrated Devices; Novel Approach for the Implementation of 3D-MID Compatible Routing Functionalities into Computer-Aided Design Tools; Optimized Process Sequences for Prototyping of Molded Interconnect Devices; Integration of Functional Circuits into FDM Parts Chapter 2: Printing TechnologiesPrinting of Functional Structures on Molded 3D Devices; Electrical Functionalization of Thermoplastics by Combining Plasmadust Coating and Aerosol Jet Printing; Production of Miniaturized Sensor Structures on Polymer Substrates Using Inkjet Printing; Progress in the Manufacturing of Molded Interconnected Devices by 3D Microcontact Printing; Chapter 3: Materials and Manufacturing; Characterization of Electromagnetic Properties of MID Materials for High Frequency Applications up to 67 GHz Novel Laser Induced Metallization for Three Dimensional Molded Interconnect Device Applications by Spray MethodExperimental Investigation of Laser Sintering of Conductive Adhesive for Functional Prototypes Produced by Embedding Stereolithography; MID Fabricated by Ultrasonic Processing; Usage of Industrial Robots as Flexible Handling Devices Supporting the Process of Three Dimensional Conductive Pattern Generation; Chapter 4: Manufacturing Processes; Study of MID Technologies for Automotive Lighting and Light Signaling Devices; Chapter 5: Assembly Technologies and Inspection Design and Solder Process Optimization in MID Technology for High Power ApplicationsChapter 6: Quality and Reliability; Hot Pin Pull Method -- New Test Procedure for the Adhesion Measurement for 3D-MID; Keywords Index; Authors Index |
| ctrlnum | (OCoLC)893677821 |
| dewey-full | 621.367 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.367 |
| dewey-search | 621.367 |
| dewey-sort | 3621.367 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic Conference Proceeding eBook |
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| genre | Conference papers and proceedings fast |
| genre_facet | Conference papers and proceedings |
| id | ZDB-4-EBA-ocn893677821 |
| illustrated | Illustrated |
| indexdate | 2025-04-11T08:42:17Z |
| institution | BVB |
| isbn | 9783038266365 3038266361 |
| issn | 1662-8985 ; 1662-8985 |
| language | English |
| oclc_num | 893677821 |
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| physical | 1 online resource (119 pages) : illustrations |
| psigel | ZDB-4-EBA FWS_PDA_EBA ZDB-4-EBA |
| publishDate | 2014 |
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| publisher | TTP, |
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| series | Advanced materials research ; |
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| spelling | International Congress Molded Interconnect Devices (11th : 2014 : Nuremberg, Germany, and Fuerth, Germany) 11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / edited by Jörg Franke [and three others]. Pfaffikon, Switzerland : TTP, 2014. Enfield, New Hampshire : Trans Tech Publications Ltd, [date of distribution not identified] ©2014 1 online resource (119 pages) : illustrations text txt rdacontent computer c rdamedia online resource cr rdacarrier data file Advanced Materials Research, 1662-8985 ; Volume 1038 Includes bibliographical references at the end of each chapters and index. Online resource; title from PDF title page (ebrary, viewed October 16, 2014). Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping, Chapter 2: Printing Technologies, Chapter 3: Materials and Manufacturing, Chapter 4: Manufacturing Processes, Chapter 5: Assembly Technologies and Inspection, Chapter 6: Quality and Reliability. Keyword: Printing Technologies, Materiala Manufacturing, Manufatruting processes, Inspection, assemply technologies, quality testing The 16 papers collected here are from the 11th International Congress Molded Interconnect Devices (MID 2014), held in September 2014 in Nuremberg/Fuerth, Germany. Technology specialists from Europe, the US, and Taiwan address development and prototyping, printing technologies, materials and manufacturing, manufacturing processes, assembly technologies and inspection, and quality and reliability. -- Electronic components and devices-- Electronic engineering-- Materials science. 11th International Congress Molded Interconnect Devices -- Scientific Proceedings; Preface and Committees; Table of Contents; Chapter 1: Development and Prototyping; Method for the Identification and Comparison of Alternative Process Chains Focusing on Economics Efficiency Analysis during the Conceptual Design of Mechatronic Integrated Devices; Novel Approach for the Implementation of 3D-MID Compatible Routing Functionalities into Computer-Aided Design Tools; Optimized Process Sequences for Prototyping of Molded Interconnect Devices; Integration of Functional Circuits into FDM Parts Chapter 2: Printing TechnologiesPrinting of Functional Structures on Molded 3D Devices; Electrical Functionalization of Thermoplastics by Combining Plasmadust Coating and Aerosol Jet Printing; Production of Miniaturized Sensor Structures on Polymer Substrates Using Inkjet Printing; Progress in the Manufacturing of Molded Interconnected Devices by 3D Microcontact Printing; Chapter 3: Materials and Manufacturing; Characterization of Electromagnetic Properties of MID Materials for High Frequency Applications up to 67 GHz Novel Laser Induced Metallization for Three Dimensional Molded Interconnect Device Applications by Spray MethodExperimental Investigation of Laser Sintering of Conductive Adhesive for Functional Prototypes Produced by Embedding Stereolithography; MID Fabricated by Ultrasonic Processing; Usage of Industrial Robots as Flexible Handling Devices Supporting the Process of Three Dimensional Conductive Pattern Generation; Chapter 4: Manufacturing Processes; Study of MID Technologies for Automotive Lighting and Light Signaling Devices; Chapter 5: Assembly Technologies and Inspection Design and Solder Process Optimization in MID Technology for High Power ApplicationsChapter 6: Quality and Reliability; Hot Pin Pull Method -- New Test Procedure for the Adhesion Measurement for 3D-MID; Keywords Index; Authors Index English. Molded interconnect devices. http://id.loc.gov/authorities/subjects/sh2002010330 Three-dimensional display systems Congresses. Affichage tridimensionnel Congrès. TECHNOLOGY & ENGINEERING Mechanical. bisacsh Molded interconnect devices fast Three-dimensional display systems fast Conference papers and proceedings fast Franke, Jörg (Prof. Dr.-Ing.), editor. https://id.oclc.org/worldcat/entity/E39PCjqRkBvDMTFHbmFd6dtwcq http://id.loc.gov/authorities/names/n2016001870 has work: 11th international congress molded interconnect devices (Text) https://id.oclc.org/worldcat/entity/E39PCFDGqt7Tg7gJC3XyDgMWym https://id.oclc.org/worldcat/ontology/hasWork Print version: International Congress Molded Interconnect Devices (11th : 2014 : Nuremberg / Fuerth, Germany). 11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. Pfaffikon, Switzerland : TTP, ©2014 124 pages Advanced materials research ; Volume 1038 1662-8985 9783038352525 Advanced materials research ; v. 1038. http://id.loc.gov/authorities/names/n99255722 |
| spellingShingle | 11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / Advanced materials research ; 11th International Congress Molded Interconnect Devices -- Scientific Proceedings; Preface and Committees; Table of Contents; Chapter 1: Development and Prototyping; Method for the Identification and Comparison of Alternative Process Chains Focusing on Economics Efficiency Analysis during the Conceptual Design of Mechatronic Integrated Devices; Novel Approach for the Implementation of 3D-MID Compatible Routing Functionalities into Computer-Aided Design Tools; Optimized Process Sequences for Prototyping of Molded Interconnect Devices; Integration of Functional Circuits into FDM Parts Chapter 2: Printing TechnologiesPrinting of Functional Structures on Molded 3D Devices; Electrical Functionalization of Thermoplastics by Combining Plasmadust Coating and Aerosol Jet Printing; Production of Miniaturized Sensor Structures on Polymer Substrates Using Inkjet Printing; Progress in the Manufacturing of Molded Interconnected Devices by 3D Microcontact Printing; Chapter 3: Materials and Manufacturing; Characterization of Electromagnetic Properties of MID Materials for High Frequency Applications up to 67 GHz Novel Laser Induced Metallization for Three Dimensional Molded Interconnect Device Applications by Spray MethodExperimental Investigation of Laser Sintering of Conductive Adhesive for Functional Prototypes Produced by Embedding Stereolithography; MID Fabricated by Ultrasonic Processing; Usage of Industrial Robots as Flexible Handling Devices Supporting the Process of Three Dimensional Conductive Pattern Generation; Chapter 4: Manufacturing Processes; Study of MID Technologies for Automotive Lighting and Light Signaling Devices; Chapter 5: Assembly Technologies and Inspection Design and Solder Process Optimization in MID Technology for High Power ApplicationsChapter 6: Quality and Reliability; Hot Pin Pull Method -- New Test Procedure for the Adhesion Measurement for 3D-MID; Keywords Index; Authors Index Molded interconnect devices. http://id.loc.gov/authorities/subjects/sh2002010330 Three-dimensional display systems Congresses. Affichage tridimensionnel Congrès. TECHNOLOGY & ENGINEERING Mechanical. bisacsh Molded interconnect devices fast Three-dimensional display systems fast |
| subject_GND | http://id.loc.gov/authorities/subjects/sh2002010330 |
| title | 11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / |
| title_auth | 11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / |
| title_exact_search | 11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / |
| title_full | 11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / edited by Jörg Franke [and three others]. |
| title_fullStr | 11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / edited by Jörg Franke [and three others]. |
| title_full_unstemmed | 11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / edited by Jörg Franke [and three others]. |
| title_short | 11th international congress molded interconnect devices : |
| title_sort | 11th international congress molded interconnect devices scientific proceedings selected peer reviewed papers from the 11th international congress molded interconnect devices mid 2014 september 24 25 2014 nuremberg fuerth germany |
| title_sub | scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / |
| topic | Molded interconnect devices. http://id.loc.gov/authorities/subjects/sh2002010330 Three-dimensional display systems Congresses. Affichage tridimensionnel Congrès. TECHNOLOGY & ENGINEERING Mechanical. bisacsh Molded interconnect devices fast Three-dimensional display systems fast |
| topic_facet | Molded interconnect devices. Three-dimensional display systems Congresses. Affichage tridimensionnel Congrès. TECHNOLOGY & ENGINEERING Mechanical. Molded interconnect devices Three-dimensional display systems Conference papers and proceedings |
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