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Proceedings of precision engineering and nanotechnology (ASPEN2011) :: selected, peer reviewed papers from the 4th International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN 2011), November 16-18, 2011, Hong Kong /

The present volumes contain selected papers on the fields of precision engineering - including precision/ultra-precision machining, non-traditional machining, manufacturing systems and machine tools, nano and micro metrology and surface characterization, MEMS/NEMS, advanced moulding and forming, hig...

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Bibliographic Details
Corporate Author:	International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN 2011) Hong Kong)
Other Authors:	Lee, W. B., Cheung, C. F., To, S.
Format:	Electronic Conference Proceeding eBook
Language:	English
Published:	Durnten-Zurich, Switzerland : Trans Tech Publications, 2012.
Series:	Key engineering materials ; v. 516.
Subjects:	Nanotechnology > Congresses. Micromachining > Congresses. Micro-usinage > Congrès. Nanotechnologie > Congrès. TECHNOLOGY & ENGINEERING > Engineering (General) TECHNOLOGY & ENGINEERING > Reference. Micromachining Nanotechnology Conference papers and proceedings
Online Access:	DE-862 DE-863
Summary:	The present volumes contain selected papers on the fields of precision engineering - including precision/ultra-precision machining, non-traditional machining, manufacturing systems and machine tools, nano and micro metrology and surface characterization, MEMS/NEMS, advanced moulding and forming, high-precision mechatronics and other technologies which are associated with micro/nano manufacturing. The work provides up-to-date and comprehensive coverage of the progress being made world wide. Review from Book News Inc.: The conferences are held by a consortium of academic societies in East Asia t.
Physical Description:	1 online resource (a-e, 667 pages :) : illustrations (some color).
Bibliography:	Includes bibliographical references and indexes.
ISBN:	9783038138426 3038138428
ISSN:	1662-9809 ;

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MARC


LEADER	00000cam a2200000 a 4500
001	ZDB-4-EBA-ocn815479236
003	OCoLC
005	20250103110447.0
006	m o d
007	cr cnu---unuuu
008	120924s2012 sz a ob 101 0 eng d
040			\|a E7B \|b eng \|e pn \|c E7B \|d OCLCO \|d OCLCQ \|d N$T \|d YDXCP \|d OCLCF \|d OCLCO \|d OCL \|d OCLCO \|d OCLCQ \|d OCLCO \|d OCLCQ \|d AGLDB \|d OCLCQ \|d VTS \|d STF \|d M8D \|d VLY \|d OCLCO \|d OCLCQ \|d OCLCO \|d OCLCQ \|d OCLCL
019			\|a 978665652 \|a 978976219 \|a 1048323646 \|a 1065247927 \|a 1119038473 \|a 1150962176 \|a 1151525313 \|a 1162210594 \|a 1241817531 \|a 1300602351 \|a 1303358828 \|a 1303510023
020			\|a 9783038138426 \|q (electronic bk.)
020			\|a 3038138428 \|q (electronic bk.)
020			\|z 9783037854280
035			\|a (OCoLC)815479236 \|z (OCoLC)978665652 \|z (OCoLC)978976219 \|z (OCoLC)1048323646 \|z (OCoLC)1065247927 \|z (OCoLC)1119038473 \|z (OCoLC)1150962176 \|z (OCoLC)1151525313 \|z (OCoLC)1162210594 \|z (OCoLC)1241817531 \|z (OCoLC)1300602351 \|z (OCoLC)1303358828 \|z (OCoLC)1303510023
050		4	\|a T174.7 \|b .I58 2011eb
072		7	\|a TEC \|x 009000 \|2 bisacsh
072		7	\|a TEC \|x 035000 \|2 bisacsh
082	7		\|a 620.5 \|2 23
049			\|a MAIN
111	2		\|a International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN 2011) \|n (4th : \|d Nov. 16-18, 2011 : \|c Hong Kong)
245	1	0	\|a Proceedings of precision engineering and nanotechnology (ASPEN2011) : \|b selected, peer reviewed papers from the 4th International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN 2011), November 16-18, 2011, Hong Kong / \|c edited by W.B. Lee, C.F. Cheung and S. To.
260			\|a Durnten-Zurich, Switzerland : \|b Trans Tech Publications, \|c 2012.
300			\|a 1 online resource (a-e, 667 pages :) : \|b illustrations (some color).
336			\|a text \|b txt \|2 rdacontent
337			\|a computer \|b c \|2 rdamedia
338			\|a online resource \|b cr \|2 rdacarrier
490	1		\|a Key engineering materials, \|x 1662-9809 ; \|v v. 516
504			\|a Includes bibliographical references and indexes.
588	0		\|a Print version record.
505	0		\|a Proceedings of Precision Engineering and Nanotechnology; Preface and Organizing Committee; Table of Contents; Electroformed Diamond Tool Adaptable to Nanometer Grinding of Cemented Carbide; Tool Deflection Modeling in Ball-End Milling of Sculptured Surface; Multiscale Modeling Study on the Nanometric Cutting Process of CaF2; Ion Beam Figuring System for Ultra-Precise Optics; Fabrication of PDMS Nano-Stamp by Replicating Si Nano-Moulds Fabricated by Interference Lithography; Cu-Direct Laser Drilling of Blind Via-Hole in Multi-Layer PWBs: Process Visualization Using High-Speed Camera Images
505	8		\|a Investigation on Micro-Machining Characteristics and Phenomenon of Semiconductor Materials by Harmonics of Nd:YAG LaserUltra Precision Machining of the Winston Cone Baffle for Space Observation Camera; A Development of Dispenser for High-Viscosity Liquid and Pick and Place of Micro Objects Using Capillary Force; Fabrication of Fine Mesh Filter Screen with Pulsed Laser; Self-Assembly of Functional Particles on Optical Element for Sensitivity Improvement of Biochemical Sensor; Development of CAPP/CAM System for Ultraprecision Micromachining -- Process Planning Considering Setting Error
505	8		\|a Optimization of Nozzle Flushing Method for Smooth Debris Exclusion in Wire EDMExperimental Research on Smooth Surface Polishing Based on the Cluster Magnetorheological Effect; Structural Effect of PVA Brush Nodule on Particle Removal Efficiency during Brush Scrubber Cleaning; Trapping of Nano-Particles Using a Near-Field Optical Fiber Probe; Determination Method of Locations and Postures of Cutting Tool for 5-Axis Machining Based on Intuition and Minimum Cusp Height; Integrated Development of a Modularized ECM Manufacturing System Based on the Reconfigurable Manufacturing System Concept
505	8		\|a Back-Side Thinning of Silicon Carbide Wafer by Plasma Etching Using Atmospheric-Pressure PlasmaEstimation System of Accurate Cutting Time Based on Actual Feedrate Identification; Smoothing Mechanism of Reaction Sintered SiC in Plasma Assisted Polishing Using Ceria Abrasive; Evaluation of Surface Roughness in High-Speed Shaping of Ni-P; Selective Cell-Adhesion on Micro-Structured Fine Particles; Development of a 3-DOF Mobile Positioning Mechanism with 6 Contact Points; Application of 3D-CAD Random Model to Prediction of Ground Surfaces by Helical Scan Grinding
505	8		\|a EDM Properties of EC-PCD Manufactured Using Electrically Conductive Diamond ParticlesDevelopment of a Feed Drive Simulator; Increase in the Area of Structured Surface and its Effect on Sensitivity Improvement of Biochemical Sensing; Robust Production Scheduling Using Autonomous Distributed Systems; 3D FEM Simulation of Micro Cutting for Prism Patterning on Nickel Plated Roll Die Using Lagrangian Method; 5-Axis Control Dexterous Ultraprecision Micromilling of Ruled Surface with Side Cutting Edge
520			\|a The present volumes contain selected papers on the fields of precision engineering - including precision/ultra-precision machining, non-traditional machining, manufacturing systems and machine tools, nano and micro metrology and surface characterization, MEMS/NEMS, advanced moulding and forming, high-precision mechatronics and other technologies which are associated with micro/nano manufacturing. The work provides up-to-date and comprehensive coverage of the progress being made world wide. Review from Book News Inc.: The conferences are held by a consortium of academic societies in East Asia t.
546			\|a English.
650		0	\|a Nanotechnology \|v Congresses.
650		0	\|a Micromachining \|v Congresses.
650		6	\|a Micro-usinage \|v Congrès.
650		6	\|a Nanotechnologie \|v Congrès.
650		7	\|a TECHNOLOGY & ENGINEERING \|x Engineering (General) \|2 bisacsh
650		7	\|a TECHNOLOGY & ENGINEERING \|x Reference. \|2 bisacsh
650		7	\|a Micromachining \|2 fast
650		7	\|a Nanotechnology \|2 fast
655		7	\|a Conference papers and proceedings \|2 fast
700	1		\|a Lee, W. B.
700	1		\|a Cheung, C. F.
700	1		\|a To, S.
758			\|i has work: \|a Proceedings of precision engineering and nanotechnology (Text) \|1 https://id.oclc.org/worldcat/entity/E39PCFRGxFbKDpyQpM9mgbfbcX \|4 https://id.oclc.org/worldcat/ontology/hasWork
776			\|z 3-03785-428-6
830		0	\|a Key engineering materials ; \|v v. 516. \|x 1662-9809 \|0 http://id.loc.gov/authorities/names/no99072054
966	4	0	\|l DE-862 \|p ZDB-4-EBA \|q FWS_PDA_EBA \|u https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=517209 \|3 Volltext
966	4	0	\|l DE-863 \|p ZDB-4-EBA \|q FWS_PDA_EBA \|u https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=517209 \|3 Volltext
938			\|a ebrary \|b EBRY \|n ebr10604246
938			\|a EBSCOhost \|b EBSC \|n 517209
938			\|a YBP Library Services \|b YANK \|n 9700769
994			\|a 92 \|b GEBAY
912			\|a ZDB-4-EBA
049			\|a DE-862
049			\|a DE-863

Record in the Search Index

DE-BY-FWS_katkey	ZDB-4-EBA-ocn815479236
_version_	1829094939746631680
adam_text
any_adam_object
author2	Lee, W. B. Cheung, C. F. To, S.
author2_role
author2_variant	w b l wb wbl c f c cf cfc s t st
author_corporate	International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN 2011) Hong Kong)
author_corporate_role
author_facet	Lee, W. B. Cheung, C. F. To, S. International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN 2011) Hong Kong)
author_sort	International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN 2011) Hong Kong)
building	Verbundindex
bvnumber	localFWS
callnumber-first	T - Technology
callnumber-label	T174
callnumber-raw	T174.7 .I58 2011eb
callnumber-search	T174.7 .I58 2011eb
callnumber-sort	T 3174.7 I58 42011EB
callnumber-subject	T - General Technology
collection	ZDB-4-EBA
contents	Proceedings of Precision Engineering and Nanotechnology; Preface and Organizing Committee; Table of Contents; Electroformed Diamond Tool Adaptable to Nanometer Grinding of Cemented Carbide; Tool Deflection Modeling in Ball-End Milling of Sculptured Surface; Multiscale Modeling Study on the Nanometric Cutting Process of CaF2; Ion Beam Figuring System for Ultra-Precise Optics; Fabrication of PDMS Nano-Stamp by Replicating Si Nano-Moulds Fabricated by Interference Lithography; Cu-Direct Laser Drilling of Blind Via-Hole in Multi-Layer PWBs: Process Visualization Using High-Speed Camera Images Investigation on Micro-Machining Characteristics and Phenomenon of Semiconductor Materials by Harmonics of Nd:YAG LaserUltra Precision Machining of the Winston Cone Baffle for Space Observation Camera; A Development of Dispenser for High-Viscosity Liquid and Pick and Place of Micro Objects Using Capillary Force; Fabrication of Fine Mesh Filter Screen with Pulsed Laser; Self-Assembly of Functional Particles on Optical Element for Sensitivity Improvement of Biochemical Sensor; Development of CAPP/CAM System for Ultraprecision Micromachining -- Process Planning Considering Setting Error Optimization of Nozzle Flushing Method for Smooth Debris Exclusion in Wire EDMExperimental Research on Smooth Surface Polishing Based on the Cluster Magnetorheological Effect; Structural Effect of PVA Brush Nodule on Particle Removal Efficiency during Brush Scrubber Cleaning; Trapping of Nano-Particles Using a Near-Field Optical Fiber Probe; Determination Method of Locations and Postures of Cutting Tool for 5-Axis Machining Based on Intuition and Minimum Cusp Height; Integrated Development of a Modularized ECM Manufacturing System Based on the Reconfigurable Manufacturing System Concept Back-Side Thinning of Silicon Carbide Wafer by Plasma Etching Using Atmospheric-Pressure PlasmaEstimation System of Accurate Cutting Time Based on Actual Feedrate Identification; Smoothing Mechanism of Reaction Sintered SiC in Plasma Assisted Polishing Using Ceria Abrasive; Evaluation of Surface Roughness in High-Speed Shaping of Ni-P; Selective Cell-Adhesion on Micro-Structured Fine Particles; Development of a 3-DOF Mobile Positioning Mechanism with 6 Contact Points; Application of 3D-CAD Random Model to Prediction of Ground Surfaces by Helical Scan Grinding EDM Properties of EC-PCD Manufactured Using Electrically Conductive Diamond ParticlesDevelopment of a Feed Drive Simulator; Increase in the Area of Structured Surface and its Effect on Sensitivity Improvement of Biochemical Sensing; Robust Production Scheduling Using Autonomous Distributed Systems; 3D FEM Simulation of Micro Cutting for Prism Patterning on Nickel Plated Roll Die Using Lagrangian Method; 5-Axis Control Dexterous Ultraprecision Micromilling of Ruled Surface with Side Cutting Edge
ctrlnum	(OCoLC)815479236
dewey-full	620.5
dewey-hundreds	600 - Technology (Applied sciences)
dewey-ones	620 - Engineering and allied operations
dewey-raw	620.5
dewey-search	620.5
dewey-sort	3620.5
dewey-tens	620 - Engineering and allied operations
format	Electronic Conference Proceeding eBook
fullrecord	<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>06691cam a2200673 a 4500</leader><controlfield tag="001">ZDB-4-EBA-ocn815479236</controlfield><controlfield tag="003">OCoLC</controlfield><controlfield tag="005">20250103110447.0</controlfield><controlfield tag="006">m o d </controlfield><controlfield tag="007">cr cnu---unuuu</controlfield><controlfield tag="008">120924s2012 sz a ob 101 0 eng d</controlfield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">E7B</subfield><subfield code="b">eng</subfield><subfield code="e">pn</subfield><subfield code="c">E7B</subfield><subfield code="d">OCLCO</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">N$T</subfield><subfield code="d">YDXCP</subfield><subfield code="d">OCLCF</subfield><subfield code="d">OCLCO</subfield><subfield code="d">OCL</subfield><subfield code="d">OCLCO</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">OCLCO</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">AGLDB</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">VTS</subfield><subfield code="d">STF</subfield><subfield code="d">M8D</subfield><subfield code="d">VLY</subfield><subfield code="d">OCLCO</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">OCLCO</subfield><subfield code="d">OCLCQ</subfield><subfield code="d">OCLCL</subfield></datafield><datafield tag="019" ind1=" " ind2=" "><subfield code="a">978665652</subfield><subfield code="a">978976219</subfield><subfield code="a">1048323646</subfield><subfield code="a">1065247927</subfield><subfield code="a">1119038473</subfield><subfield code="a">1150962176</subfield><subfield code="a">1151525313</subfield><subfield code="a">1162210594</subfield><subfield code="a">1241817531</subfield><subfield code="a">1300602351</subfield><subfield code="a">1303358828</subfield><subfield code="a">1303510023</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783038138426</subfield><subfield code="q">(electronic bk.)</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">3038138428</subfield><subfield code="q">(electronic bk.)</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="z">9783037854280</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)815479236</subfield><subfield code="z">(OCoLC)978665652</subfield><subfield code="z">(OCoLC)978976219</subfield><subfield code="z">(OCoLC)1048323646</subfield><subfield code="z">(OCoLC)1065247927</subfield><subfield code="z">(OCoLC)1119038473</subfield><subfield code="z">(OCoLC)1150962176</subfield><subfield code="z">(OCoLC)1151525313</subfield><subfield code="z">(OCoLC)1162210594</subfield><subfield code="z">(OCoLC)1241817531</subfield><subfield code="z">(OCoLC)1300602351</subfield><subfield code="z">(OCoLC)1303358828</subfield><subfield code="z">(OCoLC)1303510023</subfield></datafield><datafield tag="050" ind1=" " ind2="4"><subfield code="a">T174.7</subfield><subfield code="b">.I58 2011eb</subfield></datafield><datafield tag="072" ind1=" " ind2="7"><subfield code="a">TEC</subfield><subfield code="x">009000</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="072" ind1=" " ind2="7"><subfield code="a">TEC</subfield><subfield code="x">035000</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="082" ind1="7" ind2=" "><subfield code="a">620.5</subfield><subfield code="2">23</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">MAIN</subfield></datafield><datafield tag="111" ind1="2" ind2=" "><subfield code="a">International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN 2011)</subfield><subfield code="n">(4th :</subfield><subfield code="d">Nov. 16-18, 2011 :</subfield><subfield code="c">Hong Kong)</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Proceedings of precision engineering and nanotechnology (ASPEN2011) :</subfield><subfield code="b">selected, peer reviewed papers from the 4th International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN 2011), November 16-18, 2011, Hong Kong /</subfield><subfield code="c">edited by W.B. Lee, C.F. Cheung and S. To.</subfield></datafield><datafield tag="260" ind1=" " ind2=" "><subfield code="a">Durnten-Zurich, Switzerland :</subfield><subfield code="b">Trans Tech Publications,</subfield><subfield code="c">2012.</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 online resource (a-e, 667 pages :) :</subfield><subfield code="b">illustrations (some color).</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">computer</subfield><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">online resource</subfield><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="1" ind2=" "><subfield code="a">Key engineering materials,</subfield><subfield code="x">1662-9809 ;</subfield><subfield code="v">v. 516</subfield></datafield><datafield tag="504" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references and indexes.</subfield></datafield><datafield tag="588" ind1="0" ind2=" "><subfield code="a">Print version record.</subfield></datafield><datafield tag="505" ind1="0" ind2=" "><subfield code="a">Proceedings of Precision Engineering and Nanotechnology; Preface and Organizing Committee; Table of Contents; Electroformed Diamond Tool Adaptable to Nanometer Grinding of Cemented Carbide; Tool Deflection Modeling in Ball-End Milling of Sculptured Surface; Multiscale Modeling Study on the Nanometric Cutting Process of CaF2; Ion Beam Figuring System for Ultra-Precise Optics; Fabrication of PDMS Nano-Stamp by Replicating Si Nano-Moulds Fabricated by Interference Lithography; Cu-Direct Laser Drilling of Blind Via-Hole in Multi-Layer PWBs: Process Visualization Using High-Speed Camera Images</subfield></datafield><datafield tag="505" ind1="8" ind2=" "><subfield code="a">Investigation on Micro-Machining Characteristics and Phenomenon of Semiconductor Materials by Harmonics of Nd:YAG LaserUltra Precision Machining of the Winston Cone Baffle for Space Observation Camera; A Development of Dispenser for High-Viscosity Liquid and Pick and Place of Micro Objects Using Capillary Force; Fabrication of Fine Mesh Filter Screen with Pulsed Laser; Self-Assembly of Functional Particles on Optical Element for Sensitivity Improvement of Biochemical Sensor; Development of CAPP/CAM System for Ultraprecision Micromachining -- Process Planning Considering Setting Error</subfield></datafield><datafield tag="505" ind1="8" ind2=" "><subfield code="a">Optimization of Nozzle Flushing Method for Smooth Debris Exclusion in Wire EDMExperimental Research on Smooth Surface Polishing Based on the Cluster Magnetorheological Effect; Structural Effect of PVA Brush Nodule on Particle Removal Efficiency during Brush Scrubber Cleaning; Trapping of Nano-Particles Using a Near-Field Optical Fiber Probe; Determination Method of Locations and Postures of Cutting Tool for 5-Axis Machining Based on Intuition and Minimum Cusp Height; Integrated Development of a Modularized ECM Manufacturing System Based on the Reconfigurable Manufacturing System Concept</subfield></datafield><datafield tag="505" ind1="8" ind2=" "><subfield code="a">Back-Side Thinning of Silicon Carbide Wafer by Plasma Etching Using Atmospheric-Pressure PlasmaEstimation System of Accurate Cutting Time Based on Actual Feedrate Identification; Smoothing Mechanism of Reaction Sintered SiC in Plasma Assisted Polishing Using Ceria Abrasive; Evaluation of Surface Roughness in High-Speed Shaping of Ni-P; Selective Cell-Adhesion on Micro-Structured Fine Particles; Development of a 3-DOF Mobile Positioning Mechanism with 6 Contact Points; Application of 3D-CAD Random Model to Prediction of Ground Surfaces by Helical Scan Grinding</subfield></datafield><datafield tag="505" ind1="8" ind2=" "><subfield code="a">EDM Properties of EC-PCD Manufactured Using Electrically Conductive Diamond ParticlesDevelopment of a Feed Drive Simulator; Increase in the Area of Structured Surface and its Effect on Sensitivity Improvement of Biochemical Sensing; Robust Production Scheduling Using Autonomous Distributed Systems; 3D FEM Simulation of Micro Cutting for Prism Patterning on Nickel Plated Roll Die Using Lagrangian Method; 5-Axis Control Dexterous Ultraprecision Micromilling of Ruled Surface with Side Cutting Edge</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">The present volumes contain selected papers on the fields of precision engineering - including precision/ultra-precision machining, non-traditional machining, manufacturing systems and machine tools, nano and micro metrology and surface characterization, MEMS/NEMS, advanced moulding and forming, high-precision mechatronics and other technologies which are associated with micro/nano manufacturing. The work provides up-to-date and comprehensive coverage of the progress being made world wide. Review from Book News Inc.: The conferences are held by a consortium of academic societies in East Asia t.</subfield></datafield><datafield tag="546" ind1=" " ind2=" "><subfield code="a">English.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Nanotechnology</subfield><subfield code="v">Congresses.</subfield></datafield><datafield tag="650" ind1=" " ind2="0"><subfield code="a">Micromachining</subfield><subfield code="v">Congresses.</subfield></datafield><datafield tag="650" ind1=" " ind2="6"><subfield code="a">Micro-usinage</subfield><subfield code="v">Congrès.</subfield></datafield><datafield tag="650" ind1=" " ind2="6"><subfield code="a">Nanotechnologie</subfield><subfield code="v">Congrès.</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING</subfield><subfield code="x">Engineering (General)</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING</subfield><subfield code="x">Reference.</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Micromachining</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Nanotechnology</subfield><subfield code="2">fast</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="a">Conference papers and proceedings</subfield><subfield code="2">fast</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Lee, W. B.</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Cheung, C. F.</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">To, S.</subfield></datafield><datafield tag="758" ind1=" " ind2=" "><subfield code="i">has work:</subfield><subfield code="a">Proceedings of precision engineering and nanotechnology (Text)</subfield><subfield code="1">https://id.oclc.org/worldcat/entity/E39PCFRGxFbKDpyQpM9mgbfbcX</subfield><subfield code="4">https://id.oclc.org/worldcat/ontology/hasWork</subfield></datafield><datafield tag="776" ind1=" " ind2=" "><subfield code="z">3-03785-428-6</subfield></datafield><datafield tag="830" ind1=" " ind2="0"><subfield code="a">Key engineering materials ;</subfield><subfield code="v">v. 516.</subfield><subfield code="x">1662-9809</subfield><subfield code="0">http://id.loc.gov/authorities/names/no99072054</subfield></datafield><datafield tag="966" ind1="4" ind2="0"><subfield code="l">DE-862</subfield><subfield code="p">ZDB-4-EBA</subfield><subfield code="q">FWS_PDA_EBA</subfield><subfield code="u">https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=517209</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="4" ind2="0"><subfield code="l">DE-863</subfield><subfield code="p">ZDB-4-EBA</subfield><subfield code="q">FWS_PDA_EBA</subfield><subfield code="u">https://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=517209</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="938" ind1=" " ind2=" "><subfield code="a">ebrary</subfield><subfield code="b">EBRY</subfield><subfield code="n">ebr10604246</subfield></datafield><datafield tag="938" ind1=" " ind2=" "><subfield code="a">EBSCOhost</subfield><subfield code="b">EBSC</subfield><subfield code="n">517209</subfield></datafield><datafield tag="938" ind1=" " ind2=" "><subfield code="a">YBP Library Services</subfield><subfield code="b">YANK</subfield><subfield code="n">9700769</subfield></datafield><datafield tag="994" ind1=" " ind2=" "><subfield code="a">92</subfield><subfield code="b">GEBAY</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-4-EBA</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-862</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-863</subfield></datafield></record></collection>
genre	Conference papers and proceedings fast
genre_facet	Conference papers and proceedings
id	ZDB-4-EBA-ocn815479236
illustrated	Illustrated
indexdate	2025-04-11T08:41:06Z
institution	BVB
isbn	9783038138426 3038138428
issn	1662-9809 ;
language	English
oclc_num	815479236
open_access_boolean
owner	MAIN DE-862 DE-BY-FWS DE-863 DE-BY-FWS
owner_facet	MAIN DE-862 DE-BY-FWS DE-863 DE-BY-FWS
physical	1 online resource (a-e, 667 pages :) : illustrations (some color).
psigel	ZDB-4-EBA FWS_PDA_EBA ZDB-4-EBA
publishDate	2012
publishDateSearch	2012
publishDateSort	2012
publisher	Trans Tech Publications,
record_format	marc
series	Key engineering materials ;
series2	Key engineering materials,
spelling	International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN 2011) (4th : Nov. 16-18, 2011 : Hong Kong) Proceedings of precision engineering and nanotechnology (ASPEN2011) : selected, peer reviewed papers from the 4th International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN 2011), November 16-18, 2011, Hong Kong / edited by W.B. Lee, C.F. Cheung and S. To. Durnten-Zurich, Switzerland : Trans Tech Publications, 2012. 1 online resource (a-e, 667 pages :) : illustrations (some color). text txt rdacontent computer c rdamedia online resource cr rdacarrier Key engineering materials, 1662-9809 ; v. 516 Includes bibliographical references and indexes. Print version record. Proceedings of Precision Engineering and Nanotechnology; Preface and Organizing Committee; Table of Contents; Electroformed Diamond Tool Adaptable to Nanometer Grinding of Cemented Carbide; Tool Deflection Modeling in Ball-End Milling of Sculptured Surface; Multiscale Modeling Study on the Nanometric Cutting Process of CaF2; Ion Beam Figuring System for Ultra-Precise Optics; Fabrication of PDMS Nano-Stamp by Replicating Si Nano-Moulds Fabricated by Interference Lithography; Cu-Direct Laser Drilling of Blind Via-Hole in Multi-Layer PWBs: Process Visualization Using High-Speed Camera Images Investigation on Micro-Machining Characteristics and Phenomenon of Semiconductor Materials by Harmonics of Nd:YAG LaserUltra Precision Machining of the Winston Cone Baffle for Space Observation Camera; A Development of Dispenser for High-Viscosity Liquid and Pick and Place of Micro Objects Using Capillary Force; Fabrication of Fine Mesh Filter Screen with Pulsed Laser; Self-Assembly of Functional Particles on Optical Element for Sensitivity Improvement of Biochemical Sensor; Development of CAPP/CAM System for Ultraprecision Micromachining -- Process Planning Considering Setting Error Optimization of Nozzle Flushing Method for Smooth Debris Exclusion in Wire EDMExperimental Research on Smooth Surface Polishing Based on the Cluster Magnetorheological Effect; Structural Effect of PVA Brush Nodule on Particle Removal Efficiency during Brush Scrubber Cleaning; Trapping of Nano-Particles Using a Near-Field Optical Fiber Probe; Determination Method of Locations and Postures of Cutting Tool for 5-Axis Machining Based on Intuition and Minimum Cusp Height; Integrated Development of a Modularized ECM Manufacturing System Based on the Reconfigurable Manufacturing System Concept Back-Side Thinning of Silicon Carbide Wafer by Plasma Etching Using Atmospheric-Pressure PlasmaEstimation System of Accurate Cutting Time Based on Actual Feedrate Identification; Smoothing Mechanism of Reaction Sintered SiC in Plasma Assisted Polishing Using Ceria Abrasive; Evaluation of Surface Roughness in High-Speed Shaping of Ni-P; Selective Cell-Adhesion on Micro-Structured Fine Particles; Development of a 3-DOF Mobile Positioning Mechanism with 6 Contact Points; Application of 3D-CAD Random Model to Prediction of Ground Surfaces by Helical Scan Grinding EDM Properties of EC-PCD Manufactured Using Electrically Conductive Diamond ParticlesDevelopment of a Feed Drive Simulator; Increase in the Area of Structured Surface and its Effect on Sensitivity Improvement of Biochemical Sensing; Robust Production Scheduling Using Autonomous Distributed Systems; 3D FEM Simulation of Micro Cutting for Prism Patterning on Nickel Plated Roll Die Using Lagrangian Method; 5-Axis Control Dexterous Ultraprecision Micromilling of Ruled Surface with Side Cutting Edge The present volumes contain selected papers on the fields of precision engineering - including precision/ultra-precision machining, non-traditional machining, manufacturing systems and machine tools, nano and micro metrology and surface characterization, MEMS/NEMS, advanced moulding and forming, high-precision mechatronics and other technologies which are associated with micro/nano manufacturing. The work provides up-to-date and comprehensive coverage of the progress being made world wide. Review from Book News Inc.: The conferences are held by a consortium of academic societies in East Asia t. English. Nanotechnology Congresses. Micromachining Congresses. Micro-usinage Congrès. Nanotechnologie Congrès. TECHNOLOGY & ENGINEERING Engineering (General) bisacsh TECHNOLOGY & ENGINEERING Reference. bisacsh Micromachining fast Nanotechnology fast Conference papers and proceedings fast Lee, W. B. Cheung, C. F. To, S. has work: Proceedings of precision engineering and nanotechnology (Text) https://id.oclc.org/worldcat/entity/E39PCFRGxFbKDpyQpM9mgbfbcX https://id.oclc.org/worldcat/ontology/hasWork 3-03785-428-6 Key engineering materials ; v. 516. 1662-9809 http://id.loc.gov/authorities/names/no99072054
spellingShingle	Proceedings of precision engineering and nanotechnology (ASPEN2011) : selected, peer reviewed papers from the 4th International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN 2011), November 16-18, 2011, Hong Kong / Key engineering materials ; Proceedings of Precision Engineering and Nanotechnology; Preface and Organizing Committee; Table of Contents; Electroformed Diamond Tool Adaptable to Nanometer Grinding of Cemented Carbide; Tool Deflection Modeling in Ball-End Milling of Sculptured Surface; Multiscale Modeling Study on the Nanometric Cutting Process of CaF2; Ion Beam Figuring System for Ultra-Precise Optics; Fabrication of PDMS Nano-Stamp by Replicating Si Nano-Moulds Fabricated by Interference Lithography; Cu-Direct Laser Drilling of Blind Via-Hole in Multi-Layer PWBs: Process Visualization Using High-Speed Camera Images Investigation on Micro-Machining Characteristics and Phenomenon of Semiconductor Materials by Harmonics of Nd:YAG LaserUltra Precision Machining of the Winston Cone Baffle for Space Observation Camera; A Development of Dispenser for High-Viscosity Liquid and Pick and Place of Micro Objects Using Capillary Force; Fabrication of Fine Mesh Filter Screen with Pulsed Laser; Self-Assembly of Functional Particles on Optical Element for Sensitivity Improvement of Biochemical Sensor; Development of CAPP/CAM System for Ultraprecision Micromachining -- Process Planning Considering Setting Error Optimization of Nozzle Flushing Method for Smooth Debris Exclusion in Wire EDMExperimental Research on Smooth Surface Polishing Based on the Cluster Magnetorheological Effect; Structural Effect of PVA Brush Nodule on Particle Removal Efficiency during Brush Scrubber Cleaning; Trapping of Nano-Particles Using a Near-Field Optical Fiber Probe; Determination Method of Locations and Postures of Cutting Tool for 5-Axis Machining Based on Intuition and Minimum Cusp Height; Integrated Development of a Modularized ECM Manufacturing System Based on the Reconfigurable Manufacturing System Concept Back-Side Thinning of Silicon Carbide Wafer by Plasma Etching Using Atmospheric-Pressure PlasmaEstimation System of Accurate Cutting Time Based on Actual Feedrate Identification; Smoothing Mechanism of Reaction Sintered SiC in Plasma Assisted Polishing Using Ceria Abrasive; Evaluation of Surface Roughness in High-Speed Shaping of Ni-P; Selective Cell-Adhesion on Micro-Structured Fine Particles; Development of a 3-DOF Mobile Positioning Mechanism with 6 Contact Points; Application of 3D-CAD Random Model to Prediction of Ground Surfaces by Helical Scan Grinding EDM Properties of EC-PCD Manufactured Using Electrically Conductive Diamond ParticlesDevelopment of a Feed Drive Simulator; Increase in the Area of Structured Surface and its Effect on Sensitivity Improvement of Biochemical Sensing; Robust Production Scheduling Using Autonomous Distributed Systems; 3D FEM Simulation of Micro Cutting for Prism Patterning on Nickel Plated Roll Die Using Lagrangian Method; 5-Axis Control Dexterous Ultraprecision Micromilling of Ruled Surface with Side Cutting Edge Nanotechnology Congresses. Micromachining Congresses. Micro-usinage Congrès. Nanotechnologie Congrès. TECHNOLOGY & ENGINEERING Engineering (General) bisacsh TECHNOLOGY & ENGINEERING Reference. bisacsh Micromachining fast Nanotechnology fast
title	Proceedings of precision engineering and nanotechnology (ASPEN2011) : selected, peer reviewed papers from the 4th International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN 2011), November 16-18, 2011, Hong Kong /
title_auth	Proceedings of precision engineering and nanotechnology (ASPEN2011) : selected, peer reviewed papers from the 4th International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN 2011), November 16-18, 2011, Hong Kong /
title_exact_search	Proceedings of precision engineering and nanotechnology (ASPEN2011) : selected, peer reviewed papers from the 4th International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN 2011), November 16-18, 2011, Hong Kong /
title_full	Proceedings of precision engineering and nanotechnology (ASPEN2011) : selected, peer reviewed papers from the 4th International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN 2011), November 16-18, 2011, Hong Kong / edited by W.B. Lee, C.F. Cheung and S. To.
title_fullStr	Proceedings of precision engineering and nanotechnology (ASPEN2011) : selected, peer reviewed papers from the 4th International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN 2011), November 16-18, 2011, Hong Kong / edited by W.B. Lee, C.F. Cheung and S. To.
title_full_unstemmed	Proceedings of precision engineering and nanotechnology (ASPEN2011) : selected, peer reviewed papers from the 4th International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN 2011), November 16-18, 2011, Hong Kong / edited by W.B. Lee, C.F. Cheung and S. To.
title_short	Proceedings of precision engineering and nanotechnology (ASPEN2011) :
title_sort	proceedings of precision engineering and nanotechnology aspen2011 selected peer reviewed papers from the 4th international conference of asian society for precision engineering and nanotechnology aspen 2011 november 16 18 2011 hong kong
title_sub	selected, peer reviewed papers from the 4th International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN 2011), November 16-18, 2011, Hong Kong /
topic	Nanotechnology Congresses. Micromachining Congresses. Micro-usinage Congrès. Nanotechnologie Congrès. TECHNOLOGY & ENGINEERING Engineering (General) bisacsh TECHNOLOGY & ENGINEERING Reference. bisacsh Micromachining fast Nanotechnology fast
topic_facet	Nanotechnology Congresses. Micromachining Congresses. Micro-usinage Congrès. Nanotechnologie Congrès. TECHNOLOGY & ENGINEERING Engineering (General) TECHNOLOGY & ENGINEERING Reference. Micromachining Nanotechnology Conference papers and proceedings
work_keys_str_mv	AT internationalconferenceofasiansocietyforprecisionengineeringandnanotechnologyaspen2011hongkong proceedingsofprecisionengineeringandnanotechnologyaspen2011selectedpeerreviewedpapersfromthe4thinternationalconferenceofasiansocietyforprecisionengineeringandnanotechnologyaspen2011november16182011hongkong AT leewb proceedingsofprecisionengineeringandnanotechnologyaspen2011selectedpeerreviewedpapersfromthe4thinternationalconferenceofasiansocietyforprecisionengineeringandnanotechnologyaspen2011november16182011hongkong AT cheungcf proceedingsofprecisionengineeringandnanotechnologyaspen2011selectedpeerreviewedpapersfromthe4thinternationalconferenceofasiansocietyforprecisionengineeringandnanotechnologyaspen2011november16182011hongkong AT tos proceedingsofprecisionengineeringandnanotechnologyaspen2011selectedpeerreviewedpapersfromthe4thinternationalconferenceofasiansocietyforprecisionengineeringandnanotechnologyaspen2011november16182011hongkong

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