Flexible electronic packaging and encapsulation technology:
Saved in:
| Other Authors: | , |
|---|---|
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Weinheim
Wiley-VCH
[2024]
|
| Subjects: | |
| Online Access: | DE-703 Volltext |
| Physical Description: | 1 Online-Ressource (xvi, 360 Seiten) Illustrationen, Diagramme |
| ISBN: | 9783527845729 9783527845705 9783527845712 |
| DOI: | 10.1002/9783527845729 |
Staff View
MARC
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| 653 | |a MS40: Elektronische Materialien | ||
| 653 | |a Materials Science | ||
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Record in the Search Index
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| adam_text | |
| any_adam_object | |
| author2 | Meng, Hong 1966- Huang, Wei |
| author2_role | edt edt |
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| author_GND | (DE-588)1235805891 |
| author_facet | Meng, Hong 1966- Huang, Wei |
| building | Verbundindex |
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| classification_rvk | ZN 4192 |
| collection | ZDB-35-WIC |
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| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| doi_str_mv | 10.1002/9783527845729 |
| format | Electronic eBook |
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| illustrated | Illustrated |
| indexdate | 2025-02-10T13:10:56Z |
| institution | BVB |
| institution_GND | (DE-588)16179388-5 |
| isbn | 9783527845729 9783527845705 9783527845712 |
| language | English |
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| owner_facet | DE-703 |
| physical | 1 Online-Ressource (xvi, 360 Seiten) Illustrationen, Diagramme |
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| publishDate | 2024 |
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| spelling | Flexible electronic packaging and encapsulation technology edited by Hong Meng and Wei Huang Weinheim Wiley-VCH [2024] 1 Online-Ressource (xvi, 360 Seiten) Illustrationen, Diagramme txt rdacontent c rdamedia cr rdacarrier Verkapseln (DE-588)4139497-5 gnd rswk-swf Halbleitergehäuse (DE-588)4143472-9 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Components & Devices EE60: Komponenten u. Bauelemente Electrical & Electronics Engineering Electronic Materials Elektronische Materialien Elektrotechnik u. Elektronik Halbleiterphysik Komponenten u. Bauelemente MS40: Elektronische Materialien Materials Science Materialwissenschaften PH62: Halbleiterphysik Physics Physik Semiconductor Physics (DE-588)4143413-4 Aufsatzsammlung gnd-content Elektronisches Bauelement (DE-588)4014360-0 s Verkapseln (DE-588)4139497-5 s Halbleitergehäuse (DE-588)4143472-9 s DE-604 Meng, Hong 1966- (DE-588)1235805891 edt Huang, Wei edt Wiley-VCH (DE-588)16179388-5 pbl Erscheint auch als Druck-Ausgabe 978-3-527-35359-0 https://doi.org/10.1002/9783527845729 Verlag URL des Erstveröffentlichers Volltext 1\p vlb 20230909 DE-101 https://d-nb.info/provenance/plan#vlb |
| spellingShingle | Flexible electronic packaging and encapsulation technology Verkapseln (DE-588)4139497-5 gnd Halbleitergehäuse (DE-588)4143472-9 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd |
| subject_GND | (DE-588)4139497-5 (DE-588)4143472-9 (DE-588)4014360-0 (DE-588)4143413-4 |
| title | Flexible electronic packaging and encapsulation technology |
| title_auth | Flexible electronic packaging and encapsulation technology |
| title_exact_search | Flexible electronic packaging and encapsulation technology |
| title_full | Flexible electronic packaging and encapsulation technology edited by Hong Meng and Wei Huang |
| title_fullStr | Flexible electronic packaging and encapsulation technology edited by Hong Meng and Wei Huang |
| title_full_unstemmed | Flexible electronic packaging and encapsulation technology edited by Hong Meng and Wei Huang |
| title_short | Flexible electronic packaging and encapsulation technology |
| title_sort | flexible electronic packaging and encapsulation technology |
| topic | Verkapseln (DE-588)4139497-5 gnd Halbleitergehäuse (DE-588)4143472-9 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd |
| topic_facet | Verkapseln Halbleitergehäuse Elektronisches Bauelement Aufsatzsammlung |
| url | https://doi.org/10.1002/9783527845729 |
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