The development and characterization of a Cu-pillar flip-chip package for mm-wave applications:
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis Electronic eBook |
| Language: | English |
| Published: |
Berlin
2024
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| Subjects: | |
| Online Access: | Volltext |
| Physical Description: | 1 Online-Ressource (xi, 142 Seiten) Illustrationen, Diagramme |
| DOI: | 10.14279/depositonce-20911 |
Staff View
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| spelling | Cao, Zhibo Verfasser (DE-588)1306212758 aut The development and characterization of a Cu-pillar flip-chip package for mm-wave applications vorgelegt von Zhibo Cao Berlin 2024 1 Online-Ressource (xi, 142 Seiten) Illustrationen, Diagramme txt rdacontent c rdamedia cr rdacarrier Dissertation Technische Universität Berlin 2024 Halbleitergehäuse (DE-588)4143472-9 gnd rswk-swf (DE-588)4113937-9 Hochschulschrift gnd-content Halbleitergehäuse (DE-588)4143472-9 s DE-604 Erscheint auch als Druck-Ausgabe (DE-604)BV049803468 https://doi.org/10.14279/depositonce-20911 Resolving-System kostenfrei Volltext |
| spellingShingle | Cao, Zhibo The development and characterization of a Cu-pillar flip-chip package for mm-wave applications Halbleitergehäuse (DE-588)4143472-9 gnd |
| subject_GND | (DE-588)4143472-9 (DE-588)4113937-9 |
| title | The development and characterization of a Cu-pillar flip-chip package for mm-wave applications |
| title_auth | The development and characterization of a Cu-pillar flip-chip package for mm-wave applications |
| title_exact_search | The development and characterization of a Cu-pillar flip-chip package for mm-wave applications |
| title_full | The development and characterization of a Cu-pillar flip-chip package for mm-wave applications vorgelegt von Zhibo Cao |
| title_fullStr | The development and characterization of a Cu-pillar flip-chip package for mm-wave applications vorgelegt von Zhibo Cao |
| title_full_unstemmed | The development and characterization of a Cu-pillar flip-chip package for mm-wave applications vorgelegt von Zhibo Cao |
| title_short | The development and characterization of a Cu-pillar flip-chip package for mm-wave applications |
| title_sort | the development and characterization of a cu pillar flip chip package for mm wave applications |
| topic | Halbleitergehäuse (DE-588)4143472-9 gnd |
| topic_facet | Halbleitergehäuse Hochschulschrift |
| url | https://doi.org/10.14279/depositonce-20911 |
| work_keys_str_mv | AT caozhibo thedevelopmentandcharacterizationofacupillarflipchippackageformmwaveapplications |