Functional Via Structures in Passive Microwave Components on Multilayer Ceramic Substrates:
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis Book |
| Language: | English |
| Published: |
Düren
Shaker
2023
|
| Edition: | 1. Auflage |
| Series: | Berichte aus der Elektrotechnik
|
| Subjects: | |
| Online Access: | Inhaltsverzeichnis |
| Physical Description: | xxi, 139 Seiten Illustrationen, Diagramme 21 cm x 14.8 cm, 245 g |
| ISBN: | 9783844090024 3844090029 |
Staff View
MARC
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| 100 | 1 | |a Yildiz, Ömer Faruk |d 1990- |e Verfasser |0 (DE-588)128909960X |4 aut | |
| 245 | 1 | 0 | |a Functional Via Structures in Passive Microwave Components on Multilayer Ceramic Substrates |c Ömer Faruk Yildiz |
| 250 | |a 1. Auflage | ||
| 263 | |a 202304 | ||
| 264 | 1 | |a Düren |b Shaker |c 2023 | |
| 300 | |a xxi, 139 Seiten |b Illustrationen, Diagramme |c 21 cm x 14.8 cm, 245 g | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
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| 490 | 0 | |a Berichte aus der Elektrotechnik | |
| 502 | |b Dissertation |c Technische Universität Hamburg |d 2022 | ||
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| 653 | |a Ceramic Substrates | ||
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Record in the Search Index
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|---|---|
| adam_text | CONTENTS
SUMMARY
I
ACKNOWLEDGMENTS
III
LIST
OF
FIGURES
IX
LIST
OF
TABLES
XIII
ACRONYMS
XV
SYMBOLS,
NOTATION,
AND
UNITS
XIX
1.
INTRODUCTION
AND
MOTIVATION
1
1.1.
STATE
OF
THE
ART
................................................................................
2
1.1.1.
LOW
TEMPERATURE
COFIRED
CERAMICS
.............................
2
1.1.2.
FUNCTIONAL
VIA
STRUCTURES
................................................
4
1.1.3.
VERTICAL
INTEGRATION
.........................................................
6
1.2.
CONFERENCES,
JOURNALS,
AND
OTHER
PUBLISHED
WORK
..................
8
1.3.
THESIS
OVERVIEW
............................................................................
9
2.
FUNCTIONAL
VIAS
AS
QUASI-TRANSMISSION
LINES
11
2.1.
TRANSMISSION
LINE
MODEL
FOR
VIA
STRUCTURES
...............................
11
2.1.1.
VARIATIONAL
ANALYSIS
WITH
POLYNOMIAL
CHAOS
EXPANSION
15
2.1.2.
IMPEDANCE
STABILITY
AND
LOSSES
OF
FUNCTIONAL
VIAS
...
20
2.1.3.
VIA-TO-STRIPLINE
TRANSITIONS
..............................................
24
2.2.
VIAS
AS
IMPEDANCE
TRANSFORMERS
.................................................
24
2.2.1.
OPEN
AND
SHORTED
VIA
STUBS
..........................................
25
3.
MICROWAVE
FILTERS
USING
FUNCTIONAL
VIAS
29
3.1.
DESIGN
FLOW
FOR
VERTICAL
INTEGRATION
OF
CHEBYSHEV
FILTERS
.
.
.
29
3.2.
LOW-PASS
FILTERS
............................................................................
31
3.2.1.
MEASUREMENT
AND
CALIBRATION
SETUP
................................
34
3.2.2.
3RD-ORDER
LOW-PASS
FILTER
.................................................
37
3.2.3.
5TH-ORDER
LOW-PASS
FILTER
.................................................
37
V
CONTENTS
3.3.
BAND-PASS
FILTER
............................................................................
40
3.3.1.
5TH-ORDER
BAND-PASS
FILTER
..............................................
43
3.4.
FURTHER
REMARKS
ON
VERTICAL
INTEGRATION
....................................
43
3.4.1.
VERTICAL
INTEGRATION
OF
FILTERS
...........................................
43
3.4.2.
STEPPED
IMPEDANCE
FILTERS
..............................................
46
4.
VERTICALLY
INTEGRATED
HYBRID
COUPLERS
49
4.1.
90
HYBRID
COUPLER
..........................................................................
49
4.2.
180
HYBRID
COUPLER
.......................................................................
55
5.
N-WAY
WILKINSON
POWER
DIVIDERS
WITH
VIAS
59
5.1.
IMPLEMENTATION
OF
CONVENTIONAL
N-WAY
DIVIDERS
......................
60
5.2.
2
WAY
WILKINSON
POWER
DIVIDER
....................................................
62
5.3.
3
WAY
WILKINSON
POWER
DIVIDER
....................................................
69
5.4.
FURTHER
REMARKS
.............................................................................
74
5.4.1.
ADVANTAGES
AND
LIMITATIONS
OF
VERTICAL
INTEGRATION
...
75
5.4.2.
DIFFERENT
IMPLEMENTATIONS
OF
N-WAY
DIVIDERS
...............
75
6.
VIA
ARRAYS
ON
LOW
TEMPERATURE
COFIRED
CERAMICS
79
6.1.
DESIGN
PROCEDURE
AND
NETWORK
REPRESENTATION
.........................
80
6.1.1.
NEAR
AND
FAR-END
CROSSTALK
DEFINITIONS
.........................
81
6.2.
SINGLE-ENDED
SIGNALING
FOR
PASSIVE
MICROWAVE
COMPONENTS
.
.
82
6.2.1.
COMPARING
PHYSICS-BASED
VIA
AND
FULL-WAVE
MODELING
83
6.2.2.
IMPACT
OF
ADDITIONAL
GROUND
VIA
FENCES
......................
86
6.3.
DIFFERENTIAL
SIGNALING
FOR
VIA
ARRAYS
IN
HIGH-SPEED
LINKS
...
86
6.3.1.
COMPARING
CERAMIC
AND
ORGANIC
SUBSTRATES
..................
88
7.
CONCLUSION
AND
OUTLOOK
91
A.
THEORETICAL
BACKGROUND
95
A.I.
CHEBYSHEV
PROTOTYPE
FILTERS
.......................................................
95
A.
2.
TWO-TIER
CALIBRATION
......................................................................
95
A.2.1.
THE
THROUGH-REFLECT-LINE
METHOD
..................................
97
A.
2.2.
THE
DEEMBEDDING
METHOD
.................................................
103
A.
3.
UNCERTAINTY
QUANTIFICATION
AND
POLYNOMIAL
CHAOS
.....................
104
A.3.1.
GAUSSIAN
DISTRIBUTION
AND
HERMITE
POLYNOMIALS
....
105
A.
3.2.
UNIFORM
DISTRIBUTION
AND
LEGENDRE
POLYNOMIALS
....
105
A.
3.3.
MULTIVARIATE
POLYNOMIAL
CHAOS
EXPANSION
........................
106
B.
DERIVATIONS
AND
MATERIAL
CHARACTERIZATION
113
B.I.
DERIVATION
OF
EQ.
(5.14)
...................................................................
113
VI
CONTENTS
B.2.
LTCC
SUBSTRATE
CHARACTERIZATION
..................................................
114
B.2.1.
RING
RESONATOR
METHOD
......................................................
114
B.2.2.
MULTI-LINE
METHOD
...............................................................
116
C.
LOW
TEMPERATURE
COFIRED
CERAMIC
TEST
VEHICLES
119
BIBLIOGRAPHY
125
CURRICULUM
VITAE
139
VII
|
| adam_txt |
CONTENTS
SUMMARY
I
ACKNOWLEDGMENTS
III
LIST
OF
FIGURES
IX
LIST
OF
TABLES
XIII
ACRONYMS
XV
SYMBOLS,
NOTATION,
AND
UNITS
XIX
1.
INTRODUCTION
AND
MOTIVATION
1
1.1.
STATE
OF
THE
ART
.
2
1.1.1.
LOW
TEMPERATURE
COFIRED
CERAMICS
.
2
1.1.2.
FUNCTIONAL
VIA
STRUCTURES
.
4
1.1.3.
VERTICAL
INTEGRATION
.
6
1.2.
CONFERENCES,
JOURNALS,
AND
OTHER
PUBLISHED
WORK
.
8
1.3.
THESIS
OVERVIEW
.
9
2.
FUNCTIONAL
VIAS
AS
QUASI-TRANSMISSION
LINES
11
2.1.
TRANSMISSION
LINE
MODEL
FOR
VIA
STRUCTURES
.
11
2.1.1.
VARIATIONAL
ANALYSIS
WITH
POLYNOMIAL
CHAOS
EXPANSION
15
2.1.2.
IMPEDANCE
STABILITY
AND
LOSSES
OF
FUNCTIONAL
VIAS
.
20
2.1.3.
VIA-TO-STRIPLINE
TRANSITIONS
.
24
2.2.
VIAS
AS
IMPEDANCE
TRANSFORMERS
.
24
2.2.1.
OPEN
AND
SHORTED
VIA
STUBS
.
25
3.
MICROWAVE
FILTERS
USING
FUNCTIONAL
VIAS
29
3.1.
DESIGN
FLOW
FOR
VERTICAL
INTEGRATION
OF
CHEBYSHEV
FILTERS
.
.
.
29
3.2.
LOW-PASS
FILTERS
.
31
3.2.1.
MEASUREMENT
AND
CALIBRATION
SETUP
.
34
3.2.2.
3RD-ORDER
LOW-PASS
FILTER
.
37
3.2.3.
5TH-ORDER
LOW-PASS
FILTER
.
37
V
CONTENTS
3.3.
BAND-PASS
FILTER
.
40
3.3.1.
5TH-ORDER
BAND-PASS
FILTER
.
43
3.4.
FURTHER
REMARKS
ON
VERTICAL
INTEGRATION
.
43
3.4.1.
VERTICAL
INTEGRATION
OF
FILTERS
.
43
3.4.2.
STEPPED
IMPEDANCE
FILTERS
.
46
4.
VERTICALLY
INTEGRATED
HYBRID
COUPLERS
49
4.1.
90
HYBRID
COUPLER
.
49
4.2.
180
HYBRID
COUPLER
.
55
5.
N-WAY
WILKINSON
POWER
DIVIDERS
WITH
VIAS
59
5.1.
IMPLEMENTATION
OF
CONVENTIONAL
N-WAY
DIVIDERS
.
60
5.2.
2
WAY
WILKINSON
POWER
DIVIDER
.
62
5.3.
3
WAY
WILKINSON
POWER
DIVIDER
.
69
5.4.
FURTHER
REMARKS
.
74
5.4.1.
ADVANTAGES
AND
LIMITATIONS
OF
VERTICAL
INTEGRATION
.
75
5.4.2.
DIFFERENT
IMPLEMENTATIONS
OF
N-WAY
DIVIDERS
.
75
6.
VIA
ARRAYS
ON
LOW
TEMPERATURE
COFIRED
CERAMICS
79
6.1.
DESIGN
PROCEDURE
AND
NETWORK
REPRESENTATION
.
80
6.1.1.
NEAR
AND
FAR-END
CROSSTALK
DEFINITIONS
.
81
6.2.
SINGLE-ENDED
SIGNALING
FOR
PASSIVE
MICROWAVE
COMPONENTS
.
.
82
6.2.1.
COMPARING
PHYSICS-BASED
VIA
AND
FULL-WAVE
MODELING
83
6.2.2.
IMPACT
OF
ADDITIONAL
GROUND
VIA
FENCES
.
86
6.3.
DIFFERENTIAL
SIGNALING
FOR
VIA
ARRAYS
IN
HIGH-SPEED
LINKS
.
86
6.3.1.
COMPARING
CERAMIC
AND
ORGANIC
SUBSTRATES
.
88
7.
CONCLUSION
AND
OUTLOOK
91
A.
THEORETICAL
BACKGROUND
95
A.I.
CHEBYSHEV
PROTOTYPE
FILTERS
.
95
A.
2.
TWO-TIER
CALIBRATION
.
95
A.2.1.
THE
THROUGH-REFLECT-LINE
METHOD
.
97
A.
2.2.
THE
DEEMBEDDING
METHOD
.
103
A.
3.
UNCERTAINTY
QUANTIFICATION
AND
POLYNOMIAL
CHAOS
.
104
A.3.1.
GAUSSIAN
DISTRIBUTION
AND
HERMITE
POLYNOMIALS
.
105
A.
3.2.
UNIFORM
DISTRIBUTION
AND
LEGENDRE
POLYNOMIALS
.
105
A.
3.3.
MULTIVARIATE
POLYNOMIAL
CHAOS
EXPANSION
.
106
B.
DERIVATIONS
AND
MATERIAL
CHARACTERIZATION
113
B.I.
DERIVATION
OF
EQ.
(5.14)
.
113
VI
CONTENTS
B.2.
LTCC
SUBSTRATE
CHARACTERIZATION
.
114
B.2.1.
RING
RESONATOR
METHOD
.
114
B.2.2.
MULTI-LINE
METHOD
.
116
C.
LOW
TEMPERATURE
COFIRED
CERAMIC
TEST
VEHICLES
119
BIBLIOGRAPHY
125
CURRICULUM
VITAE
139
VII |
| any_adam_object | 1 |
| any_adam_object_boolean | 1 |
| author | Yildiz, Ömer Faruk 1990- |
| author_GND | (DE-588)128909960X |
| author_facet | Yildiz, Ömer Faruk 1990- |
| author_role | aut |
| author_sort | Yildiz, Ömer Faruk 1990- |
| author_variant | ö f y öf öfy |
| building | Verbundindex |
| bvnumber | BV049099603 |
| classification_rvk | ZN 4500 |
| ctrlnum | (OCoLC)1378699633 (DE-599)DNB1282086820 |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Elektrotechnik / Elektronik / Nachrichtentechnik |
| edition | 1. Auflage |
| format | Thesis Book |
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| genre_facet | Hochschulschrift |
| id | DE-604.BV049099603 |
| illustrated | Illustrated |
| index_date | 2024-07-03T22:32:14Z |
| indexdate | 2024-07-10T09:55:18Z |
| institution | BVB |
| institution_GND | (DE-588)1064118135 |
| isbn | 9783844090024 3844090029 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-034361163 |
| oclc_num | 1378699633 |
| open_access_boolean | |
| owner | DE-83 |
| owner_facet | DE-83 |
| physical | xxi, 139 Seiten Illustrationen, Diagramme 21 cm x 14.8 cm, 245 g |
| publishDate | 2023 |
| publishDateSearch | 2023 |
| publishDateSort | 2023 |
| publisher | Shaker |
| record_format | marc |
| series2 | Berichte aus der Elektrotechnik |
| spelling | Yildiz, Ömer Faruk 1990- Verfasser (DE-588)128909960X aut Functional Via Structures in Passive Microwave Components on Multilayer Ceramic Substrates Ömer Faruk Yildiz 1. Auflage 202304 Düren Shaker 2023 xxi, 139 Seiten Illustrationen, Diagramme 21 cm x 14.8 cm, 245 g txt rdacontent n rdamedia nc rdacarrier Berichte aus der Elektrotechnik Dissertation Technische Universität Hamburg 2022 Mikrowellenbauelement (DE-588)4123765-1 gnd rswk-swf Durchkontaktieren (DE-588)4150891-9 gnd rswk-swf LTCC (DE-588)4737870-0 gnd rswk-swf Microwave Engineering Ceramic Substrates Low Temperature Cofired Ceramics (DE-588)4113937-9 Hochschulschrift gnd-content Mikrowellenbauelement (DE-588)4123765-1 s LTCC (DE-588)4737870-0 s Durchkontaktieren (DE-588)4150891-9 s DE-604 Shaker Verlag (DE-588)1064118135 pbl DNB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=034361163&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis 1\p vlb 20230228 DE-101 https://d-nb.info/provenance/plan#vlb |
| spellingShingle | Yildiz, Ömer Faruk 1990- Functional Via Structures in Passive Microwave Components on Multilayer Ceramic Substrates Mikrowellenbauelement (DE-588)4123765-1 gnd Durchkontaktieren (DE-588)4150891-9 gnd LTCC (DE-588)4737870-0 gnd |
| subject_GND | (DE-588)4123765-1 (DE-588)4150891-9 (DE-588)4737870-0 (DE-588)4113937-9 |
| title | Functional Via Structures in Passive Microwave Components on Multilayer Ceramic Substrates |
| title_auth | Functional Via Structures in Passive Microwave Components on Multilayer Ceramic Substrates |
| title_exact_search | Functional Via Structures in Passive Microwave Components on Multilayer Ceramic Substrates |
| title_exact_search_txtP | Functional Via Structures in Passive Microwave Components on Multilayer Ceramic Substrates |
| title_full | Functional Via Structures in Passive Microwave Components on Multilayer Ceramic Substrates Ömer Faruk Yildiz |
| title_fullStr | Functional Via Structures in Passive Microwave Components on Multilayer Ceramic Substrates Ömer Faruk Yildiz |
| title_full_unstemmed | Functional Via Structures in Passive Microwave Components on Multilayer Ceramic Substrates Ömer Faruk Yildiz |
| title_short | Functional Via Structures in Passive Microwave Components on Multilayer Ceramic Substrates |
| title_sort | functional via structures in passive microwave components on multilayer ceramic substrates |
| topic | Mikrowellenbauelement (DE-588)4123765-1 gnd Durchkontaktieren (DE-588)4150891-9 gnd LTCC (DE-588)4737870-0 gnd |
| topic_facet | Mikrowellenbauelement Durchkontaktieren LTCC Hochschulschrift |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=034361163&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT yildizomerfaruk functionalviastructuresinpassivemicrowavecomponentsonmultilayerceramicsubstrates AT shakerverlag functionalviastructuresinpassivemicrowavecomponentsonmultilayerceramicsubstrates |