Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology: Design and Simulation
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| Main Authors: | , |
|---|---|
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Singapore
Springer Nature Singapore
2023
Singapore Springer |
| Edition: | 1st ed. 2023 |
| Subjects: | |
| Online Access: | BTU01 FAB01 FAW01 FCO01 FHA01 FHD01 FHI01 FHM01 FHN01 FHR01 FKE01 FLA01 FRO01 FWS01 FWS02 HTW01 TUM01 UBY01 UER01 Volltext |
| Physical Description: | 1 Online-Ressource (XV, 311 p. 693 illus., 7 illus. in color) |
| ISBN: | 9789819914555 |
| DOI: | 10.1007/978-981-99-1455-5 |
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| author | Wu, Yongle Wang, Weimin |
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| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.3 |
| dewey-search | 621.3 |
| dewey-sort | 3621.3 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik Maschinenbau |
| discipline_str_mv | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik Maschinenbau |
| doi_str_mv | 10.1007/978-981-99-1455-5 |
| edition | 1st ed. 2023 |
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| illustrated | Not Illustrated |
| index_date | 2024-07-03T22:17:10Z |
| indexdate | 2025-02-20T06:40:07Z |
| institution | BVB |
| isbn | 9789819914555 |
| language | English |
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| oclc_num | 1389182512 |
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| owner | DE-1043 DE-860 DE-91 DE-BY-TUM DE-858 DE-1046 DE-Aug4 DE-898 DE-BY-UBR DE-861 DE-523 DE-859 DE-29 DE-863 DE-BY-FWS DE-1050 DE-862 DE-BY-FWS DE-92 DE-573 DE-M347 DE-706 DE-634 |
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| physical | 1 Online-Ressource (XV, 311 p. 693 illus., 7 illus. in color) |
| psigel | ZDB-2-ENG ZDB-2-ENG_2023 |
| publishDate | 2023 |
| publishDateSearch | 2023 |
| publishDateSort | 2023 |
| publisher | Springer Nature Singapore Springer |
| record_format | marc |
| spellingShingle | Wu, Yongle Wang, Weimin Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation Microwaves, RF Engineering and Optical Communications Electronics and Microelectronics, Instrumentation Electronic Circuits and Systems Telecommunication Electronics Electronic circuits |
| title | Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation |
| title_auth | Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation |
| title_exact_search | Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation |
| title_exact_search_txtP | Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation |
| title_full | Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation by Yongle Wu, Weimin Wang |
| title_fullStr | Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation by Yongle Wu, Weimin Wang |
| title_full_unstemmed | Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation by Yongle Wu, Weimin Wang |
| title_short | Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology |
| title_sort | microwave and millimeter wave chips based on thin film integrated passive device technology design and simulation |
| title_sub | Design and Simulation |
| topic | Microwaves, RF Engineering and Optical Communications Electronics and Microelectronics, Instrumentation Electronic Circuits and Systems Telecommunication Electronics Electronic circuits |
| topic_facet | Microwaves, RF Engineering and Optical Communications Electronics and Microelectronics, Instrumentation Electronic Circuits and Systems Telecommunication Electronics Electronic circuits |
| url | https://doi.org/10.1007/978-981-99-1455-5 |
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