Antenna-in-package technology and applications:
Antennas for AiP technology / Yueping Zhang -- Package technologies / Dr Ning Ye -- Electrical, mechanical, and thermal co-design / Xiaoxiong Gu and Pritish R Parida.
Gespeichert in:
| Weitere Verfasser: | , |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Hoboken, New Jersey
Wiley-IEEE Press
[2020]
|
| Ausgabe: | First edition |
| Schlagworte: | |
| Online-Zugang: | FHI01 |
| Zusammenfassung: | Antennas for AiP technology / Yueping Zhang -- Package technologies / Dr Ning Ye -- Electrical, mechanical, and thermal co-design / Xiaoxiong Gu and Pritish R Parida. "This book starts with some historical notes about how AiP technology has evolved as we know it today. Then, the authors consider antennas and packages, thermal analysis and design, and measurement setups and methods for AiP technology. The authors show that the choice of antennas is usually given to those popular antennas that can be easily designed for the applications; the choice of packages is a trade-off among constraints such as electrical performance, thermo-mechanical reliability, compactness, manufacturability and cost; the choice of interconnects is governed by JEDEC for automatic assembly. Next, the book describes respectively low-temperature co-fired ceramic (LTCC), high-density interconnects (HDI), fan-out wafer level packaging (FOWLP) based AiP, and 3D-printing-based AiP. After that, the authors discuss in details the surface laminar circuit (SLC) based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Finally, the book touches on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications"-- |
| Beschreibung: | Includes bibliographical references and index |
| Beschreibung: | 1 Online-Ressource (xxv, 390 Seiten) |
| ISBN: | 9781119556640 |
Internformat
MARC
| LEADER | 00000nmm a2200000 c 4500 | ||
|---|---|---|---|
| 001 | BV049011446 | ||
| 003 | DE-604 | ||
| 005 | 20230626 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 230620s2020 xxu|||| o||u| ||||||eng d | ||
| 020 | |a 9781119556640 |9 978-1-119-55664-0 | ||
| 035 | |a (OCoLC)1385290014 | ||
| 035 | |a (DE-599)KXP1736861808 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 044 | |a xxu |c XD-US | ||
| 049 | |a DE-573 | ||
| 082 | 0 | |a 621.382/4 | |
| 245 | 1 | 0 | |a Antenna-in-package technology and applications |c edited by Duixian Liu (IBM Thomas J. Watson Research Center, New York, USA), Yueping Zhang (School of Electrical and Electronic Engineering Nanyang Technological University, Singapore) |
| 250 | |a First edition | ||
| 264 | 1 | |a Hoboken, New Jersey |b Wiley-IEEE Press |c [2020] | |
| 300 | |a 1 Online-Ressource (xxv, 390 Seiten) | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 500 | |a Includes bibliographical references and index | ||
| 520 | 3 | |a Antennas for AiP technology / Yueping Zhang -- Package technologies / Dr Ning Ye -- Electrical, mechanical, and thermal co-design / Xiaoxiong Gu and Pritish R Parida. | |
| 520 | 3 | |a "This book starts with some historical notes about how AiP technology has evolved as we know it today. Then, the authors consider antennas and packages, thermal analysis and design, and measurement setups and methods for AiP technology. The authors show that the choice of antennas is usually given to those popular antennas that can be easily designed for the applications; the choice of packages is a trade-off among constraints such as electrical performance, thermo-mechanical reliability, compactness, manufacturability and cost; the choice of interconnects is governed by JEDEC for automatic assembly. Next, the book describes respectively low-temperature co-fired ceramic (LTCC), high-density interconnects (HDI), fan-out wafer level packaging (FOWLP) based AiP, and 3D-printing-based AiP. After that, the authors discuss in details the surface laminar circuit (SLC) based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Finally, the book touches on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications"-- | |
| 650 | 0 | 7 | |a Antenne |0 (DE-588)4002210-9 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Gehäuse |0 (DE-588)4156307-4 |2 gnd |9 rswk-swf |
| 653 | 0 | |a Microstrip antennas | |
| 653 | 0 | |a Microelectronic packaging | |
| 653 | 0 | |a Electronic books | |
| 689 | 0 | 0 | |a Antenne |0 (DE-588)4002210-9 |D s |
| 689 | 0 | 1 | |a Gehäuse |0 (DE-588)4156307-4 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Liu, Duixian |4 edt | |
| 700 | 1 | |a Zhang, Yueping |4 edt | |
| 912 | |a ZDB-35-WEL | ||
| 999 | |a oai:aleph.bib-bvb.de:BVB01-034274492 | ||
| 966 | e | |u https://ieeexplore.ieee.org/servlet/opac?bknumber=9063370 |l FHI01 |p ZDB-35-WEL |x Aggregator |3 Volltext | |
Datensatz im Suchindex
| _version_ | 1804185281824292864 |
|---|---|
| adam_txt | |
| any_adam_object | |
| any_adam_object_boolean | |
| author2 | Liu, Duixian Zhang, Yueping |
| author2_role | edt edt |
| author2_variant | d l dl y z yz |
| author_facet | Liu, Duixian Zhang, Yueping |
| building | Verbundindex |
| bvnumber | BV049011446 |
| collection | ZDB-35-WEL |
| ctrlnum | (OCoLC)1385290014 (DE-599)KXP1736861808 |
| dewey-full | 621.382/4 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.382/4 |
| dewey-search | 621.382/4 |
| dewey-sort | 3621.382 14 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Elektrotechnik / Elektronik / Nachrichtentechnik |
| edition | First edition |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02872nmm a2200457 c 4500</leader><controlfield tag="001">BV049011446</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20230626 </controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">230620s2020 xxu|||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781119556640</subfield><subfield code="9">978-1-119-55664-0</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1385290014</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)KXP1736861808</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="044" ind1=" " ind2=" "><subfield code="a">xxu</subfield><subfield code="c">XD-US</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-573</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.382/4</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Antenna-in-package technology and applications</subfield><subfield code="c">edited by Duixian Liu (IBM Thomas J. Watson Research Center, New York, USA), Yueping Zhang (School of Electrical and Electronic Engineering Nanyang Technological University, Singapore)</subfield></datafield><datafield tag="250" ind1=" " ind2=" "><subfield code="a">First edition</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Hoboken, New Jersey</subfield><subfield code="b">Wiley-IEEE Press</subfield><subfield code="c">[2020]</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource (xxv, 390 Seiten)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references and index</subfield></datafield><datafield tag="520" ind1="3" ind2=" "><subfield code="a">Antennas for AiP technology / Yueping Zhang -- Package technologies / Dr Ning Ye -- Electrical, mechanical, and thermal co-design / Xiaoxiong Gu and Pritish R Parida.</subfield></datafield><datafield tag="520" ind1="3" ind2=" "><subfield code="a">"This book starts with some historical notes about how AiP technology has evolved as we know it today. Then, the authors consider antennas and packages, thermal analysis and design, and measurement setups and methods for AiP technology. The authors show that the choice of antennas is usually given to those popular antennas that can be easily designed for the applications; the choice of packages is a trade-off among constraints such as electrical performance, thermo-mechanical reliability, compactness, manufacturability and cost; the choice of interconnects is governed by JEDEC for automatic assembly. Next, the book describes respectively low-temperature co-fired ceramic (LTCC), high-density interconnects (HDI), fan-out wafer level packaging (FOWLP) based AiP, and 3D-printing-based AiP. After that, the authors discuss in details the surface laminar circuit (SLC) based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Finally, the book touches on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications"--</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Antenne</subfield><subfield code="0">(DE-588)4002210-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Gehäuse</subfield><subfield code="0">(DE-588)4156307-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Microstrip antennas</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Microelectronic packaging</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Electronic books</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Antenne</subfield><subfield code="0">(DE-588)4002210-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Gehäuse</subfield><subfield code="0">(DE-588)4156307-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Liu, Duixian</subfield><subfield code="4">edt</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Zhang, Yueping</subfield><subfield code="4">edt</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-35-WEL</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-034274492</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://ieeexplore.ieee.org/servlet/opac?bknumber=9063370</subfield><subfield code="l">FHI01</subfield><subfield code="p">ZDB-35-WEL</subfield><subfield code="x">Aggregator</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| id | DE-604.BV049011446 |
| illustrated | Not Illustrated |
| index_date | 2024-07-03T22:11:45Z |
| indexdate | 2024-07-10T09:52:45Z |
| institution | BVB |
| isbn | 9781119556640 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-034274492 |
| oclc_num | 1385290014 |
| open_access_boolean | |
| owner | DE-573 |
| owner_facet | DE-573 |
| physical | 1 Online-Ressource (xxv, 390 Seiten) |
| psigel | ZDB-35-WEL |
| publishDate | 2020 |
| publishDateSearch | 2020 |
| publishDateSort | 2020 |
| publisher | Wiley-IEEE Press |
| record_format | marc |
| spelling | Antenna-in-package technology and applications edited by Duixian Liu (IBM Thomas J. Watson Research Center, New York, USA), Yueping Zhang (School of Electrical and Electronic Engineering Nanyang Technological University, Singapore) First edition Hoboken, New Jersey Wiley-IEEE Press [2020] 1 Online-Ressource (xxv, 390 Seiten) txt rdacontent c rdamedia cr rdacarrier Includes bibliographical references and index Antennas for AiP technology / Yueping Zhang -- Package technologies / Dr Ning Ye -- Electrical, mechanical, and thermal co-design / Xiaoxiong Gu and Pritish R Parida. "This book starts with some historical notes about how AiP technology has evolved as we know it today. Then, the authors consider antennas and packages, thermal analysis and design, and measurement setups and methods for AiP technology. The authors show that the choice of antennas is usually given to those popular antennas that can be easily designed for the applications; the choice of packages is a trade-off among constraints such as electrical performance, thermo-mechanical reliability, compactness, manufacturability and cost; the choice of interconnects is governed by JEDEC for automatic assembly. Next, the book describes respectively low-temperature co-fired ceramic (LTCC), high-density interconnects (HDI), fan-out wafer level packaging (FOWLP) based AiP, and 3D-printing-based AiP. After that, the authors discuss in details the surface laminar circuit (SLC) based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Finally, the book touches on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications"-- Antenne (DE-588)4002210-9 gnd rswk-swf Gehäuse (DE-588)4156307-4 gnd rswk-swf Microstrip antennas Microelectronic packaging Electronic books Antenne (DE-588)4002210-9 s Gehäuse (DE-588)4156307-4 s DE-604 Liu, Duixian edt Zhang, Yueping edt |
| spellingShingle | Antenna-in-package technology and applications Antenne (DE-588)4002210-9 gnd Gehäuse (DE-588)4156307-4 gnd |
| subject_GND | (DE-588)4002210-9 (DE-588)4156307-4 |
| title | Antenna-in-package technology and applications |
| title_auth | Antenna-in-package technology and applications |
| title_exact_search | Antenna-in-package technology and applications |
| title_exact_search_txtP | Antenna-in-package technology and applications |
| title_full | Antenna-in-package technology and applications edited by Duixian Liu (IBM Thomas J. Watson Research Center, New York, USA), Yueping Zhang (School of Electrical and Electronic Engineering Nanyang Technological University, Singapore) |
| title_fullStr | Antenna-in-package technology and applications edited by Duixian Liu (IBM Thomas J. Watson Research Center, New York, USA), Yueping Zhang (School of Electrical and Electronic Engineering Nanyang Technological University, Singapore) |
| title_full_unstemmed | Antenna-in-package technology and applications edited by Duixian Liu (IBM Thomas J. Watson Research Center, New York, USA), Yueping Zhang (School of Electrical and Electronic Engineering Nanyang Technological University, Singapore) |
| title_short | Antenna-in-package technology and applications |
| title_sort | antenna in package technology and applications |
| topic | Antenne (DE-588)4002210-9 gnd Gehäuse (DE-588)4156307-4 gnd |
| topic_facet | Antenne Gehäuse |
| work_keys_str_mv | AT liuduixian antennainpackagetechnologyandapplications AT zhangyueping antennainpackagetechnologyandapplications |