Chiplet Design and Heterogeneous Integration Packaging:
Saved in:
| Main Author: | |
|---|---|
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Singapore
Springer Nature Singapore
2023
Singapore Springer |
| Edition: | 1st ed. 2023 |
| Subjects: | |
| Online Access: | BTU01 FAB01 FAW01 FCO01 FHA01 FHD01 FHI01 FHM01 FHN01 FHR01 FKE01 FLA01 FRO01 FWS01 FWS02 HTW01 TUM01 UBY01 UER01 Volltext |
| Physical Description: | 1 Online-Ressource (XXII, 525 p. 543 illus., 501 illus. in color) |
| ISBN: | 9789811999178 |
| DOI: | 10.1007/978-981-19-9917-8 |
Staff View
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Record in the Search Index
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| discipline | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik Maschinenbau |
| discipline_str_mv | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik Maschinenbau |
| doi_str_mv | 10.1007/978-981-19-9917-8 |
| edition | 1st ed. 2023 |
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| index_date | 2024-07-03T21:47:16Z |
| indexdate | 2025-02-20T06:39:45Z |
| institution | BVB |
| isbn | 9789811999178 |
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| physical | 1 Online-Ressource (XXII, 525 p. 543 illus., 501 illus. in color) |
| psigel | ZDB-2-ENG ZDB-2-ENG_2023 |
| publishDate | 2023 |
| publishDateSearch | 2023 |
| publishDateSort | 2023 |
| publisher | Springer Nature Singapore Springer |
| record_format | marc |
| spellingShingle | Lau, John H. Chiplet Design and Heterogeneous Integration Packaging Electronics and Microelectronics, Instrumentation Electronic Circuits and Systems Microsystems and MEMS. Electronics Electronic circuits Microtechnology Microelectromechanical systems |
| title | Chiplet Design and Heterogeneous Integration Packaging |
| title_auth | Chiplet Design and Heterogeneous Integration Packaging |
| title_exact_search | Chiplet Design and Heterogeneous Integration Packaging |
| title_exact_search_txtP | Chiplet Design and Heterogeneous Integration Packaging |
| title_full | Chiplet Design and Heterogeneous Integration Packaging by John H. Lau |
| title_fullStr | Chiplet Design and Heterogeneous Integration Packaging by John H. Lau |
| title_full_unstemmed | Chiplet Design and Heterogeneous Integration Packaging by John H. Lau |
| title_short | Chiplet Design and Heterogeneous Integration Packaging |
| title_sort | chiplet design and heterogeneous integration packaging |
| topic | Electronics and Microelectronics, Instrumentation Electronic Circuits and Systems Microsystems and MEMS. Electronics Electronic circuits Microtechnology Microelectromechanical systems |
| topic_facet | Electronics and Microelectronics, Instrumentation Electronic Circuits and Systems Microsystems and MEMS. Electronics Electronic circuits Microtechnology Microelectromechanical systems |
| url | https://doi.org/10.1007/978-981-19-9917-8 |
| work_keys_str_mv | AT laujohnh chipletdesignandheterogeneousintegrationpackaging |