APA-Zitierstil (7. Ausg.)

Lau, J. H. (2023). Chiplet Design and Heterogeneous Integration Packaging (1st ed. 2023.). Springer Nature Singapore. https://doi.org/10.1007/978-981-19-9917-8

Chicago-Zitierstil (17. Ausg.)

Lau, John H. Chiplet Design and Heterogeneous Integration Packaging. 1st ed. 2023. Singapore: Springer Nature Singapore, 2023. https://doi.org/10.1007/978-981-19-9917-8.

MLA-Zitierstil (9. Ausg.)

Lau, John H. Chiplet Design and Heterogeneous Integration Packaging. 1st ed. 2023. Springer Nature Singapore, 2023. https://doi.org/10.1007/978-981-19-9917-8.