Enhanced process development by simulation of ultrasonic heavy wire bonding:
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis Book |
| Language: | English |
| Published: |
Düren
Shaker Verlag
2022
|
| Series: | Schriften des Lehrstuhls für Dynamik und Mechatronik
Band 13 |
| Subjects: | |
| Online Access: | Inhaltsverzeichnis Inhaltsverzeichnis |
| Physical Description: | xiii, 154 Seiten Illustrationen, Diagramme |
| ISBN: | 9783844085273 3844085270 |
Staff View
MARC
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| 100 | 1 | |a Schemmel, Reinhard |d 1990- |e Verfasser |0 (DE-588)1269705601 |4 aut | |
| 245 | 1 | 0 | |a Enhanced process development by simulation of ultrasonic heavy wire bonding |c Reinhard Schemmel |
| 264 | 1 | |a Düren |b Shaker Verlag |c 2022 | |
| 300 | |a xiii, 154 Seiten |b Illustrationen, Diagramme | ||
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| 338 | |b nc |2 rdacarrier | ||
| 490 | 1 | |a Schriften des Lehrstuhls für Dynamik und Mechatronik |v Band 13 | |
| 502 | |b Dissertation |c Universität Paderborn |d 2022 | ||
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| 653 | |a ultrasonic thick wire bonding | ||
| 653 | |a bond formation | ||
| 653 | |a ultrasonic softening effect | ||
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Record in the Search Index
| _version_ | 1804184522303995904 |
|---|---|
| adam_text | CONTENTS
NOMENCLATURE
XIII
1
INTRODUCTION
1
1.1
OBJECTIVES
.................................................................................................
3
1.2
THESIS
OUTLINE
...........................................................................................
4
2
STATE
OF
THE
ART
7
2.1
PHENOMENOLOGICAL
DESCRIPTION
OF
THE
BOND
FORMATION
PROCESS
.................
7
2.2
FACTORS
AFFECTING
BOND
QUALITY
.................................................................
9
2.3
EQUIPMENT
AND
METHODS
OF
PROCESS
DEVELOPMENT
IN
HEAVY
WIRE
BONDING
.
21
2.4
MODELLING
AND
SIMULATION
OF
THE
WIRE
BOND
PROCESS
..................................
25
2.5
KNOWLEDGE
GAP
IN
ULTRASONIC
HEAVY
WIRE
BONDING
.....................................
28
3
ULTRASONIC
HEAVY
WIRE
BONDING
EXPERIMENTS
31
3.1
IMPACT
OF
THE
TOUCHDOWN
FORCE
..................................................................
31
3.2
DESIGN
OF
EXPERIMENT
................................................................................
34
3.3
IMPACT
OF
SUBSTRUCTURE
RESONANCES
AND
BOND
FREQUENCY
..........................
53
4
MULTI
SCALE
MODEL
OF
THE
HEAVY
WIRE
BOND
PROCESS
63
4.1
MODEL
SETUP
..............................................................................................
63
4.2
PROGRAM
STRUCTURE
.....................................................................................
79
5
MODEL
PARAMETER
IDENTIFICATION
85
5.1
TEST
RIG
FOR
LOW
FREQUENCY
WIRE
BONDING
EXPERIMENTS
...............................
85
5.2
COEFFICIENTS
OF
FRICTION
BETWEEN
TOOL,
WIRE
AND
SUBSTRATE
..........................
87
5.3
BOND
FORMATION
MODEL
PARAMETERS
............................................................
90
5.4
MATERIAL
BEHAVIOUR
OF
THE
BOND
WIRE
UNDER
STATIC
AND
ULTRASONIC
LOAD
...
92
5.5
SHEAR
STRENGTH
OF
THE
BOND
WIRE
..................................................................
102
5.6
TANGENTIAL
WIRE
STIFFNESS
.............................................................................
105
5.7
OVERVIEW
OF
THE
MODEL
PARAMETERS
............................................................
106
6
VALIDATION
OF
THE
WIRE
BOND
MODEL
109
6.1
SETUP
FOR
THE
SIMULATION
.............................................................................
109
6.2
SIMULATION
OF
THE
PARAMETER
STUDIES
............................................................
109
6.3
ADDITIONAL
SIMULATION
RESULTS
........................................................................
115
6.4
INTERPRETATION
OF
THE
SIMULATION
RESULTS
.......................................................
119
7
CONCLUSION
AND
SUGGESTED
FUTURE
WORK
123
REFERENCE
125
A
APPENDIX
137
A.1
ADDITIONAL
SHEAR
CODES
FROM
THE
WIRE
BONDING
EXPERIMENTS
..............
137
A.2
MATERIAL
PROPERTIES
FOR
THE
MODAL
ANALYSIS
OF
THE
SUBSTRATE
MODEL
......
139
A.3
PROGRAM
STRUCTURE
FOR
HIGH
PERFORMANCE
COMPUTING
..........................
140
A.4
HIGH
PERFORMANCE
COMPUTING
RESULTS
.................................................
141
A.
5
LITERATURE
VALUES
FOR
THE
MATERIAL
PARAMETERS
OF
ALUMINIUM
AN
COPPER
..
143
A.6
CONTROL
SYSTEM
OF
THE
TEST
RIG
FOR
IDENTIFICATION
OF
THE
MODEL
PARAMETERS
.
144
A.7
COMPARISON
BETWEEN
SIMULATED
AND
MEASURED
SHEAR
FORCE
VALUES
FOR
BOND
MODEL
PARAMETER
IDENTIFICATION
....................................................
146
A.8
COMPARISON
BETWEEN
SIMULATED
AND
MEASURED
TOOL
SUBSTRATE
CONTACTS
.
147
|
| adam_txt |
CONTENTS
NOMENCLATURE
XIII
1
INTRODUCTION
1
1.1
OBJECTIVES
.
3
1.2
THESIS
OUTLINE
.
4
2
STATE
OF
THE
ART
7
2.1
PHENOMENOLOGICAL
DESCRIPTION
OF
THE
BOND
FORMATION
PROCESS
.
7
2.2
FACTORS
AFFECTING
BOND
QUALITY
.
9
2.3
EQUIPMENT
AND
METHODS
OF
PROCESS
DEVELOPMENT
IN
HEAVY
WIRE
BONDING
.
21
2.4
MODELLING
AND
SIMULATION
OF
THE
WIRE
BOND
PROCESS
.
25
2.5
KNOWLEDGE
GAP
IN
ULTRASONIC
HEAVY
WIRE
BONDING
.
28
3
ULTRASONIC
HEAVY
WIRE
BONDING
EXPERIMENTS
31
3.1
IMPACT
OF
THE
TOUCHDOWN
FORCE
.
31
3.2
DESIGN
OF
EXPERIMENT
.
34
3.3
IMPACT
OF
SUBSTRUCTURE
RESONANCES
AND
BOND
FREQUENCY
.
53
4
MULTI
SCALE
MODEL
OF
THE
HEAVY
WIRE
BOND
PROCESS
63
4.1
MODEL
SETUP
.
63
4.2
PROGRAM
STRUCTURE
.
79
5
MODEL
PARAMETER
IDENTIFICATION
85
5.1
TEST
RIG
FOR
LOW
FREQUENCY
WIRE
BONDING
EXPERIMENTS
.
85
5.2
COEFFICIENTS
OF
FRICTION
BETWEEN
TOOL,
WIRE
AND
SUBSTRATE
.
87
5.3
BOND
FORMATION
MODEL
PARAMETERS
.
90
5.4
MATERIAL
BEHAVIOUR
OF
THE
BOND
WIRE
UNDER
STATIC
AND
ULTRASONIC
LOAD
.
92
5.5
SHEAR
STRENGTH
OF
THE
BOND
WIRE
.
102
5.6
TANGENTIAL
WIRE
STIFFNESS
.
105
5.7
OVERVIEW
OF
THE
MODEL
PARAMETERS
.
106
6
VALIDATION
OF
THE
WIRE
BOND
MODEL
109
6.1
SETUP
FOR
THE
SIMULATION
.
109
6.2
SIMULATION
OF
THE
PARAMETER
STUDIES
.
109
6.3
ADDITIONAL
SIMULATION
RESULTS
.
115
6.4
INTERPRETATION
OF
THE
SIMULATION
RESULTS
.
119
7
CONCLUSION
AND
SUGGESTED
FUTURE
WORK
123
REFERENCE
125
A
APPENDIX
137
A.1
ADDITIONAL
SHEAR
CODES
FROM
THE
WIRE
BONDING
EXPERIMENTS
.
137
A.2
MATERIAL
PROPERTIES
FOR
THE
MODAL
ANALYSIS
OF
THE
SUBSTRATE
MODEL
.
139
A.3
PROGRAM
STRUCTURE
FOR
HIGH
PERFORMANCE
COMPUTING
.
140
A.4
HIGH
PERFORMANCE
COMPUTING
RESULTS
.
141
A.
5
LITERATURE
VALUES
FOR
THE
MATERIAL
PARAMETERS
OF
ALUMINIUM
AN
COPPER
.
143
A.6
CONTROL
SYSTEM
OF
THE
TEST
RIG
FOR
IDENTIFICATION
OF
THE
MODEL
PARAMETERS
.
144
A.7
COMPARISON
BETWEEN
SIMULATED
AND
MEASURED
SHEAR
FORCE
VALUES
FOR
BOND
MODEL
PARAMETER
IDENTIFICATION
.
146
A.8
COMPARISON
BETWEEN
SIMULATED
AND
MEASURED
TOOL
SUBSTRATE
CONTACTS
.
147 |
| any_adam_object | 1 |
| any_adam_object_boolean | 1 |
| author | Schemmel, Reinhard 1990- |
| author_GND | (DE-588)1269705601 |
| author_facet | Schemmel, Reinhard 1990- |
| author_role | aut |
| author_sort | Schemmel, Reinhard 1990- |
| author_variant | r s rs |
| building | Verbundindex |
| bvnumber | BV048529768 |
| classification_rvk | ZN 4192 |
| ctrlnum | (OCoLC)1348181437 (DE-599)DNB1253095779 |
| dewey-full | 621.381046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381046 |
| dewey-search | 621.381046 |
| dewey-sort | 3621.381046 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Thesis Book |
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| genre | (DE-588)4113937-9 Hochschulschrift gnd-content |
| genre_facet | Hochschulschrift |
| id | DE-604.BV048529768 |
| illustrated | Illustrated |
| index_date | 2024-07-03T20:52:01Z |
| indexdate | 2024-07-10T09:40:40Z |
| institution | BVB |
| institution_GND | (DE-588)1064118135 |
| isbn | 9783844085273 3844085270 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-033906508 |
| oclc_num | 1348181437 |
| open_access_boolean | |
| owner | DE-83 |
| owner_facet | DE-83 |
| physical | xiii, 154 Seiten Illustrationen, Diagramme |
| publishDate | 2022 |
| publishDateSearch | 2022 |
| publishDateSort | 2022 |
| publisher | Shaker Verlag |
| record_format | marc |
| series | Schriften des Lehrstuhls für Dynamik und Mechatronik |
| series2 | Schriften des Lehrstuhls für Dynamik und Mechatronik |
| spelling | Schemmel, Reinhard 1990- Verfasser (DE-588)1269705601 aut Enhanced process development by simulation of ultrasonic heavy wire bonding Reinhard Schemmel Düren Shaker Verlag 2022 xiii, 154 Seiten Illustrationen, Diagramme txt rdacontent n rdamedia nc rdacarrier Schriften des Lehrstuhls für Dynamik und Mechatronik Band 13 Dissertation Universität Paderborn 2022 Kupferdraht (DE-588)4166101-1 gnd rswk-swf Experimentelle Prozessanalyse (DE-588)4219265-1 gnd rswk-swf Aluminiumdraht (DE-588)1045802050 gnd rswk-swf Ultraschallbonden (DE-588)1045772771 gnd rswk-swf Prozesssimulation (DE-588)4176077-3 gnd rswk-swf Prozessmodell (DE-588)4237203-3 gnd rswk-swf ultrasonic thick wire bonding bond formation ultrasonic softening effect (DE-588)4113937-9 Hochschulschrift gnd-content Aluminiumdraht (DE-588)1045802050 s Kupferdraht (DE-588)4166101-1 s Ultraschallbonden (DE-588)1045772771 s Experimentelle Prozessanalyse (DE-588)4219265-1 s Prozesssimulation (DE-588)4176077-3 s Prozessmodell (DE-588)4237203-3 s DE-604 Shaker Verlag (DE-588)1064118135 pbl Schriften des Lehrstuhls für Dynamik und Mechatronik Band 13 (DE-604)BV041986754 13 B:DE-101 application/pdf https://d-nb.info/1253095779/04 Inhaltsverzeichnis DNB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=033906508&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis 1\p dnb 20221011 DE-101 https://d-nb.info/provenance/plan#dnb |
| spellingShingle | Schemmel, Reinhard 1990- Enhanced process development by simulation of ultrasonic heavy wire bonding Schriften des Lehrstuhls für Dynamik und Mechatronik Kupferdraht (DE-588)4166101-1 gnd Experimentelle Prozessanalyse (DE-588)4219265-1 gnd Aluminiumdraht (DE-588)1045802050 gnd Ultraschallbonden (DE-588)1045772771 gnd Prozesssimulation (DE-588)4176077-3 gnd Prozessmodell (DE-588)4237203-3 gnd |
| subject_GND | (DE-588)4166101-1 (DE-588)4219265-1 (DE-588)1045802050 (DE-588)1045772771 (DE-588)4176077-3 (DE-588)4237203-3 (DE-588)4113937-9 |
| title | Enhanced process development by simulation of ultrasonic heavy wire bonding |
| title_auth | Enhanced process development by simulation of ultrasonic heavy wire bonding |
| title_exact_search | Enhanced process development by simulation of ultrasonic heavy wire bonding |
| title_exact_search_txtP | Enhanced process development by simulation of ultrasonic heavy wire bonding |
| title_full | Enhanced process development by simulation of ultrasonic heavy wire bonding Reinhard Schemmel |
| title_fullStr | Enhanced process development by simulation of ultrasonic heavy wire bonding Reinhard Schemmel |
| title_full_unstemmed | Enhanced process development by simulation of ultrasonic heavy wire bonding Reinhard Schemmel |
| title_short | Enhanced process development by simulation of ultrasonic heavy wire bonding |
| title_sort | enhanced process development by simulation of ultrasonic heavy wire bonding |
| topic | Kupferdraht (DE-588)4166101-1 gnd Experimentelle Prozessanalyse (DE-588)4219265-1 gnd Aluminiumdraht (DE-588)1045802050 gnd Ultraschallbonden (DE-588)1045772771 gnd Prozesssimulation (DE-588)4176077-3 gnd Prozessmodell (DE-588)4237203-3 gnd |
| topic_facet | Kupferdraht Experimentelle Prozessanalyse Aluminiumdraht Ultraschallbonden Prozesssimulation Prozessmodell Hochschulschrift |
| url | https://d-nb.info/1253095779/04 http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=033906508&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| volume_link | (DE-604)BV041986754 |
| work_keys_str_mv | AT schemmelreinhard enhancedprocessdevelopmentbysimulationofultrasonicheavywirebonding AT shakerverlag enhancedprocessdevelopmentbysimulationofultrasonicheavywirebonding |
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