APA (7th ed.) Citation

Schemmel, R. (2022). Enhanced process development by simulation of ultrasonic heavy wire bonding. Shaker Verlag.

Chicago Style (17th ed.) Citation

Schemmel, Reinhard. Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding. Düren: Shaker Verlag, 2022.

MLA (9th ed.) Citation

Schemmel, Reinhard. Enhanced Process Development by Simulation of Ultrasonic Heavy Wire Bonding. Shaker Verlag, 2022.