Advanced liquid metal cooling for chip, device and system:
"This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category--liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique sci...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | English Chinese |
| Veröffentlicht: |
New Jersey ; London ; Singapore ; Beijing ; Shanghai ; Hong Kong ; Taipei ; Chennai ; Tokyo
World Scientific
2022
|
| Schlagworte: | |
| Zusammenfassung: | "This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category--liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system. With both uniquely important fundamental and practical values, this useful reference text benefits researchers to set up their foundation and then find new ways of making advanced cooling system to fulfil the increasingly urgent needs in modern highly integrated chip industry"-- |
| Beschreibung: | Includes bibliographical references and index |
| Beschreibung: | xxxiv, 926 Seiten Illustrationen, Diagramme |
| ISBN: | 9789811245855 |
Internformat
MARC
| LEADER | 00000nam a2200000 c 4500 | ||
|---|---|---|---|
| 001 | BV048520757 | ||
| 003 | DE-604 | ||
| 005 | 20230201 | ||
| 007 | t | ||
| 008 | 221019s2022 cc a||| |||| 00||| eng d | ||
| 020 | |a 9789811245855 |c hardcover |9 978-981-12-4585-5 | ||
| 035 | |a (OCoLC)1369563698 | ||
| 035 | |a (DE-599)KXP177885267X | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 1 | |a eng |h chi | |
| 044 | |a cc |c XB-CN |a si |c XB-SG |a xxu |c XD-US |a xxk |c XA-GB | ||
| 049 | |a DE-83 | ||
| 082 | 0 | |a 621.381 | |
| 084 | |a ZN 4070 |0 (DE-625)157347: |2 rvk | ||
| 100 | 1 | |a Liu, Jing |d 1969- |e Verfasser |0 (DE-588)1269518801 |4 aut | |
| 240 | 1 | 0 | |a Mian-xiang xin-pian, qi-jian yu xi-tong-de xian-jin ye-tai jin-shu leng-que |
| 245 | 1 | 0 | |a Advanced liquid metal cooling for chip, device and system |c Jing Liu (Tsinghua University, China) |
| 264 | 1 | |a New Jersey ; London ; Singapore ; Beijing ; Shanghai ; Hong Kong ; Taipei ; Chennai ; Tokyo |b World Scientific |c 2022 | |
| 300 | |a xxxiv, 926 Seiten |b Illustrationen, Diagramme | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 500 | |a Includes bibliographical references and index | ||
| 520 | 3 | |a "This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category--liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system. With both uniquely important fundamental and practical values, this useful reference text benefits researchers to set up their foundation and then find new ways of making advanced cooling system to fulfil the increasingly urgent needs in modern highly integrated chip industry"-- | |
| 650 | 0 | 7 | |a Kühlung |0 (DE-588)4132435-3 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Kühlmittel |0 (DE-588)4165866-8 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Wärmeaustauscher |0 (DE-588)4064176-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Chip |0 (DE-588)4197163-2 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Thermodynamische Eigenschaft |0 (DE-588)4126056-9 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Flüssigmetall |0 (DE-588)4154731-7 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Abkühlung |0 (DE-588)4279871-1 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Wärmeübergang |0 (DE-588)4188877-7 |2 gnd |9 rswk-swf |
| 653 | 0 | |a Electronic apparatus and appliances / Cooling | |
| 653 | 0 | |a Liquid metal heat transfer | |
| 653 | 0 | |a Liquid metals / Thermal properties | |
| 653 | 0 | |a Thermofluids | |
| 653 | 0 | |a Heat exchangers | |
| 689 | 0 | 0 | |a Chip |0 (DE-588)4197163-2 |D s |
| 689 | 0 | 1 | |a Flüssigmetall |0 (DE-588)4154731-7 |D s |
| 689 | 0 | 2 | |a Kühlmittel |0 (DE-588)4165866-8 |D s |
| 689 | 0 | 3 | |a Abkühlung |0 (DE-588)4279871-1 |D s |
| 689 | 0 | 4 | |a Wärmeübergang |0 (DE-588)4188877-7 |D s |
| 689 | 0 | 5 | |a Thermodynamische Eigenschaft |0 (DE-588)4126056-9 |D s |
| 689 | 0 | |5 DE-604 | |
| 689 | 1 | 0 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |D s |
| 689 | 1 | 1 | |a Kühlung |0 (DE-588)4132435-3 |D s |
| 689 | 1 | 2 | |a Wärmeaustauscher |0 (DE-588)4064176-4 |D s |
| 689 | 1 | |5 (DE-627) | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-033897650 | ||
Datensatz im Suchindex
| _version_ | 1804184507016806400 |
|---|---|
| adam_txt | |
| any_adam_object | |
| any_adam_object_boolean | |
| author | Liu, Jing 1969- |
| author_GND | (DE-588)1269518801 |
| author_facet | Liu, Jing 1969- |
| author_role | aut |
| author_sort | Liu, Jing 1969- |
| author_variant | j l jl |
| building | Verbundindex |
| bvnumber | BV048520757 |
| classification_rvk | ZN 4070 |
| ctrlnum | (OCoLC)1369563698 (DE-599)KXP177885267X |
| dewey-full | 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03257nam a2200625 c 4500</leader><controlfield tag="001">BV048520757</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20230201 </controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">221019s2022 cc a||| |||| 00||| eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9789811245855</subfield><subfield code="c">hardcover</subfield><subfield code="9">978-981-12-4585-5</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1369563698</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)KXP177885267X</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="1" ind2=" "><subfield code="a">eng</subfield><subfield code="h">chi</subfield></datafield><datafield tag="044" ind1=" " ind2=" "><subfield code="a">cc</subfield><subfield code="c">XB-CN</subfield><subfield code="a">si</subfield><subfield code="c">XB-SG</subfield><subfield code="a">xxu</subfield><subfield code="c">XD-US</subfield><subfield code="a">xxk</subfield><subfield code="c">XA-GB</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-83</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4070</subfield><subfield code="0">(DE-625)157347:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Liu, Jing</subfield><subfield code="d">1969-</subfield><subfield code="e">Verfasser</subfield><subfield code="0">(DE-588)1269518801</subfield><subfield code="4">aut</subfield></datafield><datafield tag="240" ind1="1" ind2="0"><subfield code="a">Mian-xiang xin-pian, qi-jian yu xi-tong-de xian-jin ye-tai jin-shu leng-que</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Advanced liquid metal cooling for chip, device and system</subfield><subfield code="c">Jing Liu (Tsinghua University, China)</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">New Jersey ; London ; Singapore ; Beijing ; Shanghai ; Hong Kong ; Taipei ; Chennai ; Tokyo</subfield><subfield code="b">World Scientific</subfield><subfield code="c">2022</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">xxxiv, 926 Seiten</subfield><subfield code="b">Illustrationen, Diagramme</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references and index</subfield></datafield><datafield tag="520" ind1="3" ind2=" "><subfield code="a">"This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category--liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system. With both uniquely important fundamental and practical values, this useful reference text benefits researchers to set up their foundation and then find new ways of making advanced cooling system to fulfil the increasingly urgent needs in modern highly integrated chip industry"--</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Kühlung</subfield><subfield code="0">(DE-588)4132435-3</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Kühlmittel</subfield><subfield code="0">(DE-588)4165866-8</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Wärmeaustauscher</subfield><subfield code="0">(DE-588)4064176-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Elektronisches Bauelement</subfield><subfield code="0">(DE-588)4014360-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Chip</subfield><subfield code="0">(DE-588)4197163-2</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Thermodynamische Eigenschaft</subfield><subfield code="0">(DE-588)4126056-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Flüssigmetall</subfield><subfield code="0">(DE-588)4154731-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Abkühlung</subfield><subfield code="0">(DE-588)4279871-1</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Wärmeübergang</subfield><subfield code="0">(DE-588)4188877-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Electronic apparatus and appliances / Cooling</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Liquid metal heat transfer</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Liquid metals / Thermal properties</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Thermofluids</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Heat exchangers</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Chip</subfield><subfield code="0">(DE-588)4197163-2</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Flüssigmetall</subfield><subfield code="0">(DE-588)4154731-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">Kühlmittel</subfield><subfield code="0">(DE-588)4165866-8</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="3"><subfield code="a">Abkühlung</subfield><subfield code="0">(DE-588)4279871-1</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="4"><subfield code="a">Wärmeübergang</subfield><subfield code="0">(DE-588)4188877-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="5"><subfield code="a">Thermodynamische Eigenschaft</subfield><subfield code="0">(DE-588)4126056-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="1" ind2="0"><subfield code="a">Elektronisches Bauelement</subfield><subfield code="0">(DE-588)4014360-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2="1"><subfield code="a">Kühlung</subfield><subfield code="0">(DE-588)4132435-3</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2="2"><subfield code="a">Wärmeaustauscher</subfield><subfield code="0">(DE-588)4064176-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2=" "><subfield code="5">(DE-627)</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-033897650</subfield></datafield></record></collection> |
| id | DE-604.BV048520757 |
| illustrated | Illustrated |
| index_date | 2024-07-03T20:49:50Z |
| indexdate | 2024-07-10T09:40:26Z |
| institution | BVB |
| isbn | 9789811245855 |
| language | English Chinese |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-033897650 |
| oclc_num | 1369563698 |
| open_access_boolean | |
| owner | DE-83 |
| owner_facet | DE-83 |
| physical | xxxiv, 926 Seiten Illustrationen, Diagramme |
| publishDate | 2022 |
| publishDateSearch | 2022 |
| publishDateSort | 2022 |
| publisher | World Scientific |
| record_format | marc |
| spelling | Liu, Jing 1969- Verfasser (DE-588)1269518801 aut Mian-xiang xin-pian, qi-jian yu xi-tong-de xian-jin ye-tai jin-shu leng-que Advanced liquid metal cooling for chip, device and system Jing Liu (Tsinghua University, China) New Jersey ; London ; Singapore ; Beijing ; Shanghai ; Hong Kong ; Taipei ; Chennai ; Tokyo World Scientific 2022 xxxiv, 926 Seiten Illustrationen, Diagramme txt rdacontent n rdamedia nc rdacarrier Includes bibliographical references and index "This compendium summarizes the core principles and practical applications of a brand-new advanced chip cooling category--liquid metal cooling. It illustrates the science and art of room temperature liquid metal enabled cooling for chip, device and system. The concise volume features unique scientific and practical merits, and clarified intriguing liquid metal coolant or medium behaviors in making new generation powerful cooling system. With both uniquely important fundamental and practical values, this useful reference text benefits researchers to set up their foundation and then find new ways of making advanced cooling system to fulfil the increasingly urgent needs in modern highly integrated chip industry"-- Kühlung (DE-588)4132435-3 gnd rswk-swf Kühlmittel (DE-588)4165866-8 gnd rswk-swf Wärmeaustauscher (DE-588)4064176-4 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Chip (DE-588)4197163-2 gnd rswk-swf Thermodynamische Eigenschaft (DE-588)4126056-9 gnd rswk-swf Flüssigmetall (DE-588)4154731-7 gnd rswk-swf Abkühlung (DE-588)4279871-1 gnd rswk-swf Wärmeübergang (DE-588)4188877-7 gnd rswk-swf Electronic apparatus and appliances / Cooling Liquid metal heat transfer Liquid metals / Thermal properties Thermofluids Heat exchangers Chip (DE-588)4197163-2 s Flüssigmetall (DE-588)4154731-7 s Kühlmittel (DE-588)4165866-8 s Abkühlung (DE-588)4279871-1 s Wärmeübergang (DE-588)4188877-7 s Thermodynamische Eigenschaft (DE-588)4126056-9 s DE-604 Elektronisches Bauelement (DE-588)4014360-0 s Kühlung (DE-588)4132435-3 s Wärmeaustauscher (DE-588)4064176-4 s (DE-627) |
| spellingShingle | Liu, Jing 1969- Advanced liquid metal cooling for chip, device and system Kühlung (DE-588)4132435-3 gnd Kühlmittel (DE-588)4165866-8 gnd Wärmeaustauscher (DE-588)4064176-4 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd Chip (DE-588)4197163-2 gnd Thermodynamische Eigenschaft (DE-588)4126056-9 gnd Flüssigmetall (DE-588)4154731-7 gnd Abkühlung (DE-588)4279871-1 gnd Wärmeübergang (DE-588)4188877-7 gnd |
| subject_GND | (DE-588)4132435-3 (DE-588)4165866-8 (DE-588)4064176-4 (DE-588)4014360-0 (DE-588)4197163-2 (DE-588)4126056-9 (DE-588)4154731-7 (DE-588)4279871-1 (DE-588)4188877-7 |
| title | Advanced liquid metal cooling for chip, device and system |
| title_alt | Mian-xiang xin-pian, qi-jian yu xi-tong-de xian-jin ye-tai jin-shu leng-que |
| title_auth | Advanced liquid metal cooling for chip, device and system |
| title_exact_search | Advanced liquid metal cooling for chip, device and system |
| title_exact_search_txtP | Advanced liquid metal cooling for chip, device and system |
| title_full | Advanced liquid metal cooling for chip, device and system Jing Liu (Tsinghua University, China) |
| title_fullStr | Advanced liquid metal cooling for chip, device and system Jing Liu (Tsinghua University, China) |
| title_full_unstemmed | Advanced liquid metal cooling for chip, device and system Jing Liu (Tsinghua University, China) |
| title_short | Advanced liquid metal cooling for chip, device and system |
| title_sort | advanced liquid metal cooling for chip device and system |
| topic | Kühlung (DE-588)4132435-3 gnd Kühlmittel (DE-588)4165866-8 gnd Wärmeaustauscher (DE-588)4064176-4 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd Chip (DE-588)4197163-2 gnd Thermodynamische Eigenschaft (DE-588)4126056-9 gnd Flüssigmetall (DE-588)4154731-7 gnd Abkühlung (DE-588)4279871-1 gnd Wärmeübergang (DE-588)4188877-7 gnd |
| topic_facet | Kühlung Kühlmittel Wärmeaustauscher Elektronisches Bauelement Chip Thermodynamische Eigenschaft Flüssigmetall Abkühlung Wärmeübergang |
| work_keys_str_mv | AT liujing mianxiangxinpianqijianyuxitongdexianjinyetaijinshulengque AT liujing advancedliquidmetalcoolingforchipdeviceandsystem |