Holdings: MEMS packaging technologies and 3D integration

MEMS packaging technologies and 3D integration:

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Bibliographic Details
Other Authors:	Seok, Seonho (Editor)
Format:	Electronic eBook
Language:	English
Published:	Basel MDPI [2022]
Subjects:	Material Verpackung Biologie Aufsatzsammlung
Online Access:	Volltext Volltext
Item Description:	Printed edition of the special issue published in Micromachines
Physical Description:	1 Online-Ressource (IX, 198 Seiten) Illustrationen, Diagramme
ISBN:	9783036542577
DOI:	10.3390/books978-3-0365-4257-7

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MARC


LEADER	00000nam a2200000 c 4500
001	BV048454038
003	DE-604
007	cr\|uuu---uuuuu
008	220905s2022 xx a\|\|\| o\|\|\|\| 00\|\|\| eng d
020			\|a 9783036542577 \|9 978-3-0365-4257-7
024	7		\|a 10.3390/books978-3-0365-4257-7 \|2 doi
035			\|a (OCoLC)1344237759
035			\|a (DE-599)BVBBV048454038
040			\|a DE-604 \|b ger \|e rda
041	0		\|a eng
049			\|a DE-12 \|a DE-210 \|a DE-521 \|a DE-1102 \|a DE-1046 \|a DE-1028 \|a DE-1050 \|a DE-573 \|a DE-M347 \|a DE-92 \|a DE-1051 \|a DE-898 \|a DE-859 \|a DE-860 \|a DE-1049 \|a DE-861 \|a DE-863 \|a DE-862 \|a DE-Re13 \|a DE-Y3 \|a DE-255 \|a DE-Y7 \|a DE-Y2 \|a DE-70 \|a DE-2174 \|a DE-127 \|a DE-22 \|a DE-155 \|a DE-91 \|a DE-384 \|a DE-473 \|a DE-19 \|a DE-355 \|a DE-703 \|a DE-20 \|a DE-706 \|a DE-824 \|a DE-29 \|a DE-739
245	1	0	\|a MEMS packaging technologies and 3D integration \|c editor Seonho Seok
264		1	\|a Basel \|b MDPI \|c [2022]
300			\|a 1 Online-Ressource (IX, 198 Seiten) \|b Illustrationen, Diagramme
336			\|b txt \|2 rdacontent
337			\|b c \|2 rdamedia
338			\|b cr \|2 rdacarrier
500			\|a Printed edition of the special issue published in Micromachines
650	0	7	\|a Material \|0 (DE-588)4169078-3 \|2 gnd \|9 rswk-swf
650	0	7	\|a Verpackung \|0 (DE-588)4063118-7 \|2 gnd \|9 rswk-swf
650	0	7	\|a Biologie \|0 (DE-588)4006851-1 \|2 gnd \|9 rswk-swf
655		7	\|0 (DE-588)4143413-4 \|a Aufsatzsammlung \|2 gnd-content
689	0	0	\|a Biologie \|0 (DE-588)4006851-1 \|D s
689	0	1	\|a Verpackung \|0 (DE-588)4063118-7 \|D s
689	0	2	\|a Material \|0 (DE-588)4169078-3 \|D s
689	0		\|5 DE-604
700	1		\|a Seok, Seonho \|4 edt
776	0	8	\|i Erscheint auch als \|n Druck-Ausgabe \|z 978-3-0365-4258-4
856	4	0	\|u https://doi.org/10.3390/books978-3-0365-4257-7 \|x Verlag \|z kostenfrei \|3 Volltext
856	4	0	\|u https://directory.doabooks.org/handle/20.500.12854/84576 \|x Verlag \|z kostenfrei \|3 Volltext
912			\|a ZDB-94-OAB
943	1		\|a oai:aleph.bib-bvb.de:BVB01-033832162

Record in the Search Index

_version_	1824556260417077249
adam_text
adam_txt
any_adam_object
any_adam_object_boolean
author2	Seok, Seonho
author2_role	edt
author2_variant	s s ss
author_facet	Seok, Seonho
building	Verbundindex
bvnumber	BV048454038
collection	ZDB-94-OAB
ctrlnum	(OCoLC)1344237759 (DE-599)BVBBV048454038
doi_str_mv	10.3390/books978-3-0365-4257-7
format	Electronic eBook
fullrecord	<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>00000nam a2200000 c 4500</leader><controlfield tag="001">BV048454038</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="007">cr\|uuu---uuuuu</controlfield><controlfield tag="008">220905s2022 xx a\|\|\| o\|\|\|\| 00\|\|\| eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783036542577</subfield><subfield code="9">978-3-0365-4257-7</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.3390/books978-3-0365-4257-7</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1344237759</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV048454038</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-12</subfield><subfield code="a">DE-210</subfield><subfield code="a">DE-521</subfield><subfield code="a">DE-1102</subfield><subfield code="a">DE-1046</subfield><subfield code="a">DE-1028</subfield><subfield code="a">DE-1050</subfield><subfield code="a">DE-573</subfield><subfield code="a">DE-M347</subfield><subfield code="a">DE-92</subfield><subfield code="a">DE-1051</subfield><subfield code="a">DE-898</subfield><subfield code="a">DE-859</subfield><subfield code="a">DE-860</subfield><subfield code="a">DE-1049</subfield><subfield code="a">DE-861</subfield><subfield code="a">DE-863</subfield><subfield code="a">DE-862</subfield><subfield code="a">DE-Re13</subfield><subfield code="a">DE-Y3</subfield><subfield code="a">DE-255</subfield><subfield code="a">DE-Y7</subfield><subfield code="a">DE-Y2</subfield><subfield code="a">DE-70</subfield><subfield code="a">DE-2174</subfield><subfield code="a">DE-127</subfield><subfield code="a">DE-22</subfield><subfield code="a">DE-155</subfield><subfield code="a">DE-91</subfield><subfield code="a">DE-384</subfield><subfield code="a">DE-473</subfield><subfield code="a">DE-19</subfield><subfield code="a">DE-355</subfield><subfield code="a">DE-703</subfield><subfield code="a">DE-20</subfield><subfield code="a">DE-706</subfield><subfield code="a">DE-824</subfield><subfield code="a">DE-29</subfield><subfield code="a">DE-739</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">MEMS packaging technologies and 3D integration</subfield><subfield code="c">editor Seonho Seok</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Basel</subfield><subfield code="b">MDPI</subfield><subfield code="c">[2022]</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource (IX, 198 Seiten)</subfield><subfield code="b">Illustrationen, Diagramme</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Printed edition of the special issue published in Micromachines</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Material</subfield><subfield code="0">(DE-588)4169078-3</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Verpackung</subfield><subfield code="0">(DE-588)4063118-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Biologie</subfield><subfield code="0">(DE-588)4006851-1</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)4143413-4</subfield><subfield code="a">Aufsatzsammlung</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Biologie</subfield><subfield code="0">(DE-588)4006851-1</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Verpackung</subfield><subfield code="0">(DE-588)4063118-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">Material</subfield><subfield code="0">(DE-588)4169078-3</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Seok, Seonho</subfield><subfield code="4">edt</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">978-3-0365-4258-4</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.3390/books978-3-0365-4257-7</subfield><subfield code="x">Verlag</subfield><subfield code="z">kostenfrei</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://directory.doabooks.org/handle/20.500.12854/84576</subfield><subfield code="x">Verlag</subfield><subfield code="z">kostenfrei</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-94-OAB</subfield></datafield><datafield tag="943" ind1="1" ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-033832162</subfield></datafield></record></collection>
genre	(DE-588)4143413-4 Aufsatzsammlung gnd-content
genre_facet	Aufsatzsammlung
id	DE-604.BV048454038
illustrated	Illustrated
index_date	2024-07-03T20:31:48Z
indexdate	2025-02-20T07:20:44Z
institution	BVB
isbn	9783036542577
language	English
oai_aleph_id	oai:aleph.bib-bvb.de:BVB01-033832162
oclc_num	1344237759
open_access_boolean	1
owner	DE-12 DE-210 DE-521 DE-1102 DE-1046 DE-1028 DE-1050 DE-573 DE-M347 DE-92 DE-1051 DE-898 DE-BY-UBR DE-859 DE-860 DE-1049 DE-861 DE-863 DE-BY-FWS DE-862 DE-BY-FWS DE-Re13 DE-BY-UBR DE-Y3 DE-255 DE-Y7 DE-Y2 DE-70 DE-2174 DE-127 DE-22 DE-BY-UBG DE-155 DE-BY-UBR DE-91 DE-BY-TUM DE-384 DE-473 DE-BY-UBG DE-19 DE-BY-UBM DE-355 DE-BY-UBR DE-703 DE-20 DE-706 DE-824 DE-29 DE-739
owner_facet	DE-12 DE-210 DE-521 DE-1102 DE-1046 DE-1028 DE-1050 DE-573 DE-M347 DE-92 DE-1051 DE-898 DE-BY-UBR DE-859 DE-860 DE-1049 DE-861 DE-863 DE-BY-FWS DE-862 DE-BY-FWS DE-Re13 DE-BY-UBR DE-Y3 DE-255 DE-Y7 DE-Y2 DE-70 DE-2174 DE-127 DE-22 DE-BY-UBG DE-155 DE-BY-UBR DE-91 DE-BY-TUM DE-384 DE-473 DE-BY-UBG DE-19 DE-BY-UBM DE-355 DE-BY-UBR DE-703 DE-20 DE-706 DE-824 DE-29 DE-739
physical	1 Online-Ressource (IX, 198 Seiten) Illustrationen, Diagramme
psigel	ZDB-94-OAB
publishDate	2022
publishDateSearch	2022
publishDateSort	2022
publisher	MDPI
record_format	marc
spellingShingle	MEMS packaging technologies and 3D integration Material (DE-588)4169078-3 gnd Verpackung (DE-588)4063118-7 gnd Biologie (DE-588)4006851-1 gnd
subject_GND	(DE-588)4169078-3 (DE-588)4063118-7 (DE-588)4006851-1 (DE-588)4143413-4
title	MEMS packaging technologies and 3D integration
title_auth	MEMS packaging technologies and 3D integration
title_exact_search	MEMS packaging technologies and 3D integration
title_exact_search_txtP	MEMS packaging technologies and 3D integration
title_full	MEMS packaging technologies and 3D integration editor Seonho Seok
title_fullStr	MEMS packaging technologies and 3D integration editor Seonho Seok
title_full_unstemmed	MEMS packaging technologies and 3D integration editor Seonho Seok
title_short	MEMS packaging technologies and 3D integration
title_sort	mems packaging technologies and 3d integration
topic	Material (DE-588)4169078-3 gnd Verpackung (DE-588)4063118-7 gnd Biologie (DE-588)4006851-1 gnd
topic_facet	Material Verpackung Biologie Aufsatzsammlung
url	https://doi.org/10.3390/books978-3-0365-4257-7 https://directory.doabooks.org/handle/20.500.12854/84576
work_keys_str_mv	AT seokseonho memspackagingtechnologiesand3dintegration

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