Bamberg, L., Joseph, J. M., García-Ortiz, A., & Pionteck, T. (2022). 3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization (1st ed. 2022.). Springer International Publishing. https://doi.org/10.1007/978-3-030-98229-4
Chicago-Zitierstil (17. Ausg.)Bamberg, Lennart, Jan Moritz Joseph, Alberto García-Ortiz, und Thilo Pionteck. 3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization. 1st ed. 2022. Cham: Springer International Publishing, 2022. https://doi.org/10.1007/978-3-030-98229-4.
MLA-Zitierstil (9. Ausg.)Bamberg, Lennart, et al. 3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization. 1st ed. 2022. Springer International Publishing, 2022. https://doi.org/10.1007/978-3-030-98229-4.