Pawelski-Höll, C. (2021). Novel thermally conductive and flame-retardant substrates for printed circuit boards: Structure-property-relationships. https://doi.org/10.15495/EPub_UBT_00005944
Chicago-Zitierstil (17. Ausg.)Pawelski-Höll, Christin. Novel Thermally Conductive and Flame-retardant Substrates for Printed Circuit Boards: Structure-property-relationships. Bayreuth, 2021. https://doi.org/10.15495/EPub_UBT_00005944.
MLA-Zitierstil (9. Ausg.)Pawelski-Höll, Christin. Novel Thermally Conductive and Flame-retardant Substrates for Printed Circuit Boards: Structure-property-relationships. 2021. https://doi.org/10.15495/EPub_UBT_00005944.
Achtung: Diese Zitate sind unter Umständen nicht zu 100% korrekt.