Wireless interface technologies for 3D IC and module integration:
Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion o...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Cambridge
Cambridge University Press
2021
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| Schlagworte: | |
| Online-Zugang: | BSB01 FHN01 Volltext |
| Zusammenfassung: | Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design |
| Beschreibung: | Title from publisher's bibliographic system (viewed on 21 Sep 2021) |
| Beschreibung: | 1 Online-Ressource (xii, 323 Seiten) |
| ISBN: | 9781108893299 |
| DOI: | 10.1017/9781108893299 |
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| isbn | 9781108893299 |
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| spelling | Kuroda, Tadahiro 1959- (DE-588)1244868353 aut Wireless interface technologies for 3D IC and module integration Tadahiro Kuroda, University of Tokyo, Wai-Yeung Yip, University of Tokyo Cambridge Cambridge University Press 2021 1 Online-Ressource (xii, 323 Seiten) txt rdacontent c rdamedia cr rdacarrier Title from publisher's bibliographic system (viewed on 21 Sep 2021) Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design Interconnects (Integrated circuit technology) Optical interconnects Three-dimensional integrated circuits Dreidimensionale Integration (DE-588)4218841-6 gnd rswk-swf Integrierte Schaltung (DE-588)4027242-4 gnd rswk-swf Nahfeldkommunikation (DE-588)7678305-4 gnd rswk-swf Integrierte Schaltung (DE-588)4027242-4 s Dreidimensionale Integration (DE-588)4218841-6 s Nahfeldkommunikation (DE-588)7678305-4 s DE-604 Yip, Wai-Yeung ca. 20./21. Jh. (DE-588)1244868574 aut Erscheint auch als Druck-Ausgabe 978-1-108-84121-4 https://doi.org/10.1017/9781108893299 Verlag URL des Erstveröffentlichers Volltext |
| spellingShingle | Kuroda, Tadahiro 1959- Yip, Wai-Yeung ca. 20./21. Jh Wireless interface technologies for 3D IC and module integration Interconnects (Integrated circuit technology) Optical interconnects Three-dimensional integrated circuits Dreidimensionale Integration (DE-588)4218841-6 gnd Integrierte Schaltung (DE-588)4027242-4 gnd Nahfeldkommunikation (DE-588)7678305-4 gnd |
| subject_GND | (DE-588)4218841-6 (DE-588)4027242-4 (DE-588)7678305-4 |
| title | Wireless interface technologies for 3D IC and module integration |
| title_auth | Wireless interface technologies for 3D IC and module integration |
| title_exact_search | Wireless interface technologies for 3D IC and module integration |
| title_exact_search_txtP | Wireless interface technologies for 3D IC and module integration |
| title_full | Wireless interface technologies for 3D IC and module integration Tadahiro Kuroda, University of Tokyo, Wai-Yeung Yip, University of Tokyo |
| title_fullStr | Wireless interface technologies for 3D IC and module integration Tadahiro Kuroda, University of Tokyo, Wai-Yeung Yip, University of Tokyo |
| title_full_unstemmed | Wireless interface technologies for 3D IC and module integration Tadahiro Kuroda, University of Tokyo, Wai-Yeung Yip, University of Tokyo |
| title_short | Wireless interface technologies for 3D IC and module integration |
| title_sort | wireless interface technologies for 3d ic and module integration |
| topic | Interconnects (Integrated circuit technology) Optical interconnects Three-dimensional integrated circuits Dreidimensionale Integration (DE-588)4218841-6 gnd Integrierte Schaltung (DE-588)4027242-4 gnd Nahfeldkommunikation (DE-588)7678305-4 gnd |
| topic_facet | Interconnects (Integrated circuit technology) Optical interconnects Three-dimensional integrated circuits Dreidimensionale Integration Integrierte Schaltung Nahfeldkommunikation |
| url | https://doi.org/10.1017/9781108893299 |
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