Holdings: Semiconductor Advanced Packaging

Semiconductor Advanced Packaging:

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Bibliographic Details
Main Author:	Lau, John H. (Author)
Format:	Electronic eBook
Language:	English
Published:	Singapore Springer Singapore 2021 Singapore Springer
Edition:	1st ed. 2021
Subjects:	Electronics and Microelectronics, Instrumentation Semiconductors Industrial and Production Engineering Electronics Microelectronics Industrial engineering Production engineering
Online Access:	BTU01 FAB01 FAW01 FCO01 FHA01 FHD01 FHI01 FHM01 FHN01 FHR01 FKE01 FLA01 FRO01 FWS01 FWS02 HTW01 TUM01 UBY01 UER01 Volltext
Physical Description:	1 Online-Ressource (XXII, 498 p. 557 illus., 530 illus. in color)
ISBN:	9789811613760
DOI:	10.1007/978-981-16-1376-0

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Record in the Search Index

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physical	1 Online-Ressource (XXII, 498 p. 557 illus., 530 illus. in color)
psigel	ZDB-2-ENG ZDB-2-ENG_2021_Fremddaten
publishDate	2021
publishDateSearch	2021
publishDateSort	2021
publisher	Springer Singapore Springer
record_format	marc
spellingShingle	Lau, John H. Semiconductor Advanced Packaging Electronics and Microelectronics, Instrumentation Semiconductors Industrial and Production Engineering Electronics Microelectronics Industrial engineering Production engineering
title	Semiconductor Advanced Packaging
title_auth	Semiconductor Advanced Packaging
title_exact_search	Semiconductor Advanced Packaging
title_exact_search_txtP	Semiconductor Advanced Packaging
title_full	Semiconductor Advanced Packaging by John H. Lau
title_fullStr	Semiconductor Advanced Packaging by John H. Lau
title_full_unstemmed	Semiconductor Advanced Packaging by John H. Lau
title_short	Semiconductor Advanced Packaging
title_sort	semiconductor advanced packaging
topic	Electronics and Microelectronics, Instrumentation Semiconductors Industrial and Production Engineering Electronics Microelectronics Industrial engineering Production engineering
topic_facet	Electronics and Microelectronics, Instrumentation Semiconductors Industrial and Production Engineering Electronics Microelectronics Industrial engineering Production engineering
url	https://doi.org/10.1007/978-981-16-1376-0
work_keys_str_mv	AT laujohnh semiconductoradvancedpackaging

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