Antenna-in-package technology and applications:
"This book starts with some historical notes about how AiP technology has evolved as we know it today. Then, the authors consider antennas and packages, thermal analysis and design, and measurement setups and methods for AiP technology. The authors show that the choice of antennas is usually gi...
Gespeichert in:
| Weitere Verfasser: | , |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Hoboken, New Jersey
Wiley
[2020]
|
| Ausgabe: | First edition |
| Schlagworte: | |
| Zusammenfassung: | "This book starts with some historical notes about how AiP technology has evolved as we know it today. Then, the authors consider antennas and packages, thermal analysis and design, and measurement setups and methods for AiP technology. The authors show that the choice of antennas is usually given to those popular antennas that can be easily designed for the applications; the choice of packages is a trade-off among constraints such as electrical performance, thermo-mechanical reliability, compactness, manufacturability and cost; the choice of interconnects is governed by JEDEC for automatic assembly. Next, the book describes respectively low-temperature co-fired ceramic (LTCC), high-density interconnects (HDI), fan-out wafer level packaging (FOWLP) based AiP, and 3D-printing-based AiP. After that, the authors discuss in details the surface laminar circuit (SLC) based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Finally, the book touches on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications"-- |
| Beschreibung: | 2003 |
| Beschreibung: | xxv, 390 Seiten Illustrationen, Diagramme |
| ISBN: | 9781119556633 1119556635 |
Internformat
MARC
| LEADER | 00000nam a22000008c 4500 | ||
|---|---|---|---|
| 001 | BV046814067 | ||
| 003 | DE-604 | ||
| 005 | 20200903 | ||
| 007 | t | ||
| 008 | 200720s2020 a||| b||| 00||| eng d | ||
| 020 | |a 9781119556633 |9 978-1-119-55663-3 | ||
| 020 | |a 1119556635 |9 1119556635 | ||
| 035 | |a (OCoLC)1197710007 | ||
| 035 | |a (DE-599)BVBBV046814067 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-83 | ||
| 084 | |a ZN 6440 |0 (DE-625)157563: |2 rvk | ||
| 084 | |a ZN 4192 |0 (DE-625)157372: |2 rvk | ||
| 245 | 1 | 0 | |a Antenna-in-package technology and applications |c edited by Duixian Liu, Yueping Zhang |
| 250 | |a First edition | ||
| 264 | 1 | |a Hoboken, New Jersey |b Wiley |c [2020] | |
| 264 | 4 | |c © 2020 | |
| 300 | |a xxv, 390 Seiten |b Illustrationen, Diagramme | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 500 | |a 2003 | ||
| 505 | 8 | |a Antennas for AiP technology / Yueping Zhang -- Package technologies / Dr Ning Ye -- Electrical, mechanical, and thermal co-design / Xiaoxiong Gu and Pritish R Parida | |
| 520 | 3 | |a "This book starts with some historical notes about how AiP technology has evolved as we know it today. Then, the authors consider antennas and packages, thermal analysis and design, and measurement setups and methods for AiP technology. The authors show that the choice of antennas is usually given to those popular antennas that can be easily designed for the applications; the choice of packages is a trade-off among constraints such as electrical performance, thermo-mechanical reliability, compactness, manufacturability and cost; the choice of interconnects is governed by JEDEC for automatic assembly. Next, the book describes respectively low-temperature co-fired ceramic (LTCC), high-density interconnects (HDI), fan-out wafer level packaging (FOWLP) based AiP, and 3D-printing-based AiP. After that, the authors discuss in details the surface laminar circuit (SLC) based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Finally, the book touches on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications"-- | |
| 650 | 0 | 7 | |a Antenne |0 (DE-588)4002210-9 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Gehäuse |0 (DE-588)4156307-4 |2 gnd |9 rswk-swf |
| 653 | 0 | |a Microstrip antennas | |
| 653 | 0 | |a Microelectronic packaging | |
| 653 | 0 | |a Microelectronic packaging | |
| 653 | 0 | |a Microstrip antennas | |
| 689 | 0 | 0 | |a Antenne |0 (DE-588)4002210-9 |D s |
| 689 | 0 | 1 | |a Gehäuse |0 (DE-588)4156307-4 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Liu, Duixian |4 edt | |
| 700 | 1 | |a Zhang, Yueping |4 edt | |
| 776 | 0 | 8 | |i Online version |t Antenna-in-package technology and applications |b First edition |d Hoboken, New Jersey : John Wiley & Sons, Inc., [2020] |z 9781119556640 |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-032222560 | ||
Datensatz im Suchindex
| _version_ | 1804181621822193664 |
|---|---|
| adam_txt | |
| any_adam_object | |
| any_adam_object_boolean | |
| author2 | Liu, Duixian Zhang, Yueping |
| author2_role | edt edt |
| author2_variant | d l dl y z yz |
| author_facet | Liu, Duixian Zhang, Yueping |
| building | Verbundindex |
| bvnumber | BV046814067 |
| classification_rvk | ZN 6440 ZN 4192 |
| contents | Antennas for AiP technology / Yueping Zhang -- Package technologies / Dr Ning Ye -- Electrical, mechanical, and thermal co-design / Xiaoxiong Gu and Pritish R Parida |
| ctrlnum | (OCoLC)1197710007 (DE-599)BVBBV046814067 |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Elektrotechnik / Elektronik / Nachrichtentechnik |
| edition | First edition |
| format | Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02834nam a22004818c 4500</leader><controlfield tag="001">BV046814067</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20200903 </controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">200720s2020 a||| b||| 00||| eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781119556633</subfield><subfield code="9">978-1-119-55663-3</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">1119556635</subfield><subfield code="9">1119556635</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1197710007</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV046814067</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-83</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 6440</subfield><subfield code="0">(DE-625)157563:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4192</subfield><subfield code="0">(DE-625)157372:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Antenna-in-package technology and applications</subfield><subfield code="c">edited by Duixian Liu, Yueping Zhang</subfield></datafield><datafield tag="250" ind1=" " ind2=" "><subfield code="a">First edition</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Hoboken, New Jersey</subfield><subfield code="b">Wiley</subfield><subfield code="c">[2020]</subfield></datafield><datafield tag="264" ind1=" " ind2="4"><subfield code="c">© 2020</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">xxv, 390 Seiten</subfield><subfield code="b">Illustrationen, Diagramme</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">2003</subfield></datafield><datafield tag="505" ind1="8" ind2=" "><subfield code="a">Antennas for AiP technology / Yueping Zhang -- Package technologies / Dr Ning Ye -- Electrical, mechanical, and thermal co-design / Xiaoxiong Gu and Pritish R Parida</subfield></datafield><datafield tag="520" ind1="3" ind2=" "><subfield code="a">"This book starts with some historical notes about how AiP technology has evolved as we know it today. Then, the authors consider antennas and packages, thermal analysis and design, and measurement setups and methods for AiP technology. The authors show that the choice of antennas is usually given to those popular antennas that can be easily designed for the applications; the choice of packages is a trade-off among constraints such as electrical performance, thermo-mechanical reliability, compactness, manufacturability and cost; the choice of interconnects is governed by JEDEC for automatic assembly. Next, the book describes respectively low-temperature co-fired ceramic (LTCC), high-density interconnects (HDI), fan-out wafer level packaging (FOWLP) based AiP, and 3D-printing-based AiP. After that, the authors discuss in details the surface laminar circuit (SLC) based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Finally, the book touches on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications"--</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Antenne</subfield><subfield code="0">(DE-588)4002210-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Gehäuse</subfield><subfield code="0">(DE-588)4156307-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Microstrip antennas</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Microelectronic packaging</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Microelectronic packaging</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Microstrip antennas</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Antenne</subfield><subfield code="0">(DE-588)4002210-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Gehäuse</subfield><subfield code="0">(DE-588)4156307-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Liu, Duixian</subfield><subfield code="4">edt</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Zhang, Yueping</subfield><subfield code="4">edt</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Online version</subfield><subfield code="t">Antenna-in-package technology and applications</subfield><subfield code="b">First edition</subfield><subfield code="d">Hoboken, New Jersey : John Wiley & Sons, Inc., [2020]</subfield><subfield code="z">9781119556640</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-032222560</subfield></datafield></record></collection> |
| id | DE-604.BV046814067 |
| illustrated | Illustrated |
| index_date | 2024-07-03T14:59:43Z |
| indexdate | 2024-07-10T08:54:34Z |
| institution | BVB |
| isbn | 9781119556633 1119556635 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-032222560 |
| oclc_num | 1197710007 |
| open_access_boolean | |
| owner | DE-83 |
| owner_facet | DE-83 |
| physical | xxv, 390 Seiten Illustrationen, Diagramme |
| publishDate | 2020 |
| publishDateSearch | 2020 |
| publishDateSort | 2020 |
| publisher | Wiley |
| record_format | marc |
| spelling | Antenna-in-package technology and applications edited by Duixian Liu, Yueping Zhang First edition Hoboken, New Jersey Wiley [2020] © 2020 xxv, 390 Seiten Illustrationen, Diagramme txt rdacontent n rdamedia nc rdacarrier 2003 Antennas for AiP technology / Yueping Zhang -- Package technologies / Dr Ning Ye -- Electrical, mechanical, and thermal co-design / Xiaoxiong Gu and Pritish R Parida "This book starts with some historical notes about how AiP technology has evolved as we know it today. Then, the authors consider antennas and packages, thermal analysis and design, and measurement setups and methods for AiP technology. The authors show that the choice of antennas is usually given to those popular antennas that can be easily designed for the applications; the choice of packages is a trade-off among constraints such as electrical performance, thermo-mechanical reliability, compactness, manufacturability and cost; the choice of interconnects is governed by JEDEC for automatic assembly. Next, the book describes respectively low-temperature co-fired ceramic (LTCC), high-density interconnects (HDI), fan-out wafer level packaging (FOWLP) based AiP, and 3D-printing-based AiP. After that, the authors discuss in details the surface laminar circuit (SLC) based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Finally, the book touches on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications"-- Antenne (DE-588)4002210-9 gnd rswk-swf Gehäuse (DE-588)4156307-4 gnd rswk-swf Microstrip antennas Microelectronic packaging Antenne (DE-588)4002210-9 s Gehäuse (DE-588)4156307-4 s DE-604 Liu, Duixian edt Zhang, Yueping edt Online version Antenna-in-package technology and applications First edition Hoboken, New Jersey : John Wiley & Sons, Inc., [2020] 9781119556640 |
| spellingShingle | Antenna-in-package technology and applications Antennas for AiP technology / Yueping Zhang -- Package technologies / Dr Ning Ye -- Electrical, mechanical, and thermal co-design / Xiaoxiong Gu and Pritish R Parida Antenne (DE-588)4002210-9 gnd Gehäuse (DE-588)4156307-4 gnd |
| subject_GND | (DE-588)4002210-9 (DE-588)4156307-4 |
| title | Antenna-in-package technology and applications |
| title_auth | Antenna-in-package technology and applications |
| title_exact_search | Antenna-in-package technology and applications |
| title_exact_search_txtP | Antenna-in-package technology and applications |
| title_full | Antenna-in-package technology and applications edited by Duixian Liu, Yueping Zhang |
| title_fullStr | Antenna-in-package technology and applications edited by Duixian Liu, Yueping Zhang |
| title_full_unstemmed | Antenna-in-package technology and applications edited by Duixian Liu, Yueping Zhang |
| title_short | Antenna-in-package technology and applications |
| title_sort | antenna in package technology and applications |
| topic | Antenne (DE-588)4002210-9 gnd Gehäuse (DE-588)4156307-4 gnd |
| topic_facet | Antenne Gehäuse |
| work_keys_str_mv | AT liuduixian antennainpackagetechnologyandapplications AT zhangyueping antennainpackagetechnologyandapplications |