MEMS packaging (World Scientific Publishing Company Pte Limited, 2018)
Includes bibliographical references and index
Introduction to MEMS Packaging / Y C Lee, Ramesh Ramadoss and Nils Hoivik -- Silex's TSV Technology: Overview of Processes and MEMS Applications / Tomas Bauer and Thorbjörn Ebefors -- Vertical Interconnects for High-end MEMS / Maaike M Visser Taklo and Sigurd Moe -- Using Wafer-Level Packaging to Improve Sensor Manufacturability and Cost / Paul Pickering, Collin Twanow and Dean Spicer -- Nasiri Fabrication Process for Low-Cost Motion Sensors in the Consumer Market / Steven Nasiri, Ramesh Ramadoss and Sandra Winkler -- PCB Based MEMS and Microfluidics / Ramesh Ramadoss, Antonio Luque and Carmen Aracil -- Single Wafer Encapsulation of MEMS Resonators / Janna Rodriguez and Thomas Kenny -- Heterogeneous Integration and Wafer-Level Packaging of MEMS / Masayoshi Esashi and Shuji Tanaka -- Packaging of Membrane-Based Polymer Microfluidic Systems / Yu-Chuan Su -- Wafer-Level Solder Bonding by Using Localized Induction Heating / Hsueh-An Yang, Chiung-Wen Lin and Weileun Fang -- Localized Sealing Schemes for MEMS Packaging / Y T Cheng, Y C Su and Liwei Lin -- Microsprings for High-Density Flip-Chip Packaging / Eugene M Chow and Christopher L Chua -- MEMS Reliability / Chien-Ming Huang, Arvind Sai SarathiVasan, Yunhan Huang, Ravi Doraiswami, Michael Osterman and Michael Pecht