Huang, Y., Yin, Z., & Wan, X. (2019). Modeling and application of flexible electronics packaging. Science Press.
Chicago Style (17th ed.) CitationHuang, YongAn, Zhoupng Yin, and Xiaodong Wan. Modeling and Application of Flexible Electronics Packaging. Beijing: Science Press, 2019.
MLA (9th ed.) CitationHuang, YongAn, et al. Modeling and Application of Flexible Electronics Packaging. Science Press, 2019.
Warning: These citations may not always be 100% accurate.