Ciecińska, B. E. (2020). Using lasers as safe alternatives for adhesive bonding: Emerging research and opportunities. IGI Global. https://doi.org/10.4018/978-1-7998-4634-5
Chicago-Zitierstil (17. Ausg.)Ciecińska, Barbara Ewa. Using Lasers as Safe Alternatives for Adhesive Bonding: Emerging Research and Opportunities. Hershey, PA: IGI Global, 2020. https://doi.org/10.4018/978-1-7998-4634-5.
MLA-Zitierstil (9. Ausg.)Ciecińska, Barbara Ewa. Using Lasers as Safe Alternatives for Adhesive Bonding: Emerging Research and Opportunities. IGI Global, 2020. https://doi.org/10.4018/978-1-7998-4634-5.
Achtung: Diese Zitate sind unter Umständen nicht zu 100% korrekt.