Seok, S. (2018). Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method. Springer.
Chicago Style (17th ed.) CitationSeok, Seonho. Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method. Cham: Springer, 2018.
MLA (9th ed.) CitationSeok, Seonho. Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method. Springer, 2018.
Warning: These citations may not always be 100% accurate.