Seok, S. (2018). Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method. Springer.
Chicago-Zitierstil (17. Ausg.)Seok, Seonho. Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method. Cham: Springer, 2018.
MLA-Zitierstil (9. Ausg.)Seok, Seonho. Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method. Springer, 2018.
Achtung: Diese Zitate sind unter Umständen nicht zu 100% korrekt.