This Second Edition of a classic text is fully updated and greatly expanded, with in-depth revisions that include advancements in the component technology of microelectronics. The most noticeable one is the addition of an entirely new chapter on microwave modules and the gallium arsenide (GaAs) chip...

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Bibliographic Details

Main Author:	Yeh, Lian-Tuu 1944- (Author)
Format:	Electronic eBook
Language:	English
Published:	New York, N.Y. The American Society of Mechanical Engineers [2016]
Edition:	2nd edition
Subjects:	Electronic apparatus and appliances / Cooling Microelectronics Electronic apparatus and appliances / Thermal properties Heat / Transmission Semiconductors / Protection Elektronisches Bauelement Kühlung Wärmeabgabe Mikroelektronik Electronic books
Online Access:	Volltext
Summary:	This Second Edition of a classic text is fully updated and greatly expanded, with in-depth revisions that include advancements in the component technology of microelectronics. The most noticeable one is the addition of an entirely new chapter on microwave modules and the gallium arsenide (GaAs) chips, which have seldom been discussed in any of the textbooks or publications in the area of thermal management of electronic equipment. With this new chapter, the book is complete and whole in the area of thermal design of electronics systems. With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume
Item Description:	Includes bibliographical references and index 1 Introduction -- 2 Conduction -- 3 Convection -- 4 Radiation -- 5 Pool Boiling -- 6 Flow Boiling -- 7 Condensation -- 8 Extended Surfaces -- 9 Thermal Interface Resistance -- 10 Component and Printed Circuit Board -- 11 Direct Air Cooling and Fans -- 12 Natural and Mixed Convection -- 13 Heat Exchangers and Cold Plates -- 14 Advanced Cooling Technologies I: Single-Phase Liquid Cooling -- 15 Advanced Cooling Technologies II: Two-Phase Flow Cooling -- 16 Heat Pipes and Others -- 17 Thermoelectric Devices -- 18 Microwave Modules and GaAs Chips. - System requirements: Adobe Acrobat Reader. - Mode of access: Internet via World Wide Web
Physical Description:	1 online resource (522 Seiten) illustrations