Essentials of electronic packaging: a multidisciplinary approach
This book provides the basic essentials and fundamentals of electronic packaging technology. It introduces the language and terminology, as well as the basic building blocks of information processing technology such as: a) printed wiring boards and laminates, b) various types of components and packa...
Gespeichert in:
| 1. Verfasser: | |
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| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
New York, N.Y.
American Society of Mechanical Engineers
c2011
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| Schriftenreihe: | ASME Press book series on electronic packaging
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| Schlagworte: | |
| Online-Zugang: | Volltext |
| Zusammenfassung: | This book provides the basic essentials and fundamentals of electronic packaging technology. It introduces the language and terminology, as well as the basic building blocks of information processing technology such as: a) printed wiring boards and laminates, b) various types of components and packages, c) materials and processes, d) fundamentals of reliability and relevant reliability enhancement methods, and e) typical failures observed are described. A fully tested semiconductor device is the starting point for this text, thus no background in the semiconductor design or fabrication is assumed. The reader is exposed to the interaction and convergence of various disciplines such as chemistry, physics, materials science, metallurgy, and process engineering in the fabrication of an electronic appliance. The reader is also made aware of the emerging trends in electronic packaging to prepare him or her for the near-term miniaturization and integration of technology trends |
| Beschreibung: | System requirements: Adobe Acrobat Reader. - Mode of access: World Wide Web |
| Beschreibung: | 1 Online-Ressource (xviii, 374 Seiten) ill., digital file |
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| 505 | 8 | |a Includes bibliographical references and index | |
| 505 | 8 | |a Dedication -- Preface -- Foreword -- Acknowledgments -- Chapter 1. Introduction -- Chapter 2. Substrate and laminate technologies -- Chapter 3. First-level packaging-packaging and component technologies -- Chapter 4. Package-to-board interconnection -- Chapter 5. System packaging -- Chapter 6. Reliability of electronic packaging -- Chapter 7. Failure modes and mechanisms -- Chapter 8. Reliability enhancements -- Chapter 9. Emerging trends in packaging -- Appendixes -- Author biography -- Index | |
| 520 | |a This book provides the basic essentials and fundamentals of electronic packaging technology. It introduces the language and terminology, as well as the basic building blocks of information processing technology such as: a) printed wiring boards and laminates, b) various types of components and packages, c) materials and processes, d) fundamentals of reliability and relevant reliability enhancement methods, and e) typical failures observed are described. A fully tested semiconductor device is the starting point for this text, thus no background in the semiconductor design or fabrication is assumed. The reader is exposed to the interaction and convergence of various disciplines such as chemistry, physics, materials science, metallurgy, and process engineering in the fabrication of an electronic appliance. The reader is also made aware of the emerging trends in electronic packaging to prepare him or her for the near-term miniaturization and integration of technology trends | ||
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| contents | Includes bibliographical references and index Dedication -- Preface -- Foreword -- Acknowledgments -- Chapter 1. Introduction -- Chapter 2. Substrate and laminate technologies -- Chapter 3. First-level packaging-packaging and component technologies -- Chapter 4. Package-to-board interconnection -- Chapter 5. System packaging -- Chapter 6. Reliability of electronic packaging -- Chapter 7. Failure modes and mechanisms -- Chapter 8. Reliability enhancements -- Chapter 9. Emerging trends in packaging -- Appendixes -- Author biography -- Index |
| ctrlnum | (ZDB-240-ASM)1011151859667 (OCoLC)1148074467 (DE-599)BVBBV046643880 |
| discipline | Verkehr / Transport |
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| index_date | 2024-07-03T14:14:55Z |
| indexdate | 2024-07-10T08:50:06Z |
| institution | BVB |
| language | English |
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| spelling | Viswanadham, Puligandla Verfasser aut Essentials of electronic packaging a multidisciplinary approach Puligandla Viswanadham New York, N.Y. American Society of Mechanical Engineers c2011 1 Online-Ressource (xviii, 374 Seiten) ill., digital file txt rdacontent c rdamedia cr rdacarrier ASME Press book series on electronic packaging System requirements: Adobe Acrobat Reader. - Mode of access: World Wide Web Includes bibliographical references and index Dedication -- Preface -- Foreword -- Acknowledgments -- Chapter 1. Introduction -- Chapter 2. Substrate and laminate technologies -- Chapter 3. First-level packaging-packaging and component technologies -- Chapter 4. Package-to-board interconnection -- Chapter 5. System packaging -- Chapter 6. Reliability of electronic packaging -- Chapter 7. Failure modes and mechanisms -- Chapter 8. Reliability enhancements -- Chapter 9. Emerging trends in packaging -- Appendixes -- Author biography -- Index This book provides the basic essentials and fundamentals of electronic packaging technology. It introduces the language and terminology, as well as the basic building blocks of information processing technology such as: a) printed wiring boards and laminates, b) various types of components and packages, c) materials and processes, d) fundamentals of reliability and relevant reliability enhancement methods, and e) typical failures observed are described. A fully tested semiconductor device is the starting point for this text, thus no background in the semiconductor design or fabrication is assumed. The reader is exposed to the interaction and convergence of various disciplines such as chemistry, physics, materials science, metallurgy, and process engineering in the fabrication of an electronic appliance. The reader is also made aware of the emerging trends in electronic packaging to prepare him or her for the near-term miniaturization and integration of technology trends Electronic packaging Verpackungstechnik (DE-588)4187932-6 gnd rswk-swf Electronic books Verpackungstechnik (DE-588)4187932-6 s DE-604 American Society of Mechanical Engineers Sonstige oth https://asmedigitalcollection.asme.org/ebooks/book/64/Essentials-of-Electronic-Packaging-A Verlag Volltext |
| spellingShingle | Viswanadham, Puligandla Essentials of electronic packaging a multidisciplinary approach Includes bibliographical references and index Dedication -- Preface -- Foreword -- Acknowledgments -- Chapter 1. Introduction -- Chapter 2. Substrate and laminate technologies -- Chapter 3. First-level packaging-packaging and component technologies -- Chapter 4. Package-to-board interconnection -- Chapter 5. System packaging -- Chapter 6. Reliability of electronic packaging -- Chapter 7. Failure modes and mechanisms -- Chapter 8. Reliability enhancements -- Chapter 9. Emerging trends in packaging -- Appendixes -- Author biography -- Index Electronic packaging Verpackungstechnik (DE-588)4187932-6 gnd |
| subject_GND | (DE-588)4187932-6 |
| title | Essentials of electronic packaging a multidisciplinary approach |
| title_auth | Essentials of electronic packaging a multidisciplinary approach |
| title_exact_search | Essentials of electronic packaging a multidisciplinary approach |
| title_exact_search_txtP | Essentials of electronic packaging a multidisciplinary approach |
| title_full | Essentials of electronic packaging a multidisciplinary approach Puligandla Viswanadham |
| title_fullStr | Essentials of electronic packaging a multidisciplinary approach Puligandla Viswanadham |
| title_full_unstemmed | Essentials of electronic packaging a multidisciplinary approach Puligandla Viswanadham |
| title_short | Essentials of electronic packaging |
| title_sort | essentials of electronic packaging a multidisciplinary approach |
| title_sub | a multidisciplinary approach |
| topic | Electronic packaging Verpackungstechnik (DE-588)4187932-6 gnd |
| topic_facet | Electronic packaging Verpackungstechnik |
| url | https://asmedigitalcollection.asme.org/ebooks/book/64/Essentials-of-Electronic-Packaging-A |
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