Advances in embedded and fan-out wafer-level packaging technologies:
Saved in:
| Format: | Book |
|---|---|
| Language: | English |
| Published: |
Hoboken, NJ
Wiley, IEEE Press
[2019]
|
| Subjects: | |
| Physical Description: | xxvii, 548 Seiten Illustrationen, Diagramme |
| ISBN: | 9781119314134 |
Staff View
MARC
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| id | DE-604.BV045502893 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T08:19:53Z |
| institution | BVB |
| isbn | 9781119314134 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030887565 |
| oclc_num | 1091668910 |
| open_access_boolean | |
| owner | DE-29T DE-83 |
| owner_facet | DE-29T DE-83 |
| physical | xxvii, 548 Seiten Illustrationen, Diagramme |
| publishDate | 2019 |
| publishDateSearch | 2019 |
| publishDateSort | 2019 |
| publisher | Wiley, IEEE Press |
| record_format | marc |
| spelling | Advances in embedded and fan-out wafer-level packaging technologies edited by Beth Keser, Ph. D. and Steffen Kröhnert Hoboken, NJ Wiley, IEEE Press [2019] xxvii, 548 Seiten Illustrationen, Diagramme txt rdacontent n rdamedia nc rdacarrier Chip scale packaging Integrated circuits / Wafer-scale integration Chip scale packaging fast Integrated circuits / Wafer-scale integration fast Wafer level packaging (DE-588)1058582143 gnd rswk-swf Wafer level packaging (DE-588)1058582143 s DE-604 Keser, Beth 1971- Sonstige (DE-588)1188486934 oth Kroehnert, Steffen 1970- Sonstige (DE-588)1188487035 oth Erscheint auch als Online-Ausgabe, Adobe PDF 978-1-119-31397-7 Erscheint auch als Online-Ausgabe, ePub 978-1-119-31398-4 |
| spellingShingle | Advances in embedded and fan-out wafer-level packaging technologies Chip scale packaging Integrated circuits / Wafer-scale integration Chip scale packaging fast Integrated circuits / Wafer-scale integration fast Wafer level packaging (DE-588)1058582143 gnd |
| subject_GND | (DE-588)1058582143 |
| title | Advances in embedded and fan-out wafer-level packaging technologies |
| title_auth | Advances in embedded and fan-out wafer-level packaging technologies |
| title_exact_search | Advances in embedded and fan-out wafer-level packaging technologies |
| title_full | Advances in embedded and fan-out wafer-level packaging technologies edited by Beth Keser, Ph. D. and Steffen Kröhnert |
| title_fullStr | Advances in embedded and fan-out wafer-level packaging technologies edited by Beth Keser, Ph. D. and Steffen Kröhnert |
| title_full_unstemmed | Advances in embedded and fan-out wafer-level packaging technologies edited by Beth Keser, Ph. D. and Steffen Kröhnert |
| title_short | Advances in embedded and fan-out wafer-level packaging technologies |
| title_sort | advances in embedded and fan out wafer level packaging technologies |
| topic | Chip scale packaging Integrated circuits / Wafer-scale integration Chip scale packaging fast Integrated circuits / Wafer-scale integration fast Wafer level packaging (DE-588)1058582143 gnd |
| topic_facet | Chip scale packaging Integrated circuits / Wafer-scale integration Wafer level packaging |
| work_keys_str_mv | AT keserbeth advancesinembeddedandfanoutwaferlevelpackagingtechnologies AT kroehnertsteffen advancesinembeddedandfanoutwaferlevelpackagingtechnologies |