Advances in embedded and fan-out wafer-level packaging technologies:
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Hoboken, NJ
Wiley, IEEE Press
[2019]
|
| Schlagworte: | |
| Beschreibung: | xxvii, 548 Seiten Illustrationen, Diagramme |
| ISBN: | 9781119314134 |
Internformat
MARC
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| 020 | |a 9781119314134 |c hardcover |9 978-1-119-31413-4 | ||
| 035 | |a (OCoLC)1091668910 | ||
| 035 | |a (DE-599)BVBBV045502893 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-29T |a DE-83 | ||
| 084 | |a ZN 4192 |0 (DE-625)157372: |2 rvk | ||
| 245 | 1 | 0 | |a Advances in embedded and fan-out wafer-level packaging technologies |c edited by Beth Keser, Ph. D. and Steffen Kröhnert |
| 264 | 1 | |a Hoboken, NJ |b Wiley, IEEE Press |c [2019] | |
| 300 | |a xxvii, 548 Seiten |b Illustrationen, Diagramme | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 650 | 4 | |a Chip scale packaging | |
| 650 | 4 | |a Integrated circuits / Wafer-scale integration | |
| 650 | 7 | |a Chip scale packaging |2 fast | |
| 650 | 7 | |a Integrated circuits / Wafer-scale integration |2 fast | |
| 650 | 0 | 7 | |a Wafer level packaging |0 (DE-588)1058582143 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Wafer level packaging |0 (DE-588)1058582143 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Keser, Beth |d 1971- |e Sonstige |0 (DE-588)1188486934 |4 oth | |
| 700 | 1 | |a Kroehnert, Steffen |d 1970- |e Sonstige |0 (DE-588)1188487035 |4 oth | |
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| 999 | |a oai:aleph.bib-bvb.de:BVB01-030887565 | ||
Datensatz im Suchindex
| _version_ | 1804179439654797312 |
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| any_adam_object | |
| author_GND | (DE-588)1188486934 (DE-588)1188487035 |
| building | Verbundindex |
| bvnumber | BV045502893 |
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| ctrlnum | (OCoLC)1091668910 (DE-599)BVBBV045502893 |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV045502893 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T08:19:53Z |
| institution | BVB |
| isbn | 9781119314134 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030887565 |
| oclc_num | 1091668910 |
| open_access_boolean | |
| owner | DE-29T DE-83 |
| owner_facet | DE-29T DE-83 |
| physical | xxvii, 548 Seiten Illustrationen, Diagramme |
| publishDate | 2019 |
| publishDateSearch | 2019 |
| publishDateSort | 2019 |
| publisher | Wiley, IEEE Press |
| record_format | marc |
| spelling | Advances in embedded and fan-out wafer-level packaging technologies edited by Beth Keser, Ph. D. and Steffen Kröhnert Hoboken, NJ Wiley, IEEE Press [2019] xxvii, 548 Seiten Illustrationen, Diagramme txt rdacontent n rdamedia nc rdacarrier Chip scale packaging Integrated circuits / Wafer-scale integration Chip scale packaging fast Integrated circuits / Wafer-scale integration fast Wafer level packaging (DE-588)1058582143 gnd rswk-swf Wafer level packaging (DE-588)1058582143 s DE-604 Keser, Beth 1971- Sonstige (DE-588)1188486934 oth Kroehnert, Steffen 1970- Sonstige (DE-588)1188487035 oth Erscheint auch als Online-Ausgabe, Adobe PDF 978-1-119-31397-7 Erscheint auch als Online-Ausgabe, ePub 978-1-119-31398-4 |
| spellingShingle | Advances in embedded and fan-out wafer-level packaging technologies Chip scale packaging Integrated circuits / Wafer-scale integration Chip scale packaging fast Integrated circuits / Wafer-scale integration fast Wafer level packaging (DE-588)1058582143 gnd |
| subject_GND | (DE-588)1058582143 |
| title | Advances in embedded and fan-out wafer-level packaging technologies |
| title_auth | Advances in embedded and fan-out wafer-level packaging technologies |
| title_exact_search | Advances in embedded and fan-out wafer-level packaging technologies |
| title_full | Advances in embedded and fan-out wafer-level packaging technologies edited by Beth Keser, Ph. D. and Steffen Kröhnert |
| title_fullStr | Advances in embedded and fan-out wafer-level packaging technologies edited by Beth Keser, Ph. D. and Steffen Kröhnert |
| title_full_unstemmed | Advances in embedded and fan-out wafer-level packaging technologies edited by Beth Keser, Ph. D. and Steffen Kröhnert |
| title_short | Advances in embedded and fan-out wafer-level packaging technologies |
| title_sort | advances in embedded and fan out wafer level packaging technologies |
| topic | Chip scale packaging Integrated circuits / Wafer-scale integration Chip scale packaging fast Integrated circuits / Wafer-scale integration fast Wafer level packaging (DE-588)1058582143 gnd |
| topic_facet | Chip scale packaging Integrated circuits / Wafer-scale integration Wafer level packaging |
| work_keys_str_mv | AT keserbeth advancesinembeddedandfanoutwaferlevelpackagingtechnologies AT kroehnertsteffen advancesinembeddedandfanoutwaferlevelpackagingtechnologies |