Rapid thermal processing and beyond: applications in semiconductor processing : special topic volume : selected papers from RTP specialists all over the world, Dornstadt, Germany
Saved in:
| Format: | Electronic eBook |
|---|---|
| Language: | English |
| Published: |
Stafa-Zurich, Switzerland ; United Kingdom ; Enfield, NH
Trans-Tech Publications
2008
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| Series: | Materials science forum
v. 573-574 |
| Subjects: | |
| Item Description: | Print version record |
| Physical Description: | 1 online resource (xvi, 432 pages) iil |
| ISBN: | 9783038131731 3038131733 |
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MARC
| LEADER | 00000nmm a2200000zcb4500 | ||
|---|---|---|---|
| 001 | BV045345094 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 181206s2008 |||| o||u| ||||||eng d | ||
| 020 | |a 9783038131731 |9 978-3-03813-173-1 | ||
| 020 | |a 3038131733 |9 3-03813-173-3 | ||
| 035 | |a (ZDB-4-ENC)ocn825768179 | ||
| 035 | |a (OCoLC)825768179 | ||
| 035 | |a (DE-599)BVBBV045345094 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 082 | 0 | |a 621.38152 |2 22 | |
| 245 | 1 | 0 | |a Rapid thermal processing and beyond |b applications in semiconductor processing : special topic volume : selected papers from RTP specialists all over the world, Dornstadt, Germany |c edited by W. Lerch and J. Niess |
| 264 | 1 | |a Stafa-Zurich, Switzerland ; United Kingdom ; Enfield, NH |b Trans-Tech Publications |c 2008 | |
| 300 | |a 1 online resource (xvi, 432 pages) |b iil | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 490 | 0 | |a Materials science forum |v v. 573-574 | |
| 500 | |a Print version record | ||
| 505 | 8 | |a Heat-treatment and thermal annealing are very common processing steps which have been employed during semiconductor manufacturing right from the beginning of integrated circuit technology. In order to minimize undesired diffusion, and other thermal budget-dependent effects, the trend has been to reduce the annealing time sharply by switching from standard furnace batch-processing (involving several hours or even days), to rapid thermal processing involving soaking times of just a few seconds. This transition from thermal equilibrium, to highly non-equilibrium, processing was very challenging a | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING / Electronics / Semiconductors |2 bisacsh | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING / Electronics / Solid State |2 bisacsh | |
| 650 | 7 | |a Rapid thermal processing |2 fast | |
| 650 | 7 | |a Semiconductors / Thermal properties |2 fast | |
| 650 | 4 | |a Rapid thermal processing |a Semiconductors |x Thermal properties | |
| 700 | 1 | |a Lerch, W. |e Sonstige |4 oth | |
| 700 | 1 | |a Niess, J. |e Sonstige |4 oth | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |t Rapid thermal processing and beyond |d Stafa-Zurich, Switzerland ; United Kingdom ; Enfield, NH : Trans-Tech Publications, 2008 |z 0878493913 |
| 912 | |a ZDB-4-ENC | ||
| 999 | |a oai:aleph.bib-bvb.de:BVB01-030731796 | ||
Record in the Search Index
| _version_ | 1804179165522427904 |
|---|---|
| any_adam_object | |
| building | Verbundindex |
| bvnumber | BV045345094 |
| collection | ZDB-4-ENC |
| contents | Heat-treatment and thermal annealing are very common processing steps which have been employed during semiconductor manufacturing right from the beginning of integrated circuit technology. In order to minimize undesired diffusion, and other thermal budget-dependent effects, the trend has been to reduce the annealing time sharply by switching from standard furnace batch-processing (involving several hours or even days), to rapid thermal processing involving soaking times of just a few seconds. This transition from thermal equilibrium, to highly non-equilibrium, processing was very challenging a |
| ctrlnum | (ZDB-4-ENC)ocn825768179 (OCoLC)825768179 (DE-599)BVBBV045345094 |
| dewey-full | 621.38152 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.38152 |
| dewey-search | 621.38152 |
| dewey-sort | 3621.38152 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02340nmm a2200409zcb4500</leader><controlfield tag="001">BV045345094</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">181206s2008 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783038131731</subfield><subfield code="9">978-3-03813-173-1</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">3038131733</subfield><subfield code="9">3-03813-173-3</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-4-ENC)ocn825768179</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)825768179</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV045345094</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.38152</subfield><subfield code="2">22</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Rapid thermal processing and beyond</subfield><subfield code="b">applications in semiconductor processing : special topic volume : selected papers from RTP specialists all over the world, Dornstadt, Germany</subfield><subfield code="c">edited by W. Lerch and J. Niess</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Stafa-Zurich, Switzerland ; United Kingdom ; Enfield, NH</subfield><subfield code="b">Trans-Tech Publications</subfield><subfield code="c">2008</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 online resource (xvi, 432 pages)</subfield><subfield code="b">iil</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Materials science forum</subfield><subfield code="v">v. 573-574</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Print version record</subfield></datafield><datafield tag="505" ind1="8" ind2=" "><subfield code="a">Heat-treatment and thermal annealing are very common processing steps which have been employed during semiconductor manufacturing right from the beginning of integrated circuit technology. In order to minimize undesired diffusion, and other thermal budget-dependent effects, the trend has been to reduce the annealing time sharply by switching from standard furnace batch-processing (involving several hours or even days), to rapid thermal processing involving soaking times of just a few seconds. This transition from thermal equilibrium, to highly non-equilibrium, processing was very challenging a</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING / Electronics / Semiconductors</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING / Electronics / Solid State</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Rapid thermal processing</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Semiconductors / Thermal properties</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Rapid thermal processing</subfield><subfield code="a">Semiconductors</subfield><subfield code="x">Thermal properties</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Lerch, W.</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Niess, J.</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="t">Rapid thermal processing and beyond</subfield><subfield code="d">Stafa-Zurich, Switzerland ; United Kingdom ; Enfield, NH : Trans-Tech Publications, 2008</subfield><subfield code="z">0878493913</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-4-ENC</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-030731796</subfield></datafield></record></collection> |
| id | DE-604.BV045345094 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:15:32Z |
| institution | BVB |
| isbn | 9783038131731 3038131733 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030731796 |
| oclc_num | 825768179 |
| open_access_boolean | |
| physical | 1 online resource (xvi, 432 pages) iil |
| psigel | ZDB-4-ENC |
| publishDate | 2008 |
| publishDateSearch | 2008 |
| publishDateSort | 2008 |
| publisher | Trans-Tech Publications |
| record_format | marc |
| series2 | Materials science forum |
| spelling | Rapid thermal processing and beyond applications in semiconductor processing : special topic volume : selected papers from RTP specialists all over the world, Dornstadt, Germany edited by W. Lerch and J. Niess Stafa-Zurich, Switzerland ; United Kingdom ; Enfield, NH Trans-Tech Publications 2008 1 online resource (xvi, 432 pages) iil txt rdacontent c rdamedia cr rdacarrier Materials science forum v. 573-574 Print version record Heat-treatment and thermal annealing are very common processing steps which have been employed during semiconductor manufacturing right from the beginning of integrated circuit technology. In order to minimize undesired diffusion, and other thermal budget-dependent effects, the trend has been to reduce the annealing time sharply by switching from standard furnace batch-processing (involving several hours or even days), to rapid thermal processing involving soaking times of just a few seconds. This transition from thermal equilibrium, to highly non-equilibrium, processing was very challenging a TECHNOLOGY & ENGINEERING / Electronics / Semiconductors bisacsh TECHNOLOGY & ENGINEERING / Electronics / Solid State bisacsh Rapid thermal processing fast Semiconductors / Thermal properties fast Rapid thermal processing Semiconductors Thermal properties Lerch, W. Sonstige oth Niess, J. Sonstige oth Erscheint auch als Druck-Ausgabe Rapid thermal processing and beyond Stafa-Zurich, Switzerland ; United Kingdom ; Enfield, NH : Trans-Tech Publications, 2008 0878493913 |
| spellingShingle | Rapid thermal processing and beyond applications in semiconductor processing : special topic volume : selected papers from RTP specialists all over the world, Dornstadt, Germany Heat-treatment and thermal annealing are very common processing steps which have been employed during semiconductor manufacturing right from the beginning of integrated circuit technology. In order to minimize undesired diffusion, and other thermal budget-dependent effects, the trend has been to reduce the annealing time sharply by switching from standard furnace batch-processing (involving several hours or even days), to rapid thermal processing involving soaking times of just a few seconds. This transition from thermal equilibrium, to highly non-equilibrium, processing was very challenging a TECHNOLOGY & ENGINEERING / Electronics / Semiconductors bisacsh TECHNOLOGY & ENGINEERING / Electronics / Solid State bisacsh Rapid thermal processing fast Semiconductors / Thermal properties fast Rapid thermal processing Semiconductors Thermal properties |
| title | Rapid thermal processing and beyond applications in semiconductor processing : special topic volume : selected papers from RTP specialists all over the world, Dornstadt, Germany |
| title_auth | Rapid thermal processing and beyond applications in semiconductor processing : special topic volume : selected papers from RTP specialists all over the world, Dornstadt, Germany |
| title_exact_search | Rapid thermal processing and beyond applications in semiconductor processing : special topic volume : selected papers from RTP specialists all over the world, Dornstadt, Germany |
| title_full | Rapid thermal processing and beyond applications in semiconductor processing : special topic volume : selected papers from RTP specialists all over the world, Dornstadt, Germany edited by W. Lerch and J. Niess |
| title_fullStr | Rapid thermal processing and beyond applications in semiconductor processing : special topic volume : selected papers from RTP specialists all over the world, Dornstadt, Germany edited by W. Lerch and J. Niess |
| title_full_unstemmed | Rapid thermal processing and beyond applications in semiconductor processing : special topic volume : selected papers from RTP specialists all over the world, Dornstadt, Germany edited by W. Lerch and J. Niess |
| title_short | Rapid thermal processing and beyond |
| title_sort | rapid thermal processing and beyond applications in semiconductor processing special topic volume selected papers from rtp specialists all over the world dornstadt germany |
| title_sub | applications in semiconductor processing : special topic volume : selected papers from RTP specialists all over the world, Dornstadt, Germany |
| topic | TECHNOLOGY & ENGINEERING / Electronics / Semiconductors bisacsh TECHNOLOGY & ENGINEERING / Electronics / Solid State bisacsh Rapid thermal processing fast Semiconductors / Thermal properties fast Rapid thermal processing Semiconductors Thermal properties |
| topic_facet | TECHNOLOGY & ENGINEERING / Electronics / Semiconductors TECHNOLOGY & ENGINEERING / Electronics / Solid State Rapid thermal processing Semiconductors / Thermal properties Rapid thermal processing Semiconductors Thermal properties |
| work_keys_str_mv | AT lerchw rapidthermalprocessingandbeyondapplicationsinsemiconductorprocessingspecialtopicvolumeselectedpapersfromrtpspecialistsallovertheworlddornstadtgermany AT niessj rapidthermalprocessingandbeyondapplicationsinsemiconductorprocessingspecialtopicvolumeselectedpapersfromrtpspecialistsallovertheworlddornstadtgermany |