APA (7th ed.) Citation

Kuo, W., Chien, W. K., & Kim, T. (1998). Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development. Springer US. https://doi.org/10.1007/978-1-4615-5671-8

Chicago Style (17th ed.) Citation

Kuo, Way, Wei-Ting Kary Chien, and Taeho Kim. Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development. Boston, MA: Springer US, 1998. https://doi.org/10.1007/978-1-4615-5671-8.

MLA (9th ed.) Citation

Kuo, Way, et al. Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturing & Software Development. Springer US, 1998. https://doi.org/10.1007/978-1-4615-5671-8.