Fine Pitch Surface Mount Technology: Quality, Design, and Manufacturing Techniques
Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Ma...
Gespeichert in:
| 1. Verfasser: | |
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| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Boston, MA
Springer US
1992
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| Schlagworte: | |
| Online-Zugang: | BTU01 Volltext |
| Zusammenfassung: | Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Many of us who have spent a significant amount of time developing the process and design techniques for these fine pitchpackages haveconcluded that these techniquesgobeyondthose commonly useed for SMT. In 1987 the presentauthor, convincedofthe uniqueness ofthe assembly and design demands ofthese packages, chaired ajoint committee where the members agreed to use fine pitch technology (FPT) as the defining term for these demands. The committee was unique in several ways, one being that it was the first time three U. S. standards organizations, the IPC (Lincolnwood, IL), theEIA(Washington, D. C. ),and theASTM (Philadelphia),cametogether tocreate standards before a technology was in high demand. The term fine pitch technology and its acronym FPT have since become widely accepted in the electronics industry. The knowledge of the terms and demands of FPT currently exceed the usage of FPT packaged components, but this is changing rapidly because of the size, performance, and cost savings of FPT. I have resisted several past invitations to write other technical texts. However, I feel there are important advantages and significant difficulties to be encountered with FPT. |
| Beschreibung: | 1 Online-Ressource (XI, 340 p. 173 illus) |
| ISBN: | 9781461535324 |
| DOI: | 10.1007/978-1-4615-3532-4 |
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| 520 | |a Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Many of us who have spent a significant amount of time developing the process and design techniques for these fine pitchpackages haveconcluded that these techniquesgobeyondthose commonly useed for SMT. In 1987 the presentauthor, convincedofthe uniqueness ofthe assembly and design demands ofthese packages, chaired ajoint committee where the members agreed to use fine pitch technology (FPT) as the defining term for these demands. The committee was unique in several ways, one being that it was the first time three U. S. standards organizations, the IPC (Lincolnwood, IL), theEIA(Washington, D. C. ),and theASTM (Philadelphia),cametogether tocreate standards before a technology was in high demand. The term fine pitch technology and its acronym FPT have since become widely accepted in the electronics industry. The knowledge of the terms and demands of FPT currently exceed the usage of FPT packaged components, but this is changing rapidly because of the size, performance, and cost savings of FPT. I have resisted several past invitations to write other technical texts. However, I feel there are important advantages and significant difficulties to be encountered with FPT. | ||
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Datensatz im Suchindex
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| author | Marcoux, Phil P. |
| author_facet | Marcoux, Phil P. |
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| dewey-full | 621.3815 |
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| dewey-ones | 621 - Applied physics |
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| dewey-sort | 3621.3815 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| doi_str_mv | 10.1007/978-1-4615-3532-4 |
| format | Electronic eBook |
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| id | DE-604.BV045187099 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:10:58Z |
| institution | BVB |
| isbn | 9781461535324 |
| language | English |
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| spelling | Marcoux, Phil P. Verfasser aut Fine Pitch Surface Mount Technology Quality, Design, and Manufacturing Techniques by Phil P. Marcoux Boston, MA Springer US 1992 1 Online-Ressource (XI, 340 p. 173 illus) txt rdacontent c rdamedia cr rdacarrier Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Many of us who have spent a significant amount of time developing the process and design techniques for these fine pitchpackages haveconcluded that these techniquesgobeyondthose commonly useed for SMT. In 1987 the presentauthor, convincedofthe uniqueness ofthe assembly and design demands ofthese packages, chaired ajoint committee where the members agreed to use fine pitch technology (FPT) as the defining term for these demands. The committee was unique in several ways, one being that it was the first time three U. S. standards organizations, the IPC (Lincolnwood, IL), theEIA(Washington, D. C. ),and theASTM (Philadelphia),cametogether tocreate standards before a technology was in high demand. The term fine pitch technology and its acronym FPT have since become widely accepted in the electronics industry. The knowledge of the terms and demands of FPT currently exceed the usage of FPT packaged components, but this is changing rapidly because of the size, performance, and cost savings of FPT. I have resisted several past invitations to write other technical texts. However, I feel there are important advantages and significant difficulties to be encountered with FPT. Engineering Circuits and Systems Control Structures and Microprogramming Manufacturing, Machines, Tools Electrical Engineering Microprogramming Manufacturing industries Machines Tools Electrical engineering Electronic circuits Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Oberflächenmontage (DE-588)4248071-1 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 s Oberflächenmontage (DE-588)4248071-1 s 1\p DE-604 Erscheint auch als Druck-Ausgabe 9780442008628 https://doi.org/10.1007/978-1-4615-3532-4 Verlag URL des Erstveröffentlichers Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Marcoux, Phil P. Fine Pitch Surface Mount Technology Quality, Design, and Manufacturing Techniques Engineering Circuits and Systems Control Structures and Microprogramming Manufacturing, Machines, Tools Electrical Engineering Microprogramming Manufacturing industries Machines Tools Electrical engineering Electronic circuits Elektronisches Bauelement (DE-588)4014360-0 gnd Oberflächenmontage (DE-588)4248071-1 gnd |
| subject_GND | (DE-588)4014360-0 (DE-588)4248071-1 |
| title | Fine Pitch Surface Mount Technology Quality, Design, and Manufacturing Techniques |
| title_auth | Fine Pitch Surface Mount Technology Quality, Design, and Manufacturing Techniques |
| title_exact_search | Fine Pitch Surface Mount Technology Quality, Design, and Manufacturing Techniques |
| title_full | Fine Pitch Surface Mount Technology Quality, Design, and Manufacturing Techniques by Phil P. Marcoux |
| title_fullStr | Fine Pitch Surface Mount Technology Quality, Design, and Manufacturing Techniques by Phil P. Marcoux |
| title_full_unstemmed | Fine Pitch Surface Mount Technology Quality, Design, and Manufacturing Techniques by Phil P. Marcoux |
| title_short | Fine Pitch Surface Mount Technology |
| title_sort | fine pitch surface mount technology quality design and manufacturing techniques |
| title_sub | Quality, Design, and Manufacturing Techniques |
| topic | Engineering Circuits and Systems Control Structures and Microprogramming Manufacturing, Machines, Tools Electrical Engineering Microprogramming Manufacturing industries Machines Tools Electrical engineering Electronic circuits Elektronisches Bauelement (DE-588)4014360-0 gnd Oberflächenmontage (DE-588)4248071-1 gnd |
| topic_facet | Engineering Circuits and Systems Control Structures and Microprogramming Manufacturing, Machines, Tools Electrical Engineering Microprogramming Manufacturing industries Machines Tools Electrical engineering Electronic circuits Elektronisches Bauelement Oberflächenmontage |
| url | https://doi.org/10.1007/978-1-4615-3532-4 |
| work_keys_str_mv | AT marcouxphilp finepitchsurfacemounttechnologyqualitydesignandmanufacturingtechniques |