Microelectronics Packaging Handbook: Technology Drivers Part I
Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current...
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| Weitere Verfasser: | , , |
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| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Boston, MA
Springer US
1997
|
| Ausgabe: | Second Edition |
| Schlagworte: | |
| Online-Zugang: | BTU01 Volltext |
| Zusammenfassung: | Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level |
| Beschreibung: | 1 Online-Ressource (XXVII, 720 p) |
| ISBN: | 9781461540861 |
| DOI: | 10.1007/978-1-4615-4086-1 |
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| 520 | |a Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level | ||
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| 650 | 4 | |a Circuits and Systems | |
| 650 | 4 | |a Control Structures and Microprogramming | |
| 650 | 4 | |a Manufacturing, Machines, Tools | |
| 650 | 4 | |a Electrical Engineering | |
| 650 | 4 | |a Engineering | |
| 650 | 4 | |a Microprogramming | |
| 650 | 4 | |a Manufacturing industries | |
| 650 | 4 | |a Machines | |
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| 700 | 1 | |a Rymaszewski, Eugene J. |4 edt | |
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| dewey-full | 621.3815 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
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| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| doi_str_mv | 10.1007/978-1-4615-4086-1 |
| edition | Second Edition |
| format | Electronic eBook |
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| id | DE-604.BV045187024 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:10:58Z |
| institution | BVB |
| isbn | 9781461540861 |
| language | English |
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| publishDate | 1997 |
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| spelling | Microelectronics Packaging Handbook Technology Drivers Part I edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein Second Edition Boston, MA Springer US 1997 1 Online-Ressource (XXVII, 720 p) txt rdacontent c rdamedia cr rdacarrier Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level Engineering Circuits and Systems Control Structures and Microprogramming Manufacturing, Machines, Tools Electrical Engineering Microprogramming Manufacturing industries Machines Tools Electrical engineering Electronic circuits Tummala, Rao R. edt Rymaszewski, Eugene J. edt Klopfenstein, Alan G. edt Erscheint auch als Druck-Ausgabe 9781461368298 https://doi.org/10.1007/978-1-4615-4086-1 Verlag URL des Erstveröffentlichers Volltext |
| spellingShingle | Microelectronics Packaging Handbook Technology Drivers Part I Engineering Circuits and Systems Control Structures and Microprogramming Manufacturing, Machines, Tools Electrical Engineering Microprogramming Manufacturing industries Machines Tools Electrical engineering Electronic circuits |
| title | Microelectronics Packaging Handbook Technology Drivers Part I |
| title_auth | Microelectronics Packaging Handbook Technology Drivers Part I |
| title_exact_search | Microelectronics Packaging Handbook Technology Drivers Part I |
| title_full | Microelectronics Packaging Handbook Technology Drivers Part I edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein |
| title_fullStr | Microelectronics Packaging Handbook Technology Drivers Part I edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein |
| title_full_unstemmed | Microelectronics Packaging Handbook Technology Drivers Part I edited by Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein |
| title_short | Microelectronics Packaging Handbook |
| title_sort | microelectronics packaging handbook technology drivers part i |
| title_sub | Technology Drivers Part I |
| topic | Engineering Circuits and Systems Control Structures and Microprogramming Manufacturing, Machines, Tools Electrical Engineering Microprogramming Manufacturing industries Machines Tools Electrical engineering Electronic circuits |
| topic_facet | Engineering Circuits and Systems Control Structures and Microprogramming Manufacturing, Machines, Tools Electrical Engineering Microprogramming Manufacturing industries Machines Tools Electrical engineering Electronic circuits |
| url | https://doi.org/10.1007/978-1-4615-4086-1 |
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