APA (7th ed.) Citation

Tummala, R. R., Rymaszewski, E. J., & Klopfenstein, A. G. (1997). Microelectronics Packaging Handbook: Technology Drivers Part I (Second Edition.). Springer US. https://doi.org/10.1007/978-1-4615-4086-1

Chicago Style (17th ed.) Citation

Tummala, Rao R., Eugene J. Rymaszewski, and Alan G. Klopfenstein. Microelectronics Packaging Handbook: Technology Drivers Part I. Second Edition. Boston, MA: Springer US, 1997. https://doi.org/10.1007/978-1-4615-4086-1.

MLA (9th ed.) Citation

Tummala, Rao R., et al. Microelectronics Packaging Handbook: Technology Drivers Part I. Second Edition. Springer US, 1997. https://doi.org/10.1007/978-1-4615-4086-1.