Chemical-Mechanical Planarization of Semiconductor Materials:
This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and the...
Saved in:
| Other Authors: | |
|---|---|
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Berlin, Heidelberg
Springer Berlin Heidelberg
2004
|
| Series: | Springer Series in Materials Science
69 |
| Subjects: | |
| Online Access: | UBT01 Volltext |
| Summary: | This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed |
| Physical Description: | 1 Online-Ressource (XI, 428 p) |
| ISBN: | 9783662062340 |
| DOI: | 10.1007/978-3-662-06234-0 |
Staff View
MARC
| LEADER | 00000nmm a2200000zcb4500 | ||
|---|---|---|---|
| 001 | BV045152136 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 180828s2004 |||| o||u| ||||||eng d | ||
| 020 | |a 9783662062340 |9 978-3-662-06234-0 | ||
| 024 | 7 | |a 10.1007/978-3-662-06234-0 |2 doi | |
| 035 | |a (ZDB-2-CMS)978-3-662-06234-0 | ||
| 035 | |a (OCoLC)1184497955 | ||
| 035 | |a (DE-599)BVBBV045152136 | ||
| 040 | |a DE-604 |b ger |e aacr | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-703 | ||
| 082 | 0 | |a 620.11 |2 23 | |
| 245 | 1 | 0 | |a Chemical-Mechanical Planarization of Semiconductor Materials |c edited by Michael R. Oliver |
| 264 | 1 | |a Berlin, Heidelberg |b Springer Berlin Heidelberg |c 2004 | |
| 300 | |a 1 Online-Ressource (XI, 428 p) | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 490 | 0 | |a Springer Series in Materials Science |v 69 | |
| 520 | |a This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed | ||
| 650 | 4 | |a Materials Science | |
| 650 | 4 | |a Characterization and Evaluation of Materials | |
| 650 | 4 | |a Electronics and Microelectronics, Instrumentation | |
| 650 | 4 | |a Operating Procedures, Materials Treatment | |
| 650 | 4 | |a Physical Chemistry | |
| 650 | 4 | |a Surfaces and Interfaces, Thin Films | |
| 650 | 4 | |a Optical and Electronic Materials | |
| 650 | 4 | |a Materials science | |
| 650 | 4 | |a Physical chemistry | |
| 650 | 4 | |a Industrial engineering | |
| 650 | 4 | |a Electronics | |
| 650 | 4 | |a Microelectronics | |
| 650 | 4 | |a Optical materials | |
| 650 | 4 | |a Electronic materials | |
| 650 | 4 | |a Materials / Surfaces | |
| 650 | 4 | |a Thin films | |
| 650 | 0 | 7 | |a Chemisches Polieren |0 (DE-588)4227250-6 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Halbleiterwerkstoff |0 (DE-588)4158817-4 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Halbleiterwerkstoff |0 (DE-588)4158817-4 |D s |
| 689 | 0 | 1 | |a Chemisches Polieren |0 (DE-588)4227250-6 |D s |
| 689 | 0 | |8 1\p |5 DE-604 | |
| 700 | 1 | |a Oliver, Michael R. |4 edt | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 9783642077388 |
| 856 | 4 | 0 | |u https://doi.org/10.1007/978-3-662-06234-0 |x Verlag |z URL des Erstveröffentlichers |3 Volltext |
| 912 | |a ZDB-2-CMS | ||
| 940 | 1 | |q ZDB-2-CMS_2000/2004 | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-030541804 | ||
| 883 | 1 | |8 1\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
| 966 | e | |u https://doi.org/10.1007/978-3-662-06234-0 |l UBT01 |p ZDB-2-CMS |q ZDB-2-CMS_2000/2004 |x Verlag |3 Volltext | |
Record in the Search Index
| _version_ | 1804178825007857664 |
|---|---|
| any_adam_object | |
| author2 | Oliver, Michael R. |
| author2_role | edt |
| author2_variant | m r o mr mro |
| author_facet | Oliver, Michael R. |
| building | Verbundindex |
| bvnumber | BV045152136 |
| collection | ZDB-2-CMS |
| ctrlnum | (ZDB-2-CMS)978-3-662-06234-0 (OCoLC)1184497955 (DE-599)BVBBV045152136 |
| dewey-full | 620.11 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 620 - Engineering and allied operations |
| dewey-raw | 620.11 |
| dewey-search | 620.11 |
| dewey-sort | 3620.11 |
| dewey-tens | 620 - Engineering and allied operations |
| doi_str_mv | 10.1007/978-3-662-06234-0 |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02856nmm a2200637zcb4500</leader><controlfield tag="001">BV045152136</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">180828s2004 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783662062340</subfield><subfield code="9">978-3-662-06234-0</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/978-3-662-06234-0</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-2-CMS)978-3-662-06234-0</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1184497955</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV045152136</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-703</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">620.11</subfield><subfield code="2">23</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Chemical-Mechanical Planarization of Semiconductor Materials</subfield><subfield code="c">edited by Michael R. Oliver</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Berlin, Heidelberg</subfield><subfield code="b">Springer Berlin Heidelberg</subfield><subfield code="c">2004</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource (XI, 428 p)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Springer Series in Materials Science</subfield><subfield code="v">69</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Materials Science</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Characterization and Evaluation of Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics and Microelectronics, Instrumentation</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Operating Procedures, Materials Treatment</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Physical Chemistry</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Surfaces and Interfaces, Thin Films</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical and Electronic Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Materials science</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Physical chemistry</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Industrial engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microelectronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Materials / Surfaces</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Thin films</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Chemisches Polieren</subfield><subfield code="0">(DE-588)4227250-6</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Halbleiterwerkstoff</subfield><subfield code="0">(DE-588)4158817-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Halbleiterwerkstoff</subfield><subfield code="0">(DE-588)4158817-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Chemisches Polieren</subfield><subfield code="0">(DE-588)4227250-6</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="8">1\p</subfield><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Oliver, Michael R.</subfield><subfield code="4">edt</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">9783642077388</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1007/978-3-662-06234-0</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveröffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-2-CMS</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">ZDB-2-CMS_2000/2004</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-030541804</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">1\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-662-06234-0</subfield><subfield code="l">UBT01</subfield><subfield code="p">ZDB-2-CMS</subfield><subfield code="q">ZDB-2-CMS_2000/2004</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| id | DE-604.BV045152136 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:10:07Z |
| institution | BVB |
| isbn | 9783662062340 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030541804 |
| oclc_num | 1184497955 |
| open_access_boolean | |
| owner | DE-703 |
| owner_facet | DE-703 |
| physical | 1 Online-Ressource (XI, 428 p) |
| psigel | ZDB-2-CMS ZDB-2-CMS_2000/2004 ZDB-2-CMS ZDB-2-CMS_2000/2004 |
| publishDate | 2004 |
| publishDateSearch | 2004 |
| publishDateSort | 2004 |
| publisher | Springer Berlin Heidelberg |
| record_format | marc |
| series2 | Springer Series in Materials Science |
| spelling | Chemical-Mechanical Planarization of Semiconductor Materials edited by Michael R. Oliver Berlin, Heidelberg Springer Berlin Heidelberg 2004 1 Online-Ressource (XI, 428 p) txt rdacontent c rdamedia cr rdacarrier Springer Series in Materials Science 69 This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed Materials Science Characterization and Evaluation of Materials Electronics and Microelectronics, Instrumentation Operating Procedures, Materials Treatment Physical Chemistry Surfaces and Interfaces, Thin Films Optical and Electronic Materials Materials science Physical chemistry Industrial engineering Electronics Microelectronics Optical materials Electronic materials Materials / Surfaces Thin films Chemisches Polieren (DE-588)4227250-6 gnd rswk-swf Halbleiterwerkstoff (DE-588)4158817-4 gnd rswk-swf Halbleiterwerkstoff (DE-588)4158817-4 s Chemisches Polieren (DE-588)4227250-6 s 1\p DE-604 Oliver, Michael R. edt Erscheint auch als Druck-Ausgabe 9783642077388 https://doi.org/10.1007/978-3-662-06234-0 Verlag URL des Erstveröffentlichers Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Chemical-Mechanical Planarization of Semiconductor Materials Materials Science Characterization and Evaluation of Materials Electronics and Microelectronics, Instrumentation Operating Procedures, Materials Treatment Physical Chemistry Surfaces and Interfaces, Thin Films Optical and Electronic Materials Materials science Physical chemistry Industrial engineering Electronics Microelectronics Optical materials Electronic materials Materials / Surfaces Thin films Chemisches Polieren (DE-588)4227250-6 gnd Halbleiterwerkstoff (DE-588)4158817-4 gnd |
| subject_GND | (DE-588)4227250-6 (DE-588)4158817-4 |
| title | Chemical-Mechanical Planarization of Semiconductor Materials |
| title_auth | Chemical-Mechanical Planarization of Semiconductor Materials |
| title_exact_search | Chemical-Mechanical Planarization of Semiconductor Materials |
| title_full | Chemical-Mechanical Planarization of Semiconductor Materials edited by Michael R. Oliver |
| title_fullStr | Chemical-Mechanical Planarization of Semiconductor Materials edited by Michael R. Oliver |
| title_full_unstemmed | Chemical-Mechanical Planarization of Semiconductor Materials edited by Michael R. Oliver |
| title_short | Chemical-Mechanical Planarization of Semiconductor Materials |
| title_sort | chemical mechanical planarization of semiconductor materials |
| topic | Materials Science Characterization and Evaluation of Materials Electronics and Microelectronics, Instrumentation Operating Procedures, Materials Treatment Physical Chemistry Surfaces and Interfaces, Thin Films Optical and Electronic Materials Materials science Physical chemistry Industrial engineering Electronics Microelectronics Optical materials Electronic materials Materials / Surfaces Thin films Chemisches Polieren (DE-588)4227250-6 gnd Halbleiterwerkstoff (DE-588)4158817-4 gnd |
| topic_facet | Materials Science Characterization and Evaluation of Materials Electronics and Microelectronics, Instrumentation Operating Procedures, Materials Treatment Physical Chemistry Surfaces and Interfaces, Thin Films Optical and Electronic Materials Materials science Physical chemistry Industrial engineering Electronics Microelectronics Optical materials Electronic materials Materials / Surfaces Thin films Chemisches Polieren Halbleiterwerkstoff |
| url | https://doi.org/10.1007/978-3-662-06234-0 |
| work_keys_str_mv | AT olivermichaelr chemicalmechanicalplanarizationofsemiconductormaterials |