Lock-in Thermography: Basics and Use for Functional Diagnostics of Electronic Components
The book deals with lock-in thermography as a special variant of the well known IR thermography for all applications where the heat of the sample can be pulsed. Compared to steady-state thermography, the lock-in mode enables a much improved signal/noise ratio (up to 1000x) by signal averaging, a far...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Berlin, Heidelberg
Springer Berlin Heidelberg
2003
|
| Schriftenreihe: | Springer Series in Advanced Microelectronics
10 |
| Schlagworte: | |
| Online-Zugang: | FHI01 BTU01 Volltext |
| Zusammenfassung: | The book deals with lock-in thermography as a special variant of the well known IR thermography for all applications where the heat of the sample can be pulsed. Compared to steady-state thermography, the lock-in mode enables a much improved signal/noise ratio (up to 1000x) by signal averaging, a far better lateral resolution, and it may provide inherent emissivity correction. Thus, it replaces thermal failure analysis previously carried out by using conventional IR microscopy, liquid crystal imaging, or fluorescent microthermal imaging. Various experimental approaches to lock-in thermography are reviewed with special emphasis on the systems developed by the authors themselves. Thus, the book provides a useful introduction to this technique and a helpful guide for scientists and engineers working in electronic device failure analysis. It concludes with a detailed theoretical treatment of the propagation of thermal waves, which is presented as a basis for various applications, e.g., integrated circuits, MOS structures, solar cells and solar modules |
| Beschreibung: | 1 Online-Ressource (VIII, 195 p) |
| ISBN: | 9783662083963 |
| DOI: | 10.1007/978-3-662-08396-3 |
Internformat
MARC
| LEADER | 00000nmm a2200000zcb4500 | ||
|---|---|---|---|
| 001 | BV045149445 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 180827s2003 |||| o||u| ||||||eng d | ||
| 020 | |a 9783662083963 |9 978-3-662-08396-3 | ||
| 024 | 7 | |a 10.1007/978-3-662-08396-3 |2 doi | |
| 035 | |a (ZDB-2-ENG)978-3-662-08396-3 | ||
| 035 | |a (OCoLC)1184504221 | ||
| 035 | |a (DE-599)BVBBV045149445 | ||
| 040 | |a DE-604 |b ger |e aacr | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-573 |a DE-634 | ||
| 082 | 0 | |a 621.381 |2 23 | |
| 100 | 1 | |a Breitenstein, Otwin |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Lock-in Thermography |b Basics and Use for Functional Diagnostics of Electronic Components |c by Otwin Breitenstein, Martin Langenkamp |
| 264 | 1 | |a Berlin, Heidelberg |b Springer Berlin Heidelberg |c 2003 | |
| 300 | |a 1 Online-Ressource (VIII, 195 p) | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 490 | 0 | |a Springer Series in Advanced Microelectronics |v 10 | |
| 520 | |a The book deals with lock-in thermography as a special variant of the well known IR thermography for all applications where the heat of the sample can be pulsed. Compared to steady-state thermography, the lock-in mode enables a much improved signal/noise ratio (up to 1000x) by signal averaging, a far better lateral resolution, and it may provide inherent emissivity correction. Thus, it replaces thermal failure analysis previously carried out by using conventional IR microscopy, liquid crystal imaging, or fluorescent microthermal imaging. Various experimental approaches to lock-in thermography are reviewed with special emphasis on the systems developed by the authors themselves. Thus, the book provides a useful introduction to this technique and a helpful guide for scientists and engineers working in electronic device failure analysis. It concludes with a detailed theoretical treatment of the propagation of thermal waves, which is presented as a basis for various applications, e.g., integrated circuits, MOS structures, solar cells and solar modules | ||
| 650 | 4 | |a Engineering | |
| 650 | 4 | |a Electronics and Microelectronics, Instrumentation | |
| 650 | 4 | |a Measurement Science and Instrumentation | |
| 650 | 4 | |a Optical and Electronic Materials | |
| 650 | 4 | |a Nanotechnology | |
| 650 | 4 | |a Engineering, general | |
| 650 | 4 | |a Engineering | |
| 650 | 4 | |a Physical measurements | |
| 650 | 4 | |a Measurement | |
| 650 | 4 | |a Electronics | |
| 650 | 4 | |a Microelectronics | |
| 650 | 4 | |a Optical materials | |
| 650 | 4 | |a Electronic materials | |
| 650 | 4 | |a Nanotechnology | |
| 650 | 0 | 7 | |a Infrarotthermographie |0 (DE-588)4242353-3 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Prüftechnik |0 (DE-588)4047610-8 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |D s |
| 689 | 0 | 1 | |a Prüftechnik |0 (DE-588)4047610-8 |D s |
| 689 | 0 | |8 1\p |5 DE-604 | |
| 689 | 1 | 0 | |a Infrarotthermographie |0 (DE-588)4242353-3 |D s |
| 689 | 1 | |8 2\p |5 DE-604 | |
| 700 | 1 | |a Langenkamp, Martin |4 aut | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 9783642077852 |
| 856 | 4 | 0 | |u https://doi.org/10.1007/978-3-662-08396-3 |x Verlag |z URL des Erstveröffentlichers |3 Volltext |
| 912 | |a ZDB-2-ENG | ||
| 940 | 1 | |q ZDB-2-ENG_2000/2004 | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-030539143 | ||
| 883 | 1 | |8 1\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
| 883 | 1 | |8 2\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
| 966 | e | |u https://doi.org/10.1007/978-3-662-08396-3 |l FHI01 |p ZDB-2-ENG |q ZDB-2-ENG_2000/2004 |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-662-08396-3 |l BTU01 |p ZDB-2-ENG |q ZDB-2-ENG_Archiv |x Verlag |3 Volltext | |
Datensatz im Suchindex
| _version_ | 1804178821217255424 |
|---|---|
| any_adam_object | |
| author | Breitenstein, Otwin Langenkamp, Martin |
| author_facet | Breitenstein, Otwin Langenkamp, Martin |
| author_role | aut aut |
| author_sort | Breitenstein, Otwin |
| author_variant | o b ob m l ml |
| building | Verbundindex |
| bvnumber | BV045149445 |
| collection | ZDB-2-ENG |
| ctrlnum | (ZDB-2-ENG)978-3-662-08396-3 (OCoLC)1184504221 (DE-599)BVBBV045149445 |
| dewey-full | 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| doi_str_mv | 10.1007/978-3-662-08396-3 |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03749nmm a2200685zcb4500</leader><controlfield tag="001">BV045149445</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">180827s2003 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783662083963</subfield><subfield code="9">978-3-662-08396-3</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/978-3-662-08396-3</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-2-ENG)978-3-662-08396-3</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1184504221</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV045149445</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-573</subfield><subfield code="a">DE-634</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381</subfield><subfield code="2">23</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Breitenstein, Otwin</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Lock-in Thermography</subfield><subfield code="b">Basics and Use for Functional Diagnostics of Electronic Components</subfield><subfield code="c">by Otwin Breitenstein, Martin Langenkamp</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Berlin, Heidelberg</subfield><subfield code="b">Springer Berlin Heidelberg</subfield><subfield code="c">2003</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource (VIII, 195 p)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Springer Series in Advanced Microelectronics</subfield><subfield code="v">10</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">The book deals with lock-in thermography as a special variant of the well known IR thermography for all applications where the heat of the sample can be pulsed. Compared to steady-state thermography, the lock-in mode enables a much improved signal/noise ratio (up to 1000x) by signal averaging, a far better lateral resolution, and it may provide inherent emissivity correction. Thus, it replaces thermal failure analysis previously carried out by using conventional IR microscopy, liquid crystal imaging, or fluorescent microthermal imaging. Various experimental approaches to lock-in thermography are reviewed with special emphasis on the systems developed by the authors themselves. Thus, the book provides a useful introduction to this technique and a helpful guide for scientists and engineers working in electronic device failure analysis. It concludes with a detailed theoretical treatment of the propagation of thermal waves, which is presented as a basis for various applications, e.g., integrated circuits, MOS structures, solar cells and solar modules</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics and Microelectronics, Instrumentation</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Measurement Science and Instrumentation</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical and Electronic Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Nanotechnology</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Engineering, general</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Physical measurements</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Measurement</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microelectronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Nanotechnology</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Infrarotthermographie</subfield><subfield code="0">(DE-588)4242353-3</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Prüftechnik</subfield><subfield code="0">(DE-588)4047610-8</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Elektronisches Bauelement</subfield><subfield code="0">(DE-588)4014360-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Elektronisches Bauelement</subfield><subfield code="0">(DE-588)4014360-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Prüftechnik</subfield><subfield code="0">(DE-588)4047610-8</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="8">1\p</subfield><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="1" ind2="0"><subfield code="a">Infrarotthermographie</subfield><subfield code="0">(DE-588)4242353-3</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2=" "><subfield code="8">2\p</subfield><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Langenkamp, Martin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">9783642077852</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1007/978-3-662-08396-3</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveröffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-2-ENG</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">ZDB-2-ENG_2000/2004</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-030539143</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">1\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">2\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-662-08396-3</subfield><subfield code="l">FHI01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="q">ZDB-2-ENG_2000/2004</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-662-08396-3</subfield><subfield code="l">BTU01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="q">ZDB-2-ENG_Archiv</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| id | DE-604.BV045149445 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:10:03Z |
| institution | BVB |
| isbn | 9783662083963 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030539143 |
| oclc_num | 1184504221 |
| open_access_boolean | |
| owner | DE-573 DE-634 |
| owner_facet | DE-573 DE-634 |
| physical | 1 Online-Ressource (VIII, 195 p) |
| psigel | ZDB-2-ENG ZDB-2-ENG_2000/2004 ZDB-2-ENG ZDB-2-ENG_2000/2004 ZDB-2-ENG ZDB-2-ENG_Archiv |
| publishDate | 2003 |
| publishDateSearch | 2003 |
| publishDateSort | 2003 |
| publisher | Springer Berlin Heidelberg |
| record_format | marc |
| series2 | Springer Series in Advanced Microelectronics |
| spelling | Breitenstein, Otwin Verfasser aut Lock-in Thermography Basics and Use for Functional Diagnostics of Electronic Components by Otwin Breitenstein, Martin Langenkamp Berlin, Heidelberg Springer Berlin Heidelberg 2003 1 Online-Ressource (VIII, 195 p) txt rdacontent c rdamedia cr rdacarrier Springer Series in Advanced Microelectronics 10 The book deals with lock-in thermography as a special variant of the well known IR thermography for all applications where the heat of the sample can be pulsed. Compared to steady-state thermography, the lock-in mode enables a much improved signal/noise ratio (up to 1000x) by signal averaging, a far better lateral resolution, and it may provide inherent emissivity correction. Thus, it replaces thermal failure analysis previously carried out by using conventional IR microscopy, liquid crystal imaging, or fluorescent microthermal imaging. Various experimental approaches to lock-in thermography are reviewed with special emphasis on the systems developed by the authors themselves. Thus, the book provides a useful introduction to this technique and a helpful guide for scientists and engineers working in electronic device failure analysis. It concludes with a detailed theoretical treatment of the propagation of thermal waves, which is presented as a basis for various applications, e.g., integrated circuits, MOS structures, solar cells and solar modules Engineering Electronics and Microelectronics, Instrumentation Measurement Science and Instrumentation Optical and Electronic Materials Nanotechnology Engineering, general Physical measurements Measurement Electronics Microelectronics Optical materials Electronic materials Infrarotthermographie (DE-588)4242353-3 gnd rswk-swf Prüftechnik (DE-588)4047610-8 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 s Prüftechnik (DE-588)4047610-8 s 1\p DE-604 Infrarotthermographie (DE-588)4242353-3 s 2\p DE-604 Langenkamp, Martin aut Erscheint auch als Druck-Ausgabe 9783642077852 https://doi.org/10.1007/978-3-662-08396-3 Verlag URL des Erstveröffentlichers Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk 2\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Breitenstein, Otwin Langenkamp, Martin Lock-in Thermography Basics and Use for Functional Diagnostics of Electronic Components Engineering Electronics and Microelectronics, Instrumentation Measurement Science and Instrumentation Optical and Electronic Materials Nanotechnology Engineering, general Physical measurements Measurement Electronics Microelectronics Optical materials Electronic materials Infrarotthermographie (DE-588)4242353-3 gnd Prüftechnik (DE-588)4047610-8 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd |
| subject_GND | (DE-588)4242353-3 (DE-588)4047610-8 (DE-588)4014360-0 |
| title | Lock-in Thermography Basics and Use for Functional Diagnostics of Electronic Components |
| title_auth | Lock-in Thermography Basics and Use for Functional Diagnostics of Electronic Components |
| title_exact_search | Lock-in Thermography Basics and Use for Functional Diagnostics of Electronic Components |
| title_full | Lock-in Thermography Basics and Use for Functional Diagnostics of Electronic Components by Otwin Breitenstein, Martin Langenkamp |
| title_fullStr | Lock-in Thermography Basics and Use for Functional Diagnostics of Electronic Components by Otwin Breitenstein, Martin Langenkamp |
| title_full_unstemmed | Lock-in Thermography Basics and Use for Functional Diagnostics of Electronic Components by Otwin Breitenstein, Martin Langenkamp |
| title_short | Lock-in Thermography |
| title_sort | lock in thermography basics and use for functional diagnostics of electronic components |
| title_sub | Basics and Use for Functional Diagnostics of Electronic Components |
| topic | Engineering Electronics and Microelectronics, Instrumentation Measurement Science and Instrumentation Optical and Electronic Materials Nanotechnology Engineering, general Physical measurements Measurement Electronics Microelectronics Optical materials Electronic materials Infrarotthermographie (DE-588)4242353-3 gnd Prüftechnik (DE-588)4047610-8 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd |
| topic_facet | Engineering Electronics and Microelectronics, Instrumentation Measurement Science and Instrumentation Optical and Electronic Materials Nanotechnology Engineering, general Physical measurements Measurement Electronics Microelectronics Optical materials Electronic materials Infrarotthermographie Prüftechnik Elektronisches Bauelement |
| url | https://doi.org/10.1007/978-3-662-08396-3 |
| work_keys_str_mv | AT breitensteinotwin lockinthermographybasicsanduseforfunctionaldiagnosticsofelectroniccomponents AT langenkampmartin lockinthermographybasicsanduseforfunctionaldiagnosticsofelectroniccomponents |