Low Dielectric Constant Materials for IC Applications:
Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applicat...
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| Other Authors: | , , |
|---|---|
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Berlin, Heidelberg
Springer Berlin Heidelberg
2003
|
| Series: | Springer Series in Advanced Microelectronics
9 |
| Subjects: | |
| Online Access: | FHI01 BTU01 Volltext |
| Summary: | Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing |
| Physical Description: | 1 Online-Ressource (XIX, 310 p) |
| ISBN: | 9783642559082 |
| DOI: | 10.1007/978-3-642-55908-2 |
Staff View
MARC
| LEADER | 00000nmm a2200000zcb4500 | ||
|---|---|---|---|
| 001 | BV045149307 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 180827s2003 |||| o||u| ||||||eng d | ||
| 020 | |a 9783642559082 |9 978-3-642-55908-2 | ||
| 024 | 7 | |a 10.1007/978-3-642-55908-2 |2 doi | |
| 035 | |a (ZDB-2-ENG)978-3-642-55908-2 | ||
| 035 | |a (OCoLC)1184406824 | ||
| 035 | |a (DE-599)BVBBV045149307 | ||
| 040 | |a DE-604 |b ger |e aacr | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-573 |a DE-634 | ||
| 082 | 0 | |a 621.381 |2 23 | |
| 245 | 1 | 0 | |a Low Dielectric Constant Materials for IC Applications |c edited by Paul S. Ho, Jihperng Jim Leu, Wei William Lee |
| 264 | 1 | |a Berlin, Heidelberg |b Springer Berlin Heidelberg |c 2003 | |
| 300 | |a 1 Online-Ressource (XIX, 310 p) | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 490 | 0 | |a Springer Series in Advanced Microelectronics |v 9 | |
| 520 | |a Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing | ||
| 650 | 4 | |a Engineering | |
| 650 | 4 | |a Electronics and Microelectronics, Instrumentation | |
| 650 | 4 | |a Optical and Electronic Materials | |
| 650 | 4 | |a Characterization and Evaluation of Materials | |
| 650 | 4 | |a Engineering | |
| 650 | 4 | |a Electronics | |
| 650 | 4 | |a Microelectronics | |
| 650 | 4 | |a Optical materials | |
| 650 | 4 | |a Electronic materials | |
| 650 | 4 | |a Materials science | |
| 650 | 0 | 7 | |a Werkstoff |0 (DE-588)4065579-9 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Integrierte Schaltung |0 (DE-588)4027242-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Dielektrische Eigenschaft |0 (DE-588)4149718-1 |2 gnd |9 rswk-swf |
| 655 | 7 | |8 1\p |0 (DE-588)4143413-4 |a Aufsatzsammlung |2 gnd-content | |
| 689 | 0 | 0 | |a Integrierte Schaltung |0 (DE-588)4027242-4 |D s |
| 689 | 0 | 1 | |a Werkstoff |0 (DE-588)4065579-9 |D s |
| 689 | 0 | 2 | |a Dielektrische Eigenschaft |0 (DE-588)4149718-1 |D s |
| 689 | 0 | |8 2\p |5 DE-604 | |
| 700 | 1 | |a Ho, Paul S. |4 edt | |
| 700 | 1 | |a Leu, Jihperng Jim |4 edt | |
| 700 | 1 | |a Lee, Wei William |4 edt | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 9783642632211 |
| 856 | 4 | 0 | |u https://doi.org/10.1007/978-3-642-55908-2 |x Verlag |z URL des Erstveröffentlichers |3 Volltext |
| 912 | |a ZDB-2-ENG | ||
| 940 | 1 | |q ZDB-2-ENG_2000/2004 | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-030539006 | ||
| 883 | 1 | |8 1\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
| 883 | 1 | |8 2\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
| 966 | e | |u https://doi.org/10.1007/978-3-642-55908-2 |l FHI01 |p ZDB-2-ENG |q ZDB-2-ENG_2000/2004 |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-642-55908-2 |l BTU01 |p ZDB-2-ENG |q ZDB-2-ENG_Archiv |x Verlag |3 Volltext | |
Record in the Search Index
| _version_ | 1804178820857593856 |
|---|---|
| any_adam_object | |
| author2 | Ho, Paul S. Leu, Jihperng Jim Lee, Wei William |
| author2_role | edt edt edt |
| author2_variant | p s h ps psh j j l jj jjl w w l ww wwl |
| author_facet | Ho, Paul S. Leu, Jihperng Jim Lee, Wei William |
| building | Verbundindex |
| bvnumber | BV045149307 |
| collection | ZDB-2-ENG |
| ctrlnum | (ZDB-2-ENG)978-3-642-55908-2 (OCoLC)1184406824 (DE-599)BVBBV045149307 |
| dewey-full | 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| doi_str_mv | 10.1007/978-3-642-55908-2 |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03508nmm a2200649zcb4500</leader><controlfield tag="001">BV045149307</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">180827s2003 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783642559082</subfield><subfield code="9">978-3-642-55908-2</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/978-3-642-55908-2</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-2-ENG)978-3-642-55908-2</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1184406824</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV045149307</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-573</subfield><subfield code="a">DE-634</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381</subfield><subfield code="2">23</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Low Dielectric Constant Materials for IC Applications</subfield><subfield code="c">edited by Paul S. Ho, Jihperng Jim Leu, Wei William Lee</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Berlin, Heidelberg</subfield><subfield code="b">Springer Berlin Heidelberg</subfield><subfield code="c">2003</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource (XIX, 310 p)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Springer Series in Advanced Microelectronics</subfield><subfield code="v">9</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics and Microelectronics, Instrumentation</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical and Electronic Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Characterization and Evaluation of Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microelectronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Materials science</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Werkstoff</subfield><subfield code="0">(DE-588)4065579-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Integrierte Schaltung</subfield><subfield code="0">(DE-588)4027242-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Dielektrische Eigenschaft</subfield><subfield code="0">(DE-588)4149718-1</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="8">1\p</subfield><subfield code="0">(DE-588)4143413-4</subfield><subfield code="a">Aufsatzsammlung</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Integrierte Schaltung</subfield><subfield code="0">(DE-588)4027242-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Werkstoff</subfield><subfield code="0">(DE-588)4065579-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">Dielektrische Eigenschaft</subfield><subfield code="0">(DE-588)4149718-1</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="8">2\p</subfield><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Ho, Paul S.</subfield><subfield code="4">edt</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Leu, Jihperng Jim</subfield><subfield code="4">edt</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Lee, Wei William</subfield><subfield code="4">edt</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">9783642632211</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1007/978-3-642-55908-2</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveröffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-2-ENG</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">ZDB-2-ENG_2000/2004</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-030539006</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">1\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">2\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-642-55908-2</subfield><subfield code="l">FHI01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="q">ZDB-2-ENG_2000/2004</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-642-55908-2</subfield><subfield code="l">BTU01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="q">ZDB-2-ENG_Archiv</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| genre | 1\p (DE-588)4143413-4 Aufsatzsammlung gnd-content |
| genre_facet | Aufsatzsammlung |
| id | DE-604.BV045149307 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:10:03Z |
| institution | BVB |
| isbn | 9783642559082 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030539006 |
| oclc_num | 1184406824 |
| open_access_boolean | |
| owner | DE-573 DE-634 |
| owner_facet | DE-573 DE-634 |
| physical | 1 Online-Ressource (XIX, 310 p) |
| psigel | ZDB-2-ENG ZDB-2-ENG_2000/2004 ZDB-2-ENG ZDB-2-ENG_2000/2004 ZDB-2-ENG ZDB-2-ENG_Archiv |
| publishDate | 2003 |
| publishDateSearch | 2003 |
| publishDateSort | 2003 |
| publisher | Springer Berlin Heidelberg |
| record_format | marc |
| series2 | Springer Series in Advanced Microelectronics |
| spelling | Low Dielectric Constant Materials for IC Applications edited by Paul S. Ho, Jihperng Jim Leu, Wei William Lee Berlin, Heidelberg Springer Berlin Heidelberg 2003 1 Online-Ressource (XIX, 310 p) txt rdacontent c rdamedia cr rdacarrier Springer Series in Advanced Microelectronics 9 Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing Engineering Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Characterization and Evaluation of Materials Electronics Microelectronics Optical materials Electronic materials Materials science Werkstoff (DE-588)4065579-9 gnd rswk-swf Integrierte Schaltung (DE-588)4027242-4 gnd rswk-swf Dielektrische Eigenschaft (DE-588)4149718-1 gnd rswk-swf 1\p (DE-588)4143413-4 Aufsatzsammlung gnd-content Integrierte Schaltung (DE-588)4027242-4 s Werkstoff (DE-588)4065579-9 s Dielektrische Eigenschaft (DE-588)4149718-1 s 2\p DE-604 Ho, Paul S. edt Leu, Jihperng Jim edt Lee, Wei William edt Erscheint auch als Druck-Ausgabe 9783642632211 https://doi.org/10.1007/978-3-642-55908-2 Verlag URL des Erstveröffentlichers Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk 2\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Low Dielectric Constant Materials for IC Applications Engineering Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Characterization and Evaluation of Materials Electronics Microelectronics Optical materials Electronic materials Materials science Werkstoff (DE-588)4065579-9 gnd Integrierte Schaltung (DE-588)4027242-4 gnd Dielektrische Eigenschaft (DE-588)4149718-1 gnd |
| subject_GND | (DE-588)4065579-9 (DE-588)4027242-4 (DE-588)4149718-1 (DE-588)4143413-4 |
| title | Low Dielectric Constant Materials for IC Applications |
| title_auth | Low Dielectric Constant Materials for IC Applications |
| title_exact_search | Low Dielectric Constant Materials for IC Applications |
| title_full | Low Dielectric Constant Materials for IC Applications edited by Paul S. Ho, Jihperng Jim Leu, Wei William Lee |
| title_fullStr | Low Dielectric Constant Materials for IC Applications edited by Paul S. Ho, Jihperng Jim Leu, Wei William Lee |
| title_full_unstemmed | Low Dielectric Constant Materials for IC Applications edited by Paul S. Ho, Jihperng Jim Leu, Wei William Lee |
| title_short | Low Dielectric Constant Materials for IC Applications |
| title_sort | low dielectric constant materials for ic applications |
| topic | Engineering Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Characterization and Evaluation of Materials Electronics Microelectronics Optical materials Electronic materials Materials science Werkstoff (DE-588)4065579-9 gnd Integrierte Schaltung (DE-588)4027242-4 gnd Dielektrische Eigenschaft (DE-588)4149718-1 gnd |
| topic_facet | Engineering Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Characterization and Evaluation of Materials Electronics Microelectronics Optical materials Electronic materials Materials science Werkstoff Integrierte Schaltung Dielektrische Eigenschaft Aufsatzsammlung |
| url | https://doi.org/10.1007/978-3-642-55908-2 |
| work_keys_str_mv | AT hopauls lowdielectricconstantmaterialsforicapplications AT leujihperngjim lowdielectricconstantmaterialsforicapplications AT leeweiwilliam lowdielectricconstantmaterialsforicapplications |