Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys:
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS that is designed for solder joint fatigue reliability analysis of electronic packages....
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| Main Authors: | , , |
|---|---|
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Boston, MA
Springer US
2003
|
| Series: | The Springer International Series in Engineering and Computer Science
719 |
| Subjects: | |
| Online Access: | FHI01 BTU01 Volltext |
| Summary: | Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages |
| Physical Description: | 1 Online-Ressource (XX, 185 p) |
| ISBN: | 9781461502555 |
| DOI: | 10.1007/978-1-4615-0255-5 |
Staff View
MARC
| LEADER | 00000nmm a2200000zcb4500 | ||
|---|---|---|---|
| 001 | BV045148817 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 180827s2003 |||| o||u| ||||||eng d | ||
| 020 | |a 9781461502555 |9 978-1-4615-0255-5 | ||
| 024 | 7 | |a 10.1007/978-1-4615-0255-5 |2 doi | |
| 035 | |a (ZDB-2-ENG)978-1-4615-0255-5 | ||
| 035 | |a (OCoLC)1050939840 | ||
| 035 | |a (DE-599)BVBBV045148817 | ||
| 040 | |a DE-604 |b ger |e aacr | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-573 |a DE-634 | ||
| 082 | 0 | |a 670 |2 23 | |
| 100 | 1 | |a Madenci, Erdogan |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys |c by Erdogan Madenci, Ibrahim Guven, Bahattin Kilic |
| 264 | 1 | |a Boston, MA |b Springer US |c 2003 | |
| 300 | |a 1 Online-Ressource (XX, 185 p) | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 490 | 0 | |a The Springer International Series in Engineering and Computer Science |v 719 | |
| 520 | |a Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages | ||
| 650 | 4 | |a Engineering | |
| 650 | 4 | |a Manufacturing, Machines, Tools | |
| 650 | 4 | |a Optical and Electronic Materials | |
| 650 | 4 | |a Electrical Engineering | |
| 650 | 4 | |a Engineering | |
| 650 | 4 | |a Manufacturing industries | |
| 650 | 4 | |a Machines | |
| 650 | 4 | |a Tools | |
| 650 | 4 | |a Electrical engineering | |
| 650 | 4 | |a Optical materials | |
| 650 | 4 | |a Electronic materials | |
| 650 | 0 | 7 | |a Löten |0 (DE-588)4036162-7 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Materialermüdung |0 (DE-588)4074631-8 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Elektrotechnik |0 (DE-588)4014390-9 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Berechnung |0 (DE-588)4120997-7 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Elektrotechnik |0 (DE-588)4014390-9 |D s |
| 689 | 0 | 1 | |a Löten |0 (DE-588)4036162-7 |D s |
| 689 | 0 | 2 | |a Materialermüdung |0 (DE-588)4074631-8 |D s |
| 689 | 0 | 3 | |a Berechnung |0 (DE-588)4120997-7 |D s |
| 689 | 0 | |8 1\p |5 DE-604 | |
| 700 | 1 | |a Guven, Ibrahim |4 aut | |
| 700 | 1 | |a Kilic, Bahattin |4 aut | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 9781461349891 |
| 856 | 4 | 0 | |u https://doi.org/10.1007/978-1-4615-0255-5 |x Verlag |z URL des Erstveröffentlichers |3 Volltext |
| 912 | |a ZDB-2-ENG | ||
| 940 | 1 | |q ZDB-2-ENG_2000/2004 | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-030538516 | ||
| 883 | 1 | |8 1\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
| 966 | e | |u https://doi.org/10.1007/978-1-4615-0255-5 |l FHI01 |p ZDB-2-ENG |q ZDB-2-ENG_2000/2004 |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-1-4615-0255-5 |l BTU01 |p ZDB-2-ENG |q ZDB-2-ENG_Archiv |x Verlag |3 Volltext | |
Record in the Search Index
| _version_ | 1804178819440967680 |
|---|---|
| any_adam_object | |
| author | Madenci, Erdogan Guven, Ibrahim Kilic, Bahattin |
| author_facet | Madenci, Erdogan Guven, Ibrahim Kilic, Bahattin |
| author_role | aut aut aut |
| author_sort | Madenci, Erdogan |
| author_variant | e m em i g ig b k bk |
| building | Verbundindex |
| bvnumber | BV045148817 |
| collection | ZDB-2-ENG |
| ctrlnum | (ZDB-2-ENG)978-1-4615-0255-5 (OCoLC)1050939840 (DE-599)BVBBV045148817 |
| dewey-full | 670 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 670 - Manufacturing |
| dewey-raw | 670 |
| dewey-search | 670 |
| dewey-sort | 3670 |
| dewey-tens | 670 - Manufacturing |
| discipline | Werkstoffwissenschaften / Fertigungstechnik |
| doi_str_mv | 10.1007/978-1-4615-0255-5 |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03268nmm a2200661zcb4500</leader><controlfield tag="001">BV045148817</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">180827s2003 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781461502555</subfield><subfield code="9">978-1-4615-0255-5</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/978-1-4615-0255-5</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-2-ENG)978-1-4615-0255-5</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1050939840</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV045148817</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-573</subfield><subfield code="a">DE-634</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">670</subfield><subfield code="2">23</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Madenci, Erdogan</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys</subfield><subfield code="c">by Erdogan Madenci, Ibrahim Guven, Bahattin Kilic</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Boston, MA</subfield><subfield code="b">Springer US</subfield><subfield code="c">2003</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource (XX, 185 p)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">The Springer International Series in Engineering and Computer Science</subfield><subfield code="v">719</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Manufacturing, Machines, Tools</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical and Electronic Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electrical Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Manufacturing industries</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Machines</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Tools</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electrical engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic materials</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Löten</subfield><subfield code="0">(DE-588)4036162-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Materialermüdung</subfield><subfield code="0">(DE-588)4074631-8</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Elektrotechnik</subfield><subfield code="0">(DE-588)4014390-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Berechnung</subfield><subfield code="0">(DE-588)4120997-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Elektrotechnik</subfield><subfield code="0">(DE-588)4014390-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Löten</subfield><subfield code="0">(DE-588)4036162-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">Materialermüdung</subfield><subfield code="0">(DE-588)4074631-8</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="3"><subfield code="a">Berechnung</subfield><subfield code="0">(DE-588)4120997-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="8">1\p</subfield><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Guven, Ibrahim</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Kilic, Bahattin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">9781461349891</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1007/978-1-4615-0255-5</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveröffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-2-ENG</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">ZDB-2-ENG_2000/2004</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-030538516</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">1\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4615-0255-5</subfield><subfield code="l">FHI01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="q">ZDB-2-ENG_2000/2004</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4615-0255-5</subfield><subfield code="l">BTU01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="q">ZDB-2-ENG_Archiv</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| id | DE-604.BV045148817 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:10:02Z |
| institution | BVB |
| isbn | 9781461502555 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030538516 |
| oclc_num | 1050939840 |
| open_access_boolean | |
| owner | DE-573 DE-634 |
| owner_facet | DE-573 DE-634 |
| physical | 1 Online-Ressource (XX, 185 p) |
| psigel | ZDB-2-ENG ZDB-2-ENG_2000/2004 ZDB-2-ENG ZDB-2-ENG_2000/2004 ZDB-2-ENG ZDB-2-ENG_Archiv |
| publishDate | 2003 |
| publishDateSearch | 2003 |
| publishDateSort | 2003 |
| publisher | Springer US |
| record_format | marc |
| series2 | The Springer International Series in Engineering and Computer Science |
| spelling | Madenci, Erdogan Verfasser aut Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys by Erdogan Madenci, Ibrahim Guven, Bahattin Kilic Boston, MA Springer US 2003 1 Online-Ressource (XX, 185 p) txt rdacontent c rdamedia cr rdacarrier The Springer International Series in Engineering and Computer Science 719 Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages Engineering Manufacturing, Machines, Tools Optical and Electronic Materials Electrical Engineering Manufacturing industries Machines Tools Electrical engineering Optical materials Electronic materials Löten (DE-588)4036162-7 gnd rswk-swf Materialermüdung (DE-588)4074631-8 gnd rswk-swf Elektrotechnik (DE-588)4014390-9 gnd rswk-swf Berechnung (DE-588)4120997-7 gnd rswk-swf Elektrotechnik (DE-588)4014390-9 s Löten (DE-588)4036162-7 s Materialermüdung (DE-588)4074631-8 s Berechnung (DE-588)4120997-7 s 1\p DE-604 Guven, Ibrahim aut Kilic, Bahattin aut Erscheint auch als Druck-Ausgabe 9781461349891 https://doi.org/10.1007/978-1-4615-0255-5 Verlag URL des Erstveröffentlichers Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Madenci, Erdogan Guven, Ibrahim Kilic, Bahattin Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys Engineering Manufacturing, Machines, Tools Optical and Electronic Materials Electrical Engineering Manufacturing industries Machines Tools Electrical engineering Optical materials Electronic materials Löten (DE-588)4036162-7 gnd Materialermüdung (DE-588)4074631-8 gnd Elektrotechnik (DE-588)4014390-9 gnd Berechnung (DE-588)4120997-7 gnd |
| subject_GND | (DE-588)4036162-7 (DE-588)4074631-8 (DE-588)4014390-9 (DE-588)4120997-7 |
| title | Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys |
| title_auth | Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys |
| title_exact_search | Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys |
| title_full | Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys by Erdogan Madenci, Ibrahim Guven, Bahattin Kilic |
| title_fullStr | Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys by Erdogan Madenci, Ibrahim Guven, Bahattin Kilic |
| title_full_unstemmed | Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys by Erdogan Madenci, Ibrahim Guven, Bahattin Kilic |
| title_short | Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys |
| title_sort | fatigue life prediction of solder joints in electronic packages with ansys |
| topic | Engineering Manufacturing, Machines, Tools Optical and Electronic Materials Electrical Engineering Manufacturing industries Machines Tools Electrical engineering Optical materials Electronic materials Löten (DE-588)4036162-7 gnd Materialermüdung (DE-588)4074631-8 gnd Elektrotechnik (DE-588)4014390-9 gnd Berechnung (DE-588)4120997-7 gnd |
| topic_facet | Engineering Manufacturing, Machines, Tools Optical and Electronic Materials Electrical Engineering Manufacturing industries Machines Tools Electrical engineering Optical materials Electronic materials Löten Materialermüdung Elektrotechnik Berechnung |
| url | https://doi.org/10.1007/978-1-4615-0255-5 |
| work_keys_str_mv | AT madencierdogan fatiguelifepredictionofsolderjointsinelectronicpackageswithansys AT guvenibrahim fatiguelifepredictionofsolderjointsinelectronicpackageswithansys AT kilicbahattin fatiguelifepredictionofsolderjointsinelectronicpackageswithansys |