Thin-Film Capacitors for Packaged Electronics:
Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of what's the best one can achiev...
Gespeichert in:
Hauptverfasser: | , |
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Format: | Elektronisch E-Book |
Sprache: | English |
Veröffentlicht: |
Boston, MA
Springer US
2004
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Schlagworte: | |
Online-Zugang: | FHI01 BTU01 Volltext |
Zusammenfassung: | Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of what's the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following: -Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures, -Electrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz), -Process modeling to determine stable operating points, -Prevention of metal (Cu) diffusion into the dielectric, -Measurements and modeling of the dielectric micro-roughness |
Beschreibung: | 1 Online-Ressource (XV, 158 p. 41 illus) |
ISBN: | 9781441991447 |
DOI: | 10.1007/978-1-4419-9144-7 |
Internformat
MARC
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300 | |a 1 Online-Ressource (XV, 158 p. 41 illus) | ||
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520 | |a Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of what's the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following: -Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures, -Electrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz), -Process modeling to determine stable operating points, -Prevention of metal (Cu) diffusion into the dielectric, -Measurements and modeling of the dielectric micro-roughness | ||
650 | 4 | |a Engineering | |
650 | 4 | |a Manufacturing, Machines, Tools | |
650 | 4 | |a Theoretical and Computational Chemistry | |
650 | 4 | |a Electrical Engineering | |
650 | 4 | |a Optical and Electronic Materials | |
650 | 4 | |a Engineering | |
650 | 4 | |a Chemistry, Physical and theoretical | |
650 | 4 | |a Manufacturing industries | |
650 | 4 | |a Machines | |
650 | 4 | |a Tools | |
650 | 4 | |a Electrical engineering | |
650 | 4 | |a Optical materials | |
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Datensatz im Suchindex
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any_adam_object | |
author | Jain, Pushkar Rymaszewski, Eugene J. |
author_facet | Jain, Pushkar Rymaszewski, Eugene J. |
author_role | aut aut |
author_sort | Jain, Pushkar |
author_variant | p j pj e j r ej ejr |
building | Verbundindex |
bvnumber | BV045148703 |
collection | ZDB-2-ENG |
ctrlnum | (ZDB-2-ENG)978-1-4419-9144-7 (OCoLC)1050946926 (DE-599)BVBBV045148703 |
dewey-full | 670 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 670 - Manufacturing |
dewey-raw | 670 |
dewey-search | 670 |
dewey-sort | 3670 |
dewey-tens | 670 - Manufacturing |
discipline | Werkstoffwissenschaften / Fertigungstechnik |
doi_str_mv | 10.1007/978-1-4419-9144-7 |
format | Electronic eBook |
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id | DE-604.BV045148703 |
illustrated | Not Illustrated |
indexdate | 2024-07-10T08:10:01Z |
institution | BVB |
isbn | 9781441991447 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030538402 |
oclc_num | 1050946926 |
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physical | 1 Online-Ressource (XV, 158 p. 41 illus) |
psigel | ZDB-2-ENG ZDB-2-ENG_2000/2004 ZDB-2-ENG ZDB-2-ENG_2000/2004 ZDB-2-ENG ZDB-2-ENG_Archiv |
publishDate | 2004 |
publishDateSearch | 2004 |
publishDateSort | 2004 |
publisher | Springer US |
record_format | marc |
spelling | Jain, Pushkar Verfasser aut Thin-Film Capacitors for Packaged Electronics by Pushkar Jain, Eugene J. Rymaszewski Boston, MA Springer US 2004 1 Online-Ressource (XV, 158 p. 41 illus) txt rdacontent c rdamedia cr rdacarrier Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of what's the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following: -Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures, -Electrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz), -Process modeling to determine stable operating points, -Prevention of metal (Cu) diffusion into the dielectric, -Measurements and modeling of the dielectric micro-roughness Engineering Manufacturing, Machines, Tools Theoretical and Computational Chemistry Electrical Engineering Optical and Electronic Materials Chemistry, Physical and theoretical Manufacturing industries Machines Tools Electrical engineering Optical materials Electronic materials Rymaszewski, Eugene J. aut Erscheint auch als Druck-Ausgabe 9781402077050 https://doi.org/10.1007/978-1-4419-9144-7 Verlag URL des Erstveröffentlichers Volltext |
spellingShingle | Jain, Pushkar Rymaszewski, Eugene J. Thin-Film Capacitors for Packaged Electronics Engineering Manufacturing, Machines, Tools Theoretical and Computational Chemistry Electrical Engineering Optical and Electronic Materials Chemistry, Physical and theoretical Manufacturing industries Machines Tools Electrical engineering Optical materials Electronic materials |
title | Thin-Film Capacitors for Packaged Electronics |
title_auth | Thin-Film Capacitors for Packaged Electronics |
title_exact_search | Thin-Film Capacitors for Packaged Electronics |
title_full | Thin-Film Capacitors for Packaged Electronics by Pushkar Jain, Eugene J. Rymaszewski |
title_fullStr | Thin-Film Capacitors for Packaged Electronics by Pushkar Jain, Eugene J. Rymaszewski |
title_full_unstemmed | Thin-Film Capacitors for Packaged Electronics by Pushkar Jain, Eugene J. Rymaszewski |
title_short | Thin-Film Capacitors for Packaged Electronics |
title_sort | thin film capacitors for packaged electronics |
topic | Engineering Manufacturing, Machines, Tools Theoretical and Computational Chemistry Electrical Engineering Optical and Electronic Materials Chemistry, Physical and theoretical Manufacturing industries Machines Tools Electrical engineering Optical materials Electronic materials |
topic_facet | Engineering Manufacturing, Machines, Tools Theoretical and Computational Chemistry Electrical Engineering Optical and Electronic Materials Chemistry, Physical and theoretical Manufacturing industries Machines Tools Electrical engineering Optical materials Electronic materials |
url | https://doi.org/10.1007/978-1-4419-9144-7 |
work_keys_str_mv | AT jainpushkar thinfilmcapacitorsforpackagedelectronics AT rymaszewskieugenej thinfilmcapacitorsforpackagedelectronics |