MEMS packaging:
Saved in:
| Other Authors: | , , |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
New Jersey
World Scientific
[2018]
|
| Series: | WSPC series in advanced integration and packaging
Vol. 5 |
| Subjects: | |
| Item Description: | Includes bibliographical references and index |
| Physical Description: | xiv, 348 pages Illustrationen, Diagramme |
| ISBN: | 9789813229358 |
Staff View
MARC
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| 082 | 0 | |a 621.381/046 |2 23 | |
| 245 | 1 | 0 | |a MEMS packaging |c editors Y.C. Lee (University of Colorado, Boulder, USA), Yu-Ting Cheng (National Chiao Tung University, Taiwan), Ramesh Ramadoss (IoT Technologies Inc., USA) |
| 264 | 1 | |a New Jersey |b World Scientific |c [2018] | |
| 300 | |a xiv, 348 pages |b Illustrationen, Diagramme | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 1 | |a WSPC series in advanced integration and packaging |v Vol. 5 | |
| 500 | |a Includes bibliographical references and index | ||
| 650 | 4 | |a Microelectromechanical systems | |
| 650 | 4 | |a Microelectronic packaging | |
| 700 | 1 | |a Lee, Y. C. |4 edt | |
| 700 | 1 | |a Cheng, Yu-Ting |4 edt | |
| 700 | 1 | |a Ramadoss, Ramesh |4 edt | |
| 830 | 0 | |a WSPC series in advanced integration and packaging |v Vol. 5 |w (DE-604)BV041357980 |9 5 | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-030301144 | ||
Record in the Search Index
| _version_ | 1804178467034497024 |
|---|---|
| any_adam_object | |
| author2 | Lee, Y. C. Cheng, Yu-Ting Ramadoss, Ramesh |
| author2_role | edt edt edt |
| author2_variant | y c l yc ycl y t c ytc r r rr |
| author_facet | Lee, Y. C. Cheng, Yu-Ting Ramadoss, Ramesh |
| building | Verbundindex |
| bvnumber | BV044907526 |
| callnumber-first | T - Technology |
| callnumber-label | TK7875 |
| callnumber-raw | TK7875 |
| callnumber-search | TK7875 |
| callnumber-sort | TK 47875 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| ctrlnum | (OCoLC)1038730973 (DE-599)BVBBV044907526 |
| dewey-full | 621.381/046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/046 |
| dewey-search | 621.381/046 |
| dewey-sort | 3621.381 246 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV044907526 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T08:04:26Z |
| institution | BVB |
| isbn | 9789813229358 |
| language | English |
| lccn | 017039802 |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030301144 |
| oclc_num | 1038730973 |
| open_access_boolean | |
| owner | DE-29T |
| owner_facet | DE-29T |
| physical | xiv, 348 pages Illustrationen, Diagramme |
| publishDate | 2018 |
| publishDateSearch | 2018 |
| publishDateSort | 2018 |
| publisher | World Scientific |
| record_format | marc |
| series | WSPC series in advanced integration and packaging |
| series2 | WSPC series in advanced integration and packaging |
| spelling | MEMS packaging editors Y.C. Lee (University of Colorado, Boulder, USA), Yu-Ting Cheng (National Chiao Tung University, Taiwan), Ramesh Ramadoss (IoT Technologies Inc., USA) New Jersey World Scientific [2018] xiv, 348 pages Illustrationen, Diagramme txt rdacontent n rdamedia nc rdacarrier WSPC series in advanced integration and packaging Vol. 5 Includes bibliographical references and index Microelectromechanical systems Microelectronic packaging Lee, Y. C. edt Cheng, Yu-Ting edt Ramadoss, Ramesh edt WSPC series in advanced integration and packaging Vol. 5 (DE-604)BV041357980 5 |
| spellingShingle | MEMS packaging WSPC series in advanced integration and packaging Microelectromechanical systems Microelectronic packaging |
| title | MEMS packaging |
| title_auth | MEMS packaging |
| title_exact_search | MEMS packaging |
| title_full | MEMS packaging editors Y.C. Lee (University of Colorado, Boulder, USA), Yu-Ting Cheng (National Chiao Tung University, Taiwan), Ramesh Ramadoss (IoT Technologies Inc., USA) |
| title_fullStr | MEMS packaging editors Y.C. Lee (University of Colorado, Boulder, USA), Yu-Ting Cheng (National Chiao Tung University, Taiwan), Ramesh Ramadoss (IoT Technologies Inc., USA) |
| title_full_unstemmed | MEMS packaging editors Y.C. Lee (University of Colorado, Boulder, USA), Yu-Ting Cheng (National Chiao Tung University, Taiwan), Ramesh Ramadoss (IoT Technologies Inc., USA) |
| title_short | MEMS packaging |
| title_sort | mems packaging |
| topic | Microelectromechanical systems Microelectronic packaging |
| topic_facet | Microelectromechanical systems Microelectronic packaging |
| volume_link | (DE-604)BV041357980 |
| work_keys_str_mv | AT leeyc memspackaging AT chengyuting memspackaging AT ramadossramesh memspackaging |