Handbook of wafer bonding:
Gespeichert in:
| Format: | Elektronisch E-Book |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Weinheim, Germany
Wiley-VCH
2012
|
| Schlagworte: | |
| Beschreibung: | xxxi, 395 p. |
| ISBN: | 9783527326464 9783527644247 |
Internformat
MARC
| LEADER | 00000nmm a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV044847387 | ||
| 003 | DE-604 | ||
| 005 | 20180305 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 180305s2012 |||| o||u| ||||||eng d | ||
| 020 | |a 9783527326464 |9 978-3-527-32646-4 | ||
| 020 | |a 9783527644247 |c Online |9 978-3-527-64424-7 | ||
| 035 | |a (ZDB-38-ESG)ebr10529302 | ||
| 035 | |a (OCoLC)779616373 | ||
| 035 | |a (DE-599)BVBBV044847387 | ||
| 040 | |a DE-604 |b ger |e aacr | ||
| 041 | 0 | |a eng | |
| 245 | 1 | 0 | |a Handbook of wafer bonding |c edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo |
| 264 | 1 | |a Weinheim, Germany |b Wiley-VCH |c 2012 | |
| 300 | |a xxxi, 395 p. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 505 | 8 | |a Includes bibliographical references and index | |
| 505 | 8 | |a pt. 1. Technologies -- pt. 2. Applications | |
| 650 | 4 | |a Semiconductors |x Bonding |v Handbooks, manuals, etc | |
| 650 | 4 | |a Semiconductor wafers | |
| 650 | 4 | |a Microelectromechanical systems |x Design and construction | |
| 650 | 0 | 7 | |a MEMS |0 (DE-588)4824724-8 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Wafer |0 (DE-588)4294605-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Bonden |0 (DE-588)4232594-8 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Wafer |0 (DE-588)4294605-0 |D s |
| 689 | 0 | 1 | |a Bonden |0 (DE-588)4232594-8 |D s |
| 689 | 0 | 2 | |a MEMS |0 (DE-588)4824724-8 |D s |
| 689 | 0 | |8 1\p |5 DE-604 | |
| 700 | 1 | |a Ramm, Peter |e Sonstige |4 oth | |
| 700 | 1 | |a Lu, James Jian-Qiang |e Sonstige |4 oth | |
| 700 | 1 | |a Taklo, Maaike M. V. |e Sonstige |4 oth | |
| 912 | |a ZDB-38-ESG | ||
| 999 | |a oai:aleph.bib-bvb.de:BVB01-030242249 | ||
| 883 | 1 | |8 1\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
Datensatz im Suchindex
| _version_ | 1804178360814796800 |
|---|---|
| any_adam_object | |
| building | Verbundindex |
| bvnumber | BV044847387 |
| collection | ZDB-38-ESG |
| contents | Includes bibliographical references and index pt. 1. Technologies -- pt. 2. Applications |
| ctrlnum | (ZDB-38-ESG)ebr10529302 (OCoLC)779616373 (DE-599)BVBBV044847387 |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01664nmm a2200457zc 4500</leader><controlfield tag="001">BV044847387</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20180305 </controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">180305s2012 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783527326464</subfield><subfield code="9">978-3-527-32646-4</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783527644247</subfield><subfield code="c">Online</subfield><subfield code="9">978-3-527-64424-7</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-38-ESG)ebr10529302</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)779616373</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV044847387</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Handbook of wafer bonding</subfield><subfield code="c">edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Weinheim, Germany</subfield><subfield code="b">Wiley-VCH</subfield><subfield code="c">2012</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">xxxi, 395 p.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="505" ind1="8" ind2=" "><subfield code="a">Includes bibliographical references and index</subfield></datafield><datafield tag="505" ind1="8" ind2=" "><subfield code="a">pt. 1. Technologies -- pt. 2. Applications</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Semiconductors</subfield><subfield code="x">Bonding</subfield><subfield code="v">Handbooks, manuals, etc</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Semiconductor wafers</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microelectromechanical systems</subfield><subfield code="x">Design and construction</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">MEMS</subfield><subfield code="0">(DE-588)4824724-8</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Wafer</subfield><subfield code="0">(DE-588)4294605-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Bonden</subfield><subfield code="0">(DE-588)4232594-8</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Wafer</subfield><subfield code="0">(DE-588)4294605-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Bonden</subfield><subfield code="0">(DE-588)4232594-8</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">MEMS</subfield><subfield code="0">(DE-588)4824724-8</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="8">1\p</subfield><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Ramm, Peter</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Lu, James Jian-Qiang</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Taklo, Maaike M. V.</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-38-ESG</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-030242249</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">1\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield></record></collection> |
| id | DE-604.BV044847387 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:02:44Z |
| institution | BVB |
| isbn | 9783527326464 9783527644247 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030242249 |
| oclc_num | 779616373 |
| open_access_boolean | |
| physical | xxxi, 395 p. |
| psigel | ZDB-38-ESG |
| publishDate | 2012 |
| publishDateSearch | 2012 |
| publishDateSort | 2012 |
| publisher | Wiley-VCH |
| record_format | marc |
| spelling | Handbook of wafer bonding edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo Weinheim, Germany Wiley-VCH 2012 xxxi, 395 p. txt rdacontent c rdamedia cr rdacarrier Includes bibliographical references and index pt. 1. Technologies -- pt. 2. Applications Semiconductors Bonding Handbooks, manuals, etc Semiconductor wafers Microelectromechanical systems Design and construction MEMS (DE-588)4824724-8 gnd rswk-swf Wafer (DE-588)4294605-0 gnd rswk-swf Bonden (DE-588)4232594-8 gnd rswk-swf Wafer (DE-588)4294605-0 s Bonden (DE-588)4232594-8 s MEMS (DE-588)4824724-8 s 1\p DE-604 Ramm, Peter Sonstige oth Lu, James Jian-Qiang Sonstige oth Taklo, Maaike M. V. Sonstige oth 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Handbook of wafer bonding Includes bibliographical references and index pt. 1. Technologies -- pt. 2. Applications Semiconductors Bonding Handbooks, manuals, etc Semiconductor wafers Microelectromechanical systems Design and construction MEMS (DE-588)4824724-8 gnd Wafer (DE-588)4294605-0 gnd Bonden (DE-588)4232594-8 gnd |
| subject_GND | (DE-588)4824724-8 (DE-588)4294605-0 (DE-588)4232594-8 |
| title | Handbook of wafer bonding |
| title_auth | Handbook of wafer bonding |
| title_exact_search | Handbook of wafer bonding |
| title_full | Handbook of wafer bonding edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo |
| title_fullStr | Handbook of wafer bonding edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo |
| title_full_unstemmed | Handbook of wafer bonding edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo |
| title_short | Handbook of wafer bonding |
| title_sort | handbook of wafer bonding |
| topic | Semiconductors Bonding Handbooks, manuals, etc Semiconductor wafers Microelectromechanical systems Design and construction MEMS (DE-588)4824724-8 gnd Wafer (DE-588)4294605-0 gnd Bonden (DE-588)4232594-8 gnd |
| topic_facet | Semiconductors Bonding Handbooks, manuals, etc Semiconductor wafers Microelectromechanical systems Design and construction MEMS Wafer Bonden |
| work_keys_str_mv | AT rammpeter handbookofwaferbonding AT lujamesjianqiang handbookofwaferbonding AT taklomaaikemv handbookofwaferbonding |