Modeling and simulation for microelectronic packaging assembly: manufacturing, reliability and testing
Saved in:
| Main Author: | |
|---|---|
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Hoboken, N.J.
Wiley
2011
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| Subjects: | |
| Online Access: | Buchcover |
| Physical Description: | xxii, 564 p. |
| ISBN: | 9780470827826 9780470828410 9781118082829 9780470827819 |
Staff View
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| 100 | 1 | |a Liu, S. |d 1963- |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Modeling and simulation for microelectronic packaging assembly |b manufacturing, reliability and testing |c Sheng Liu, Yong Liu |
| 264 | 1 | |a Hoboken, N.J. |b Wiley |c 2011 | |
| 300 | |a xxii, 564 p. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
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| 505 | 8 | |a Includes bibliographical references and index | |
| 505 | 8 | |a pt. 1. Mechanics and modeling -- pt. 2. Modeling in microelectronic packaging and assembly -- pt. 3. Modeling in microelectronic package reliability and test -- pt. 4. Modern modeling and simulation methodologies : application to nano packaging | |
| 505 | 8 | |a "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- | |
| 650 | 4 | |a Microelectronic packaging |x Simulation methods | |
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| contents | Includes bibliographical references and index pt. 1. Mechanics and modeling -- pt. 2. Modeling in microelectronic packaging and assembly -- pt. 3. Modeling in microelectronic package reliability and test -- pt. 4. Modern modeling and simulation methodologies : application to nano packaging "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- |
| ctrlnum | (ZDB-38-ESG)ebr10494525 (OCoLC)756280855 (DE-599)BVBBV044846255 |
| dewey-full | 621.381/046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/046 |
| dewey-search | 621.381/046 |
| dewey-sort | 3621.381 246 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
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| id | DE-604.BV044846255 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:02:42Z |
| institution | BVB |
| isbn | 9780470827826 9780470828410 9781118082829 9780470827819 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030241117 |
| oclc_num | 756280855 |
| open_access_boolean | |
| physical | xxii, 564 p. |
| psigel | ZDB-38-ESG |
| publishDate | 2011 |
| publishDateSearch | 2011 |
| publishDateSort | 2011 |
| publisher | Wiley |
| record_format | marc |
| spelling | Liu, S. 1963- Verfasser aut Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing Sheng Liu, Yong Liu Hoboken, N.J. Wiley 2011 xxii, 564 p. txt rdacontent c rdamedia cr rdacarrier Includes bibliographical references and index pt. 1. Mechanics and modeling -- pt. 2. Modeling in microelectronic packaging and assembly -- pt. 3. Modeling in microelectronic package reliability and test -- pt. 4. Modern modeling and simulation methodologies : application to nano packaging "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- Microelectronic packaging Simulation methods Liu, Yong 1962- Sonstige oth Erscheint auch als Druck-Ausgabe, Hardcover 978-0-470-82780-2 SWB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=030241117&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Buchcover |
| spellingShingle | Liu, S. 1963- Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing Includes bibliographical references and index pt. 1. Mechanics and modeling -- pt. 2. Modeling in microelectronic packaging and assembly -- pt. 3. Modeling in microelectronic package reliability and test -- pt. 4. Modern modeling and simulation methodologies : application to nano packaging "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- Microelectronic packaging Simulation methods |
| title | Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing |
| title_auth | Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing |
| title_exact_search | Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing |
| title_full | Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing Sheng Liu, Yong Liu |
| title_fullStr | Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing Sheng Liu, Yong Liu |
| title_full_unstemmed | Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing Sheng Liu, Yong Liu |
| title_short | Modeling and simulation for microelectronic packaging assembly |
| title_sort | modeling and simulation for microelectronic packaging assembly manufacturing reliability and testing |
| title_sub | manufacturing, reliability and testing |
| topic | Microelectronic packaging Simulation methods |
| topic_facet | Microelectronic packaging Simulation methods |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=030241117&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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