APA (7th ed.) Citation

Liu, S. (2011). Modeling and simulation for microelectronic packaging assembly: Manufacturing, reliability and testing. Wiley.

Chicago Style (17th ed.) Citation

Liu, S. Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing. Hoboken, N.J: Wiley, 2011.

MLA (9th ed.) Citation

Liu, S. Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing. Wiley, 2011.

Warning: These citations may not always be 100% accurate.