Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging:
Gespeichert in:
| Format: | Elektronisch E-Book |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Bradford, England
Emerald Group Publishing
c2006
|
| Schlagworte: | |
| Beschreibung: | 72 p |
| ISBN: | 184663010X |
Internformat
MARC
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| 245 | 1 | 0 | |a Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging |c guest editors Christopher Bailey and Johan Liu |
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Datensatz im Suchindex
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| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:02:24Z |
| institution | BVB |
| isbn | 184663010X |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030230228 |
| oclc_num | 133162498 |
| open_access_boolean | |
| physical | 72 p |
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| publishDate | 2006 |
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| publisher | Emerald Group Publishing |
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| spelling | Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging guest editors Christopher Bailey and Johan Liu Bradford, England Emerald Group Publishing c2006 72 p txt rdacontent c rdamedia cr rdacarrier Manufacturing processes Electronic packaging Bailey, Christopher Sonstige oth Liu, Johan Sonstige oth |
| spellingShingle | Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging Manufacturing processes Electronic packaging |
| title | Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging |
| title_auth | Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging |
| title_exact_search | Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging |
| title_full | Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging guest editors Christopher Bailey and Johan Liu |
| title_fullStr | Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging guest editors Christopher Bailey and Johan Liu |
| title_full_unstemmed | Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging guest editors Christopher Bailey and Johan Liu |
| title_short | Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging |
| title_sort | advanced manufacturing process lead free interconnect materials and reliability modeling for electronics packaging |
| topic | Manufacturing processes Electronic packaging |
| topic_facet | Manufacturing processes Electronic packaging |
| work_keys_str_mv | AT baileychristopher advancedmanufacturingprocessleadfreeinterconnectmaterialsandreliabilitymodelingforelectronicspackaging AT liujohan advancedmanufacturingprocessleadfreeinterconnectmaterialsandreliabilitymodelingforelectronicspackaging |