Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging:
Gespeichert in:
Format: | Elektronisch E-Book |
---|---|
Sprache: | English |
Veröffentlicht: |
Bradford, England
Emerald Group Publishing
c2006
|
Schlagworte: | |
Beschreibung: | 72 p |
ISBN: | 184663010X |
Internformat
MARC
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245 | 1 | 0 | |a Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging |c guest editors Christopher Bailey and Johan Liu |
264 | 1 | |a Bradford, England |b Emerald Group Publishing |c c2006 | |
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700 | 1 | |a Bailey, Christopher |e Sonstige |4 oth | |
700 | 1 | |a Liu, Johan |e Sonstige |4 oth | |
912 | |a ZDB-38-ESG | ||
999 | |a oai:aleph.bib-bvb.de:BVB01-030230228 |
Datensatz im Suchindex
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illustrated | Not Illustrated |
indexdate | 2024-07-10T08:02:24Z |
institution | BVB |
isbn | 184663010X |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030230228 |
oclc_num | 133162498 |
open_access_boolean | |
physical | 72 p |
psigel | ZDB-38-ESG |
publishDate | 2006 |
publishDateSearch | 2006 |
publishDateSort | 2006 |
publisher | Emerald Group Publishing |
record_format | marc |
spelling | Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging guest editors Christopher Bailey and Johan Liu Bradford, England Emerald Group Publishing c2006 72 p txt rdacontent c rdamedia cr rdacarrier Manufacturing processes Electronic packaging Bailey, Christopher Sonstige oth Liu, Johan Sonstige oth |
spellingShingle | Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging Manufacturing processes Electronic packaging |
title | Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging |
title_auth | Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging |
title_exact_search | Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging |
title_full | Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging guest editors Christopher Bailey and Johan Liu |
title_fullStr | Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging guest editors Christopher Bailey and Johan Liu |
title_full_unstemmed | Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging guest editors Christopher Bailey and Johan Liu |
title_short | Advanced manufacturing process, lead free interconnect materials and reliability modeling for electronics packaging |
title_sort | advanced manufacturing process lead free interconnect materials and reliability modeling for electronics packaging |
topic | Manufacturing processes Electronic packaging |
topic_facet | Manufacturing processes Electronic packaging |
work_keys_str_mv | AT baileychristopher advancedmanufacturingprocessleadfreeinterconnectmaterialsandreliabilitymodelingforelectronicspackaging AT liujohan advancedmanufacturingprocessleadfreeinterconnectmaterialsandreliabilitymodelingforelectronicspackaging |