Lead finishing in semiconductor devices: soldering
This monograph provides an insight review on semiconductor device lead soldering process where various process and material controls are discussed with the aim of achieving zero defect soldering. Quality problems like solderability and visual mechanical problems are discussed and ways to overcome ar...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Singapore
World Scientific Pub. Co.
c1989
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| Schlagworte: | |
| Online-Zugang: | FHN01 Volltext |
| Zusammenfassung: | This monograph provides an insight review on semiconductor device lead soldering process where various process and material controls are discussed with the aim of achieving zero defect soldering. Quality problems like solderability and visual mechanical problems are discussed and ways to overcome are suggested. Related topics like the corrosion in the microelectronic devices (chip corrosion and lead tarnishing), various techniques like ion chromatography and surface techniques are presented in terms of their applications in the areas of semiconductor device assembly |
| Beschreibung: | xxi, 245 p. ill |
| ISBN: | 9789814503327 |
Internformat
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| 520 | |a This monograph provides an insight review on semiconductor device lead soldering process where various process and material controls are discussed with the aim of achieving zero defect soldering. Quality problems like solderability and visual mechanical problems are discussed and ways to overcome are suggested. Related topics like the corrosion in the microelectronic devices (chip corrosion and lead tarnishing), various techniques like ion chromatography and surface techniques are presented in terms of their applications in the areas of semiconductor device assembly | ||
| 650 | 4 | |a Electronic apparatus and appliances / Design and construction | |
| 650 | 4 | |a Solder and soldering | |
| 650 | 4 | |a Semiconductors | |
| 650 | 4 | |a Electric connectors | |
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Datensatz im Suchindex
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| author | Tan, A. C. |
| author_facet | Tan, A. C. |
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| author_sort | Tan, A. C. |
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| building | Verbundindex |
| bvnumber | BV044639372 |
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| dewey-full | 673.456 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 673 - Nonferrous metals |
| dewey-raw | 673.456 |
| dewey-search | 673.456 |
| dewey-sort | 3673.456 |
| dewey-tens | 670 - Manufacturing |
| discipline | Werkstoffwissenschaften / Fertigungstechnik Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
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| id | DE-604.BV044639372 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T07:57:55Z |
| institution | BVB |
| isbn | 9789814503327 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030037345 |
| oclc_num | 988734081 |
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| physical | xxi, 245 p. ill |
| psigel | ZDB-124-WOP ZDB-124-WOP FHN_PDA_WOP |
| publishDate | 1989 |
| publishDateSearch | 1989 |
| publishDateSort | 1989 |
| publisher | World Scientific Pub. Co. |
| record_format | marc |
| spelling | Tan, A. C. Verfasser aut Lead finishing in semiconductor devices soldering A.C. Tan Singapore World Scientific Pub. Co. c1989 xxi, 245 p. ill txt rdacontent c rdamedia cr rdacarrier This monograph provides an insight review on semiconductor device lead soldering process where various process and material controls are discussed with the aim of achieving zero defect soldering. Quality problems like solderability and visual mechanical problems are discussed and ways to overcome are suggested. Related topics like the corrosion in the microelectronic devices (chip corrosion and lead tarnishing), various techniques like ion chromatography and surface techniques are presented in terms of their applications in the areas of semiconductor device assembly Electronic apparatus and appliances / Design and construction Solder and soldering Semiconductors Electric connectors Gedruckte Schaltung (DE-588)4019627-6 gnd rswk-swf Elektrolöten (DE-588)4122130-8 gnd rswk-swf Gedruckte Schaltung (DE-588)4019627-6 s Elektrolöten (DE-588)4122130-8 s 1\p DE-604 Erscheint auch als Druck-Ausgabe 9789971506797 Erscheint auch als Druck-Ausgabe 9971506793 http://www.worldscientific.com/worldscibooks/10.1142/0672#t=toc Verlag URL des Erstveroeffentlichers Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Tan, A. C. Lead finishing in semiconductor devices soldering Electronic apparatus and appliances / Design and construction Solder and soldering Semiconductors Electric connectors Gedruckte Schaltung (DE-588)4019627-6 gnd Elektrolöten (DE-588)4122130-8 gnd |
| subject_GND | (DE-588)4019627-6 (DE-588)4122130-8 |
| title | Lead finishing in semiconductor devices soldering |
| title_auth | Lead finishing in semiconductor devices soldering |
| title_exact_search | Lead finishing in semiconductor devices soldering |
| title_full | Lead finishing in semiconductor devices soldering A.C. Tan |
| title_fullStr | Lead finishing in semiconductor devices soldering A.C. Tan |
| title_full_unstemmed | Lead finishing in semiconductor devices soldering A.C. Tan |
| title_short | Lead finishing in semiconductor devices |
| title_sort | lead finishing in semiconductor devices soldering |
| title_sub | soldering |
| topic | Electronic apparatus and appliances / Design and construction Solder and soldering Semiconductors Electric connectors Gedruckte Schaltung (DE-588)4019627-6 gnd Elektrolöten (DE-588)4122130-8 gnd |
| topic_facet | Electronic apparatus and appliances / Design and construction Solder and soldering Semiconductors Electric connectors Gedruckte Schaltung Elektrolöten |
| url | http://www.worldscientific.com/worldscibooks/10.1142/0672#t=toc |
| work_keys_str_mv | AT tanac leadfinishinginsemiconductordevicessoldering |