Encyclopedia of thermal packaging, Vol. 6, Thermal packaging techniques:
This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students stu...
Saved in:
| Main Author: | |
|---|---|
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Singapore
World Scientific Pub. Co.
c2013
|
| Subjects: | |
| Online Access: | FHN01 Volltext |
| Summary: | This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering |
| Physical Description: | xvii, 286 p. ill. (some col.) |
| ISBN: | 9789814313797 |
Staff View
MARC
| LEADER | 00000nmm a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV044638140 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 171120s2013 |||| o||u| ||||||eng d | ||
| 020 | |a 9789814313797 |c electronic bk. |9 978-981-4313-79-7 | ||
| 024 | 7 | |a 10.1142/7819-vol6 |2 doi | |
| 035 | |a (ZDB-124-WOP)00002865 | ||
| 035 | |a (OCoLC)1012664618 | ||
| 035 | |a (DE-599)BVBBV044638140 | ||
| 040 | |a DE-604 |b ger |e aacr | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-92 | ||
| 082 | 0 | |a 621.381046 |2 22 | |
| 100 | 1 | |a Solbrekken, Gary Lawrence |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Encyclopedia of thermal packaging, Vol. 6, Thermal packaging techniques |c Gary L Solbrekken |
| 264 | 1 | |a Singapore |b World Scientific Pub. Co. |c c2013 | |
| 300 | |a xvii, 286 p. |b ill. (some col.) | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 520 | |a This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering | ||
| 650 | 4 | |a Electronic packaging | |
| 650 | 4 | |a Insulation (Heat) | |
| 650 | 4 | |a Electronic measurements | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 9789814313780 (set 1) |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 9789814327626 (set 1 : v. 6) |
| 856 | 4 | 0 | |u http://www.worldscientific.com/worldscibooks/10.1142/7819-vol6#t=toc |x Verlag |z URL des Erstveroeffentlichers |3 Volltext |
| 912 | |a ZDB-124-WOP | ||
| 999 | |a oai:aleph.bib-bvb.de:BVB01-030036114 | ||
| 966 | e | |u http://www.worldscientific.com/worldscibooks/10.1142/7819-vol6#t=toc |l FHN01 |p ZDB-124-WOP |q FHN_PDA_WOP |x Verlag |3 Volltext | |
Record in the Search Index
| _version_ | 1804178054461784064 |
|---|---|
| any_adam_object | |
| author | Solbrekken, Gary Lawrence |
| author_facet | Solbrekken, Gary Lawrence |
| author_role | aut |
| author_sort | Solbrekken, Gary Lawrence |
| author_variant | g l s gl gls |
| building | Verbundindex |
| bvnumber | BV044638140 |
| collection | ZDB-124-WOP |
| ctrlnum | (ZDB-124-WOP)00002865 (OCoLC)1012664618 (DE-599)BVBBV044638140 |
| dewey-full | 621.381046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381046 |
| dewey-search | 621.381046 |
| dewey-sort | 3621.381046 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01851nmm a2200397zc 4500</leader><controlfield tag="001">BV044638140</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">171120s2013 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9789814313797</subfield><subfield code="c">electronic bk.</subfield><subfield code="9">978-981-4313-79-7</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1142/7819-vol6</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-124-WOP)00002865</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1012664618</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV044638140</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-92</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381046</subfield><subfield code="2">22</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Solbrekken, Gary Lawrence</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Encyclopedia of thermal packaging, Vol. 6, Thermal packaging techniques</subfield><subfield code="c">Gary L Solbrekken</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Singapore</subfield><subfield code="b">World Scientific Pub. Co.</subfield><subfield code="c">c2013</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">xvii, 286 p.</subfield><subfield code="b">ill. (some col.)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic packaging</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Insulation (Heat)</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic measurements</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">9789814313780 (set 1)</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">9789814327626 (set 1 : v. 6)</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">http://www.worldscientific.com/worldscibooks/10.1142/7819-vol6#t=toc</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveroeffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-124-WOP</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-030036114</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">http://www.worldscientific.com/worldscibooks/10.1142/7819-vol6#t=toc</subfield><subfield code="l">FHN01</subfield><subfield code="p">ZDB-124-WOP</subfield><subfield code="q">FHN_PDA_WOP</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| id | DE-604.BV044638140 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T07:57:52Z |
| institution | BVB |
| isbn | 9789814313797 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030036114 |
| oclc_num | 1012664618 |
| open_access_boolean | |
| owner | DE-92 |
| owner_facet | DE-92 |
| physical | xvii, 286 p. ill. (some col.) |
| psigel | ZDB-124-WOP ZDB-124-WOP FHN_PDA_WOP |
| publishDate | 2013 |
| publishDateSearch | 2013 |
| publishDateSort | 2013 |
| publisher | World Scientific Pub. Co. |
| record_format | marc |
| spelling | Solbrekken, Gary Lawrence Verfasser aut Encyclopedia of thermal packaging, Vol. 6, Thermal packaging techniques Gary L Solbrekken Singapore World Scientific Pub. Co. c2013 xvii, 286 p. ill. (some col.) txt rdacontent c rdamedia cr rdacarrier This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering Electronic packaging Insulation (Heat) Electronic measurements Erscheint auch als Druck-Ausgabe 9789814313780 (set 1) Erscheint auch als Druck-Ausgabe 9789814327626 (set 1 : v. 6) http://www.worldscientific.com/worldscibooks/10.1142/7819-vol6#t=toc Verlag URL des Erstveroeffentlichers Volltext |
| spellingShingle | Solbrekken, Gary Lawrence Encyclopedia of thermal packaging, Vol. 6, Thermal packaging techniques Electronic packaging Insulation (Heat) Electronic measurements |
| title | Encyclopedia of thermal packaging, Vol. 6, Thermal packaging techniques |
| title_auth | Encyclopedia of thermal packaging, Vol. 6, Thermal packaging techniques |
| title_exact_search | Encyclopedia of thermal packaging, Vol. 6, Thermal packaging techniques |
| title_full | Encyclopedia of thermal packaging, Vol. 6, Thermal packaging techniques Gary L Solbrekken |
| title_fullStr | Encyclopedia of thermal packaging, Vol. 6, Thermal packaging techniques Gary L Solbrekken |
| title_full_unstemmed | Encyclopedia of thermal packaging, Vol. 6, Thermal packaging techniques Gary L Solbrekken |
| title_short | Encyclopedia of thermal packaging, Vol. 6, Thermal packaging techniques |
| title_sort | encyclopedia of thermal packaging vol 6 thermal packaging techniques |
| topic | Electronic packaging Insulation (Heat) Electronic measurements |
| topic_facet | Electronic packaging Insulation (Heat) Electronic measurements |
| url | http://www.worldscientific.com/worldscibooks/10.1142/7819-vol6#t=toc |
| work_keys_str_mv | AT solbrekkengarylawrence encyclopediaofthermalpackagingvol6thermalpackagingtechniques |