Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect:
Saved in:
| Main Author: | |
|---|---|
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Singapore
Springer Singapore
2018
|
| Series: | Springer Theses, Recognizing Outstanding Ph.D. Research
|
| Subjects: | |
| Online Access: | BTU01 FAW01 FHA01 FHI01 FHM01 FHN01 FHR01 FKE01 FLA01 FRO01 FWS01 FWS02 HTW01 TUM01 UBY01 Volltext |
| Physical Description: | 1 Online-Ressource (XVIII, 137 p. 103 illus) |
| ISBN: | 9789811061653 |
| ISSN: | 2190-5053 |
| DOI: | 10.1007/978-981-10-6165-3 |
Staff View
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Record in the Search Index
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| any_adam_object | |
| author | Cheng, Jie |
| author_facet | Cheng, Jie |
| author_role | aut |
| author_sort | Cheng, Jie |
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| dewey-tens | 670 - Manufacturing |
| discipline | Elektrotechnik Werkstoffwissenschaften / Fertigungstechnik Maschinenbau |
| doi_str_mv | 10.1007/978-981-10-6165-3 |
| format | Electronic eBook |
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| id | DE-604.BV044530648 |
| illustrated | Not Illustrated |
| indexdate | 2025-02-20T06:55:07Z |
| institution | BVB |
| isbn | 9789811061653 |
| issn | 2190-5053 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029929938 |
| oclc_num | 1011412007 |
| open_access_boolean | |
| owner | DE-861 DE-1046 DE-898 DE-BY-UBR DE-92 DE-M347 DE-859 DE-Aug4 DE-862 DE-BY-FWS DE-863 DE-BY-FWS DE-634 DE-523 DE-706 DE-91 DE-BY-TUM DE-860 DE-573 |
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| physical | 1 Online-Ressource (XVIII, 137 p. 103 illus) |
| psigel | ZDB-2-ENG ZDB-2-ENG_2018 |
| publishDate | 2018 |
| publishDateSearch | 2018 |
| publishDateSort | 2018 |
| publisher | Springer Singapore |
| record_format | marc |
| series2 | Springer Theses, Recognizing Outstanding Ph.D. Research |
| spellingShingle | Cheng, Jie Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect Engineering Manufacturing industries Machines Tools Electronics Microelectronics Tribology Corrosion and anti-corrosives Coatings Manufacturing, Machines, Tools Tribology, Corrosion and Coatings Electronics and Microelectronics, Instrumentation Ingenieurwissenschaften |
| title | Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect |
| title_auth | Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect |
| title_exact_search | Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect |
| title_full | Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect by Jie Cheng |
| title_fullStr | Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect by Jie Cheng |
| title_full_unstemmed | Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect by Jie Cheng |
| title_short | Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect |
| title_sort | research on chemical mechanical polishing mechanism of novel diffusion barrier ru for cu interconnect |
| topic | Engineering Manufacturing industries Machines Tools Electronics Microelectronics Tribology Corrosion and anti-corrosives Coatings Manufacturing, Machines, Tools Tribology, Corrosion and Coatings Electronics and Microelectronics, Instrumentation Ingenieurwissenschaften |
| topic_facet | Engineering Manufacturing industries Machines Tools Electronics Microelectronics Tribology Corrosion and anti-corrosives Coatings Manufacturing, Machines, Tools Tribology, Corrosion and Coatings Electronics and Microelectronics, Instrumentation Ingenieurwissenschaften |
| url | https://doi.org/10.1007/978-981-10-6165-3 |
| work_keys_str_mv | AT chengjie researchonchemicalmechanicalpolishingmechanismofnoveldiffusionbarrierruforcuinterconnect |