APA (7th ed.) Citation

Cheng, J. (2018). Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect. Springer Singapore. https://doi.org/10.1007/978-981-10-6165-3

Chicago Style (17th ed.) Citation

Cheng, Jie. Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect. Singapore: Springer Singapore, 2018. https://doi.org/10.1007/978-981-10-6165-3.

MLA (9th ed.) Citation

Cheng, Jie. Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect. Springer Singapore, 2018. https://doi.org/10.1007/978-981-10-6165-3.