Advances in chemical mechanical planarization (CMP):
Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planar...
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| Other Authors: | |
|---|---|
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Waltham, MA
Woodhead Publishing
[2016]
|
| Series: | Woodhead Publishing series in electronic and optical materials
number 86 |
| Subjects: | |
| Online Access: | FAW01 FLA01 Volltext |
| Summary: | Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction |
| Item Description: | Includes bibliographical references and index |
| Physical Description: | 1 online resource |
| ISBN: | 9780081002186 0081002181 9780081001653 |
Staff View
MARC
| LEADER | 00000nmm a2200000zcb4500 | ||
|---|---|---|---|
| 001 | BV044392287 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 170630s2016 |||| o||u| ||||||eng d | ||
| 020 | |a 9780081002186 |9 978-0-08-100218-6 | ||
| 020 | |a 0081002181 |9 0-08-100218-1 | ||
| 020 | |a 9780081001653 |9 978-0-08-100165-3 | ||
| 035 | |a (ZDB-33-ESD)ocn934626626 | ||
| 035 | |a (OCoLC)934626626 | ||
| 035 | |a (DE-599)BVBBV044392287 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-1046 | ||
| 082 | 0 | |a 621.381 |2 23 | |
| 245 | 1 | 0 | |a Advances in chemical mechanical planarization (CMP) |c edited by Suryadevara Babu |
| 264 | 1 | |a Waltham, MA |b Woodhead Publishing |c [2016] | |
| 264 | 4 | |c © 2016 | |
| 300 | |a 1 online resource | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 490 | 0 | |a Woodhead Publishing series in electronic and optical materials |v number 86 | |
| 500 | |a Includes bibliographical references and index | ||
| 520 | |a Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction | ||
| 650 | 7 | |a TECHNOLOGY & ENGINEERING / Mechanical |2 bisacsh | |
| 650 | 7 | |a Chemical mechanical planarization |2 fast | |
| 650 | 7 | |a Microelectronics |2 fast | |
| 650 | 7 | |a Nanoelectronics |2 fast | |
| 650 | 4 | |a Chemical mechanical planarization | |
| 650 | 4 | |a Nanoelectronics | |
| 650 | 4 | |a Microelectronics | |
| 700 | 1 | |a Babu, S. V. |4 edt | |
| 856 | 4 | 0 | |u http://www.sciencedirect.com/science/book/9780081001653 |x Verlag |z URL des Erstveröffentlichers |3 Volltext |
| 912 | |a ZDB-33-ESD |a ZDB-33-EBS | ||
| 999 | |a oai:aleph.bib-bvb.de:BVB01-029794509 | ||
| 966 | e | |u http://www.sciencedirect.com/science/book/9780081001653 |l FAW01 |p ZDB-33-ESD |q FAW_PDA_ESD |x Verlag |3 Volltext | |
| 966 | e | |u http://www.sciencedirect.com/science/book/9780081001653 |l FLA01 |p ZDB-33-ESD |q FLA_PDA_ESD |x Verlag |3 Volltext | |
Record in the Search Index
| _version_ | 1804177666425749504 |
|---|---|
| any_adam_object | |
| author2 | Babu, S. V. |
| author2_role | edt |
| author2_variant | s v b sv svb |
| author_facet | Babu, S. V. |
| building | Verbundindex |
| bvnumber | BV044392287 |
| collection | ZDB-33-ESD ZDB-33-EBS |
| ctrlnum | (ZDB-33-ESD)ocn934626626 (OCoLC)934626626 (DE-599)BVBBV044392287 |
| dewey-full | 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03046nmm a2200481zcb4500</leader><controlfield tag="001">BV044392287</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">170630s2016 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9780081002186</subfield><subfield code="9">978-0-08-100218-6</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0081002181</subfield><subfield code="9">0-08-100218-1</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9780081001653</subfield><subfield code="9">978-0-08-100165-3</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-33-ESD)ocn934626626</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)934626626</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV044392287</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-1046</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381</subfield><subfield code="2">23</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Advances in chemical mechanical planarization (CMP)</subfield><subfield code="c">edited by Suryadevara Babu</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Waltham, MA</subfield><subfield code="b">Woodhead Publishing</subfield><subfield code="c">[2016]</subfield></datafield><datafield tag="264" ind1=" " ind2="4"><subfield code="c">© 2016</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 online resource</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Woodhead Publishing series in electronic and optical materials</subfield><subfield code="v">number 86</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references and index</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING / Mechanical</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Chemical mechanical planarization</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Microelectronics</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Nanoelectronics</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Chemical mechanical planarization</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Nanoelectronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microelectronics</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Babu, S. V.</subfield><subfield code="4">edt</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">http://www.sciencedirect.com/science/book/9780081001653</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveröffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-33-ESD</subfield><subfield code="a">ZDB-33-EBS</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-029794509</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">http://www.sciencedirect.com/science/book/9780081001653</subfield><subfield code="l">FAW01</subfield><subfield code="p">ZDB-33-ESD</subfield><subfield code="q">FAW_PDA_ESD</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">http://www.sciencedirect.com/science/book/9780081001653</subfield><subfield code="l">FLA01</subfield><subfield code="p">ZDB-33-ESD</subfield><subfield code="q">FLA_PDA_ESD</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| id | DE-604.BV044392287 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T07:51:42Z |
| institution | BVB |
| isbn | 9780081002186 0081002181 9780081001653 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029794509 |
| oclc_num | 934626626 |
| open_access_boolean | |
| owner | DE-1046 |
| owner_facet | DE-1046 |
| physical | 1 online resource |
| psigel | ZDB-33-ESD ZDB-33-EBS ZDB-33-ESD FAW_PDA_ESD ZDB-33-ESD FLA_PDA_ESD |
| publishDate | 2016 |
| publishDateSearch | 2016 |
| publishDateSort | 2016 |
| publisher | Woodhead Publishing |
| record_format | marc |
| series2 | Woodhead Publishing series in electronic and optical materials |
| spelling | Advances in chemical mechanical planarization (CMP) edited by Suryadevara Babu Waltham, MA Woodhead Publishing [2016] © 2016 1 online resource txt rdacontent c rdamedia cr rdacarrier Woodhead Publishing series in electronic and optical materials number 86 Includes bibliographical references and index Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction TECHNOLOGY & ENGINEERING / Mechanical bisacsh Chemical mechanical planarization fast Microelectronics fast Nanoelectronics fast Chemical mechanical planarization Nanoelectronics Microelectronics Babu, S. V. edt http://www.sciencedirect.com/science/book/9780081001653 Verlag URL des Erstveröffentlichers Volltext |
| spellingShingle | Advances in chemical mechanical planarization (CMP) TECHNOLOGY & ENGINEERING / Mechanical bisacsh Chemical mechanical planarization fast Microelectronics fast Nanoelectronics fast Chemical mechanical planarization Nanoelectronics Microelectronics |
| title | Advances in chemical mechanical planarization (CMP) |
| title_auth | Advances in chemical mechanical planarization (CMP) |
| title_exact_search | Advances in chemical mechanical planarization (CMP) |
| title_full | Advances in chemical mechanical planarization (CMP) edited by Suryadevara Babu |
| title_fullStr | Advances in chemical mechanical planarization (CMP) edited by Suryadevara Babu |
| title_full_unstemmed | Advances in chemical mechanical planarization (CMP) edited by Suryadevara Babu |
| title_short | Advances in chemical mechanical planarization (CMP) |
| title_sort | advances in chemical mechanical planarization cmp |
| topic | TECHNOLOGY & ENGINEERING / Mechanical bisacsh Chemical mechanical planarization fast Microelectronics fast Nanoelectronics fast Chemical mechanical planarization Nanoelectronics Microelectronics |
| topic_facet | TECHNOLOGY & ENGINEERING / Mechanical Chemical mechanical planarization Microelectronics Nanoelectronics |
| url | http://www.sciencedirect.com/science/book/9780081001653 |
| work_keys_str_mv | AT babusv advancesinchemicalmechanicalplanarizationcmp |