Robust design of microelectronics assemblies against mechanical shock, temperature and moisture:
This book discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. De...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Cambridge, UK
Woodhead Publishing
[2015]
|
| Schriftenreihe: | Woodhead Publishing series in electronic and optical materials
no. 81 |
| Schlagworte: | |
| Online-Zugang: | FAW01 FLA01 Volltext |
| Zusammenfassung: | This book discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. Detailed chapters cover: temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. -- |
| Beschreibung: | Includes bibliographical references and index |
| Beschreibung: | 1 online resource |
| ISBN: | 9780857099112 0857099116 9781845695286 |
Internformat
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Datensatz im Suchindex
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| dewey-search | 621.3815 |
| dewey-sort | 3621.3815 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
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| id | DE-604.BV044391936 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T07:51:41Z |
| institution | BVB |
| isbn | 9780857099112 0857099116 9781845695286 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029794158 |
| oclc_num | 910159095 |
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| owner_facet | DE-1046 |
| physical | 1 online resource |
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| publishDate | 2015 |
| publishDateSearch | 2015 |
| publishDateSort | 2015 |
| publisher | Woodhead Publishing |
| record_format | marc |
| series2 | Woodhead Publishing series in electronic and optical materials |
| spelling | Wong, E-H. Verfasser aut Robust design of microelectronics assemblies against mechanical shock, temperature and moisture E.-H. Wong and Y.-W. Mai Cambridge, UK Woodhead Publishing [2015] 1 online resource txt rdacontent c rdamedia cr rdacarrier Woodhead Publishing series in electronic and optical materials no. 81 Includes bibliographical references and index This book discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. Detailed chapters cover: temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. -- TECHNOLOGY & ENGINEERING / Mechanical bisacsh TECHNOLOGY & ENGINEERING / Electronics / Microelectronics bisacsh Computer engineering fast Microelectronics / Design fast Computer engineering Microelectronics Design Mai, Y. W. 1946- aut http://www.sciencedirect.com/science/book/9781845695286 Verlag URL des Erstveröffentlichers Volltext |
| spellingShingle | Wong, E-H Mai, Y. W. 1946- Robust design of microelectronics assemblies against mechanical shock, temperature and moisture TECHNOLOGY & ENGINEERING / Mechanical bisacsh TECHNOLOGY & ENGINEERING / Electronics / Microelectronics bisacsh Computer engineering fast Microelectronics / Design fast Computer engineering Microelectronics Design |
| title | Robust design of microelectronics assemblies against mechanical shock, temperature and moisture |
| title_auth | Robust design of microelectronics assemblies against mechanical shock, temperature and moisture |
| title_exact_search | Robust design of microelectronics assemblies against mechanical shock, temperature and moisture |
| title_full | Robust design of microelectronics assemblies against mechanical shock, temperature and moisture E.-H. Wong and Y.-W. Mai |
| title_fullStr | Robust design of microelectronics assemblies against mechanical shock, temperature and moisture E.-H. Wong and Y.-W. Mai |
| title_full_unstemmed | Robust design of microelectronics assemblies against mechanical shock, temperature and moisture E.-H. Wong and Y.-W. Mai |
| title_short | Robust design of microelectronics assemblies against mechanical shock, temperature and moisture |
| title_sort | robust design of microelectronics assemblies against mechanical shock temperature and moisture |
| topic | TECHNOLOGY & ENGINEERING / Mechanical bisacsh TECHNOLOGY & ENGINEERING / Electronics / Microelectronics bisacsh Computer engineering fast Microelectronics / Design fast Computer engineering Microelectronics Design |
| topic_facet | TECHNOLOGY & ENGINEERING / Mechanical TECHNOLOGY & ENGINEERING / Electronics / Microelectronics Computer engineering Microelectronics / Design Microelectronics Design |
| url | http://www.sciencedirect.com/science/book/9781845695286 |
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